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WO/2020/144911A1 |
The present invention relates to a polishing device. Said polishing device comprises: a window member (50) for transmitting infrared rays; a polishing pad (1) in which the window member (50) is embedded; a polishing head (3), which rotat...
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WO/2020/143262A1 |
A chemical mechanical polishing operation platform and a chemical mechanical polishing apparatus comprising a polishing head support (1). The polishing head support (1) comprises multiple branch supports (111). The multiple branch suppor...
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WO/2020/145121A1 |
The present invention addresses the problem of providing: a method for regenerating a polishing agent, which can be employed for the polishing of a chemically strengthened glass, and whereby it becomes possible to remove a K2O-containing...
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WO/2020/137099A1 |
The information processing device of the present invention is for determining a polishing recipe on the basis of response data for each area acquired by changing pressure for each area of a polishing head, and is provided with: an abnorm...
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WO/2020/138198A1 |
Provided is a non-woven-fabric polishing pad characterized in having polishing performance that is exceptional in terms of polishing stability and smoothness of a polished object, and moreover characterized in that the change in the poli...
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WO/2020/137278A1 |
Provided is a polishing composition with which micro defects and haze in a polished semiconductor wafer can be further reduced. This polishing composition comprises abrasive grains, a basic compound, a vinyl alcohol-based resin having 1,...
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WO/2020/137186A1 |
This method for manufacturing a wafer having a notch part is provided with: a both side polishing step for polishing both main surfaces of a wafer; a notched mirror surface polishing step for performing mirror polishing on a notch-chamfe...
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WO/2020/137802A1 |
The present invention pertains to a pad temperature adjusting device for adjusting the surface temperature of a polishing pad. The pad temperature adjusting device (5) comprises: a pad contacting member (11); a supplying system (30) that...
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WO/2020/135498A1 |
Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing comprises: during final polishing to the remaining predetermined time, using both polishing slurry and an oxidizing solution as a ...
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WO/2020/139663A1 |
A method of generating a matrix to relate a plurality of controllable parameters of a chemical mechanical polishing system to a polishing rate profile includes polishing a test substrate. The test substrate is polished for a first period...
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WO/2020/139605A1 |
A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially ...
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WO/2020/137653A1 |
The present invention relates to a method for cleaning an optical film thickness measurement system that is used for measuring the film thickness of a substrate such as a wafer while the substrate is being polished. This method comprises...
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WO/2020/126460A1 |
The present invention relates to a device for supporting workpieces to be lapped (1) adapted to the lapping ring (5) of a lapping machine. The device comprises an outer casing (10), arranged on the lapping ring (5) and comprising at leas...
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WO/2020/119779A1 |
Disclosed are a semiconductor wafer photoelectrochemical mechanical polishing processing device and a processing method therefor. A wafer (4) is adhered and fixed to a polishing head (3) by means of a conductive adhesive, and the wafer (...
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WO/2020/123332A1 |
The invention provides a chemical-mechanical polishing composition comprising(a) an abrasive having a Vickers hardness of 16 GPa or more, and (b) a liquid carrier, wherein the polishing composition is substantially free of an oxidizing a...
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WO/2020/123203A1 |
A grinding wheel and methods of manufacturing the same. The grinding wheel includes a core region extending around a central axis and a grinding region circumferentially surrounding the core region. The grinding wheel also includes at le...
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WO/2020/122191A1 |
Provided are: a polishing composition which can be used more suitably in a use application in which a synthetic resin or the like is polished; and a polishing method for polishing an object of interest with a polishing composition. A pol...
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WO/2020/115968A1 |
A polyurethane for polishing layers, which has a terminal group represented by formula (I) R-(OX)n-; a polishing layer which uses this polyurethane for polishing layers; and a polishing pad. (In formula (I), R represents a monovalent hyd...
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WO/2020/117441A1 |
A chemical mechanical polishing composition for polishing a substrate having copper, barrier, and dielectric layers includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole...
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WO/2020/117438A1 |
A chemical mechanical polishing composition for polishing a substrate having a cobalt layer includes a water based liquid carrier, cationic silica abrasive particles dispersed in the liquid carrier, and a triazole compound, wherein the p...
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WO/2020/117440A1 |
The invention provides a chemical mechanical polishing composition for polishing a silicon nitride containing substrate. The composition includes an aqueous carrier; cationic silica particles dispersed in the aqueous carrier, the cationi...
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WO/2020/117439A1 |
A chemical mechanical polishing composition for polishing a substrate includes a liquid carrier and cationic metal oxide abrasive particles dispersed in the liquid carrier. The cationic metal oxide abrasive particles have a surface modif...
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WO/2020/109947A1 |
A polishing pad includes a polishing layer having a first major surface and a second major surface opposite the first major surface. The polishing pad further includes a subpad, which is coupled to the polishing layer, and has a first ma...
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WO/2020/110258A1 |
Provided is a polishing pad the size of which can be set freely and which is easily attachable to a polishing device. A polishing pad (1) comprises a plurality of pad pieces (3a–3f), a plurality of joining sections, and a plurality of ...
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WO/2020/106904A1 |
A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional ro...
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WO/2020/100985A1 |
In one embodiment, there is provided a polishing liquid composition capable of reducing scratching of a substrate surface after polishing while ensuring polishing speed. The present disclosure, in one embodiment, pertains to a polishin...
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WO/2020/100563A1 |
Provided is a silicon wafer pre-polishing composition that has an exceptional ability to eliminate bulging of an HLM margin and is capable of preventing or suppressing polishing vibration. The polishing composition provided by the presen...
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WO/2020/096010A1 |
The present invention relates to a curable composition comprising: (A) a rotaxane monomer which has a composite molecular structure comprising cyclic molecules and an axial molecule extending through the rings of the cyclic molecules, th...
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WO/2020/095883A1 |
Provided are: a semiconductor wafer polishing auxiliary sheet that can be prevented from being polished away along with a semiconductor wafer and that is capable of preventing a semiconductor wafer from being contaminated or damaged due ...
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WO/2020/095832A1 |
The present invention uses a polyurethane for polishing layers, which has a carboxylic acid ester group, and preferably uses a polyurethane which has a carboxylic acid ester group in at least one of a side chain, an end of the main chain...
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WO/2020/089129A1 |
The invention pertains to compositions comprising at least one polymer or precursors thereof, at least one liquid medium and a plurality of microcapsules having a cross-linked polymeric shell and a core containing at least one (per)fuoro...
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WO/2020/091000A1 |
[Problem] To provide a polish composition having a high polishing rate and capable of suppressing the occurrence of defects, when used for CMP polishing for a device wafer. [Solution] This polishing composition includes silica particles,...
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WO/2020/082259A1 |
An apparatus and method for chemical mechanical polishing (CMP), the apparatus includes a platen (301), a slurry supply (306), and at least one scraping fixture (320). The platen is configured to rotate a pad (302) thereon about a centra...
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WO/2020/077849A1 |
The present application relates to the technical field of crystalline material processing. Disclosed are a high-flatness, low-damage and large-diameter monocrystalline silicon carbide substrate, and a manufacturing method therefor. The s...
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WO/2020/081906A1 |
An abrasive tool comprises an arbor having a body formed with an internal bore, a mounting plate disposed on the arbor, a cover plate, an abrasive article disposed between the mounting plate and the cover plate, and at least one internal...
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WO/2020/078729A1 |
Described herein is a method for facilitating chemical mechanical polishing. The method comprises determining contact mechanics information indicative of contact pressures and friction forces between a wafer and a pad during the chemical...
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WO/2020/074634A1 |
The present invention provides an apparatus for working oppositely arranged first and second surfaces of a pressing section. The apparatus comprises an upper working unit forming a top wall and an upper sidewall extending downwardly from...
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WO/2020/075654A1 |
The present invention addresses the problem of providing a silica-based particle dispersion which contains a silica-based particle group and with which a high polishing rate and high surface precision can be achieved with respect to a si...
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WO/2020/066786A1 |
In an embodiment, provided is a polishing liquid composition capable of improving the abrasion rate of a silicon oxide film. In an embodiment, the present disclosure pertains to a polishing liquid composition that is for a silicon oxide ...
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WO/2020/068629A1 |
A method of forming a carrier wafer includes the steps of: lapping a first surface and a second surface of the carrier wafer such that the carrier wafer is substantially flat, the carrier wafer comprising a glass, glass-ceramic or cerami...
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WO/2020/067401A1 |
The purpose of the present invention is to provide: a polishing pad which is capable of reducing the occurrence of scratches; and a method for producing a polished article. A polishing pad which is provided with a polyurethane sheet as a...
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WO/2020/066671A1 |
Provided are: a polishing pad useful for removing undulations in a curved resin-coated surface at a high polishing rate; and a polishing method using the polishing pad. A polishing pad (10) according to an aspect of the present invention...
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WO/2020/066873A1 |
Provided is a method that is for polishing a silicon wafer by a polishing device using a carrier holding the silicon wafer, and that can reduce wear on the carrier. In this polishing method, a polishing liquid used in the polishing devic...
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WO/2020/065723A1 |
A slurry for polishing a carbon-containing silicon oxide, the slurry containing abrasive grains and a liquid medium, wherein the abrasive grains contain a first particle and a second particle in contact with the first particle, the secon...
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WO/2020/064282A1 |
The invention relates to a method for polishing a semiconductor wafer in that at least one side of the semiconductor wafer is pressed against a polishing pad secured to a rotating polishing disc in the presence of a polishing agent. The ...
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WO/2020/068345A1 |
During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least...
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WO/2020/066998A1 |
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The ave...
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WO/2020/067057A1 |
The present invention provides: a polishing composition which enables the achievement of high polishing rate and high surface quality with respect to polishing of a gallium oxide substrate; and a polishing method and a production method ...
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WO/2020/057330A1 |
A polishing and loading/unloading component module, comprising a loading/unloading module and two polishing modules; the loading/unloading module is at the middle, and the two polishing modules are located at two sides thereof, the loadi...
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WO/2020/056818A1 |
Disclosed is a polishing loading and unloading component module containing a movable loading and unloading module. The polishing loading and unloading component module comprises one loading and unloading module and two polishing modules,...
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