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WO/2006/070452A1 |
A method for manufacturing a semiconductor device, which comprises providing a tank (21) for storing a plating solution in addition to a plating treatment tank (20), and arranging magnets (33a to 33d) in the plating solution storage tank...
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WO/2006/064803A1 |
[PROBLEMS] To improve the corrosion resistance by converting a pipe making step and a coating forming step to a continuous step and forming a corrosion-resistant coating having no pin-holes. [MEANS FOR SOLVING PROBLEMS] On the way of the...
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WO/2006/064711A1 |
In a face down type jet plating device, it is possible to prevent lowering of the plating quality caused by a minute solid foreign matter attributed to a black film. In the face down type plating device, a partition wall (7) is provided ...
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WO/2006/065580A2 |
A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (107). The multi-layered wafer support apparatus includes a bottom film layer (201) and a top film layer (301). The bot...
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WO/2006/062015A1 |
The present invention provides a pneumatic tire comprises a carcass (4) and a belt (6). At least one of the carcass (4) and the belt (6) includes a layer comprising a coating rubber-covered steel cord. A rubber composition comprising 100...
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WO/2006/061659A1 |
Apparatus for surface treatment of battery cans, including cleaning and electroplating of the interior and exterior surfaces of battery cans as they are transported along a continuously moving production line. The battery cans are automa...
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WO/2006/061081A2 |
The invention relates to a method for electrochemical deposition of tantalum and/or copper on a substrate in an ionic liquid, containing at least one tetraalkylammonium-, tetraalkylphosphonium-, 1,1-dialkylpyrrolidinium-, 1-hydroxyalkyl-...
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WO/2006/062627A1 |
Methods and apparatuses for coating surfaces of medical devices by electroplating are disclosed. In one embodiment, the invention includes a coating method in which a mixture of a therapeutic agent, and a plating material are electroplat...
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WO/2006/060520A2 |
This invention relates to processes and apparati for selectively electroplating a metal layer or layers into recessed topographic features on a conductive surface. The processes and apparati of the invention are useful for fabricating me...
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WO/2006/057216A1 |
A process for producing a permanent magnet for use in automotive IPM motor that excels in all of corrosion resistance, abrasion resistance and impact resistance. On the surface of R-Fe-B permanent magnet, there are sequentially formed a ...
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WO/2006/046346A1 |
[PROBLEMS] To provide a battery capable of ensuring stably over a long term a good contact state that allows an efficient take-out of a high current from a low voltage high capacity battery without increasing the cost, forcing an extra b...
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WO/2006/043507A1 |
Disclosed is an engine part comprising a metal base and a chromium plating layer which covers at least a part of the metal base surface and is made of a trivalent chromium plating liquid. The amount of boron contained in the chromium pla...
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WO/2006/043696A1 |
A filter for purifying hydrogen which has a porous support and a Pd alloy film being bond onto one surface of the support, wherein the porous support has such pores that a thickness (T) of the porous support, a diameter (D1) of the openi...
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WO/2006/043578A1 |
Disclosed is a method for forming an Sn-Ag-Cu three-element alloy thin film wherein the three-element alloy thin film is formed by electroplating. This method is characterized in that the plating bath contains an Sn compound, an Ag compo...
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WO2005123988B1 |
Embodiments of a method of barrier layer surface treatment to enable direct copper plating without copper seed layer. In one embodiment, a method of plating copper on a substrate with a group VIII metal layer on top comprises pre-treatin...
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WO/2006/033315A1 |
[PROBLEMS] Plating method and apparatus by which a recess is not formed at the time of forming a field via. [MEANS FOR SOLVING PROBLEMS] A plating apparatus (10) is composed of insulating bodies (20A, 20B) composed of a porous resin (spo...
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WO/2006/030998A1 |
Disclosed are an electro polishing combined electric plating apparatus and an electroless plating apparatus using the same that that can form a plating film on a workpiece shaped in a pipe made of a material selected from the group consi...
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WO/2006/028207A1 |
An electrolytic copper foil with a carrier foil furnished with a primer resin layer, that even when the electrolytic copper foil with a carrier foil at its surface to be bonded with a substrate resin layer has low surface roughness, exhi...
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WO/2006/028189A1 |
In a conductive material, on the surface of a base material composed of a Cu plate strip, a Cu-Sn alloy covering layer, which contains a Cu of 20-70at% and has an average thickness of 0.1-3.0μm, and an Sn covering layer having an averag...
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WO/2006/028482A1 |
Platinum containing coatings for corrosion and oxidation protection of a substrate, and platinum electrodeposition methods for coating a substrate. The coating comprises platinum and at least one supplementary constituent, and the method...
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WO/2006/019163A1 |
An extra-long tool producing device comprising a plating solution tank (401), a plating bath (402), a staring cathode (403), a terminating cathode (404), a starting anode (405), an intermediate anode (406), a terminating anode (407), and...
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WO/2006/016570A1 |
[PROBLEM] To provide a method for producing a rare earth element based permanent magnet having a copper plating film on the surface thereof, which uses a novel plating solution for the electrolytic copper plating treatment and allows the...
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WO/2006/015568A1 |
The invention relates to a method for coating a plastic film that is used in the production of a combined metal and plastic capacitor. According to said method, a thin first metal layer is vapour deposited on the plastic film. The vapour...
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WO/2006/013735A1 |
A composite copper foil having three layers of a supporting metal layer, an exfoliating layer and a thin copper layer, wherein one surface of the exfoliating layer comprises, as a main component, an alloy of tungsten or an alloy of molyb...
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WO/2006/012112A2 |
An apparatus and method for plating a metal layer onto a substrate is provided. A catholyte volume is positioned to receive a substrate for plating. An anolyte volume having one or more anode segments positioned therein is ionically sepa...
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WO/2006/011922A2 |
Pulse reverse electrolysis of acid copper solutions is used for applying copper to printing cylinders, especially gravure printing cylinders. The plating composition generally comprising copper ions, counter ions, chloride ions, a polyal...
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WO/2006/008899A1 |
A coated copper being inhibited in the growth of a whisker, which comprises a copper substrate or a copper alloy substrate, a tin layer containing copper diffused therein formed on the surface of said substrate and a pure tin layer forme...
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WO/2006/006534A1 |
A terminal part relating to one embodiment of this invention is of a flexible printed wiring board or a flexible flat cable and is to be fitted in a connector. In the terminal part, copper or copper alloy wiring wherein a pure tin or tin...
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WO/2006/005549A2 |
The invention relates to a clamping device for a printing cylinder, comprising two holders (11), arranged on a common axis, the holders (11) each comprising a recess (12) for housing one end (15) of the printing cylinder, with the recess...
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WO/2006/004298A1 |
Disclosed is a method for preparing a surface-blackened copper foil for electromagnetic radiation shielding and a copper foil produced by the method, which has low light reflectance and no stain and hardly has residues, thereby having a ...
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WO/2006/002969A2 |
A device and a method for chemically or electrolytically treating work pieces (1) are proposed in an effort to avoid irregular contours of finest conductive structures, pads and lands as well as bridges (shorts) on the one side or breaks...
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WO/2006/001594A1 |
The present invention relates to a method for producing a surface-blackened copper foil for electromagnetic radiation shielding, specifically relates to a method for producing a surface- treated copper foil for electromagnetic radiation ...
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WO/2005/123989A1 |
A plating apparatus has a tubular electrode (16) placed in a hollow section (12) of work (11). The tubular electrode (16) has a through-hole (16a) formed in the longitudinal direction. A circular tube-like gap (S1) in which a plating liq...
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WO/2005/123990A1 |
The invention relates to a device and method for electrolytically treating flat work pieces (1), more specifically for electrolytically treating electrically conductive structures S that are electrically insulated against each other on t...
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WO/2005/122297A1 |
Disclosed is a composite foil having high tensile strength after a heat treatment at a high temperature which can be suitably used as a thin collector for nonaqueous electrolyte secondary batteries. Specifically, a metal foil with carrie...
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WO/2005/120139A1 |
A surface-treated electrolytic copper foil for a polyimide resin substrate, which is an electrolytic copper foil having a surface treating layer for improving the adhesiveness with the polyimide resin substrate on the glossy surface side...
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WO/2005/115486A1 |
The invention relates to a system for administering a respirable gas, particularly at a pressure level lying above the ambient pressure. The invention further relates to components of said system, especially an apparatus conveying breath...
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WO/2005/116303A1 |
A method for controlling the chemical composition of an electroplating bath solution used to plate a plurality of substrates by providing the electroplating bath solution to a small-volume plating cell configured to minimize additive bre...
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WO/2005/116300A1 |
In an external plating structure of a semiconductor package, a Pd or Pd alloy film is used as a material replacing the conventional solder plating as a soldering metal. The highly reliable semiconductor component external plating structu...
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WO/2005/107982A1 |
A tool holder 1 comprising a shaft 2 intended to be arranged in a tool holder in a manufacturing machine, a head 3 on which a cutter is intended to be arranged and a vibration-damping material 4 arranged between, and attached to, the sha...
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WO/2005/108647A1 |
A porous metal foil with carrier foil characterized by having a porous metal foil layer disposed by electroplating on a conductive carrier foil and further having interposed therebetween a junction interface layer of conductive polymer. ...
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WO/2005/105356A2 |
A system for electrochemical mechanical polishing of a conductive surface of a wafer is provided. The system includes a wafer holder to hold the wafer and a belt pad disposed proximate to the wafer to polish the conductive surface. Appli...
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WO/2005/106081A1 |
The invention relates to a method for selectively coating or etching surfaces during which the surface areas that are not to be treated are masked with a masking device (18) during the actual coating or etching process. The masking devic...
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WO/2005/106989A1 |
A plated steel plate for a battery container, which can provide a battery having excellent discharging characteristics without forming a conductive layer, which is mainly composed of graphite, in the battery container, and the battery co...
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WO/2005/104268A1 |
There are provided a plated steel plate for cell vessel capable of forming a cell having an excellent discharge characteristic without forming a graphite-based conductive layer on the inner surface of the cell vessel, a cell vessel using...
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WO/2005/103340A1 |
Disclosed is a composite foil which exhibits high tensile strength even after a high-temperature heat treatment and is suitably used as a current collector for nonaqueous electrolyte secondary batteries. Specifically disclosed are compos...
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WO/2005/104267A1 |
A plated steel sheet for battery container that even when no conductive layer composed mainly of graphite, etc. is disposed on an internal surface of battery container, can provide a battery of excellent discharge characteristics; a batt...
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WO/2005/100641A1 |
[PROBLEMS] To provide a method for imparting excellent resistance to hydrogen to various articles including a rare earth element based permanent magnet, with simplicity and ease, at a low cost. [MEANS FOR SOLVING PROBLEMS] A method for i...
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WO/2005/098095A1 |
A method which comprises a step of carrying out a molten salt electrolysis in an electrolytic bath, wherein at least one metal compound selected from the group consisting of actinoid compounds and rare earth compounds is molten, by the u...
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WO/2005/095677A1 |
A copper foil having a high adhesion strength even though the roughness RZ of the roughened surface of the copper foil is low and its manufacturing method are provided. The relation between the surface coefficient C(S) and the roughness ...
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