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WO/2021/048977A1 |
A sealing material for compression molding comprising an epoxy resin, a curing agent, and an inorganic filler, wherein at least 85% of the entire surface area of an image thereof obtained in observation by an ultrasonic flaw detection de...
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WO/2021/048282A1 |
A curable epoxy resin adhesive, the adhesive comprising an epoxy resin component and a curing agent component. The curing agent component comprises first and second amine curing agents. Each of the first and second amine curing agents ha...
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WO/2021/049370A1 |
The glass filler of the present invention comprises a glass base material and a coating film containing a surface treating agent, said coating film coating at least a part of the surface of the glass base material. The glass base materia...
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WO/2017/170880A9 |
Provided are a curable composition that provides a cured product with a high glass transition temperature and excellent adhesion, a cured product production method, and a cured product therefrom. The curable composition includes: 30–...
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WO/2021/046137A1 |
Thick thermoset prepreg sheets and slit tapes and methods and apparatus for the production thereof.
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WO/2021/044946A1 |
Provided is a resin composition containing an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin contains a phosphorus-containing epoxy resin. The curing agent contains dicyandiamide. The inorganic filler contains sili...
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WO/2021/045209A1 |
The present invention provides a fluorine-containing copolymer represented by formula (1) or (2).
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WO/2021/043728A1 |
The present invention relates to a two-component epoxy resin composition, consisting of: - a resin component comprising: - at least one epoxy resin that contains on average more than one epoxy group per molecule; - up to 25 wt.-% of at l...
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WO/2021/042285A1 |
A self-emulsifying epoxy composition is prepared by the components comprising an epoxide adduct a) and an epoxide compound b), the solid content of the self-emulsifying composition has a smaller particle size. The self-emulsifying epoxy ...
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WO/2021/042384A1 |
Provided is a preparation method for a carbon nanotube fiber composite material, comprising the following steps: mixing a carbon nanotube fiber fabric with a thermosetting resin solution to prepare a carbon nanotube fiber fabric impregna...
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WO/2021/044879A1 |
Provided are: a liquid curable composition which contains quantum dots (A) and a curable substrate component (B) and which exhibits excellent dispersion stability of the quantum dots (A); a film comprising a cured product of the curable ...
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WO/2021/044915A1 |
A thermally conductive composition including metal-containing particles and a thermosetting component that includes at least one selected from the group consisting of polymers, oligomers, and monomers, the thermally conductive compositio...
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WO/2021/039380A1 |
Provided are: a resin composition that contains copper particles and a specific resin, and is capable of producing a cured product having a low volume resistance value; and a cured product obtained by curing the resin composition. Said r...
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WO/2021/039200A1 |
The purpose of the present invention is to provide a thermally conductive resin with excellent thermal conductivity. This thermally conductive resin is characterized by comprising a resin and alumina fibers which are contained in the res...
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WO/2021/039809A1 |
Provided is a semiconductor encapsulation resin composition containing (A) at least one thermosetting resin selected from the group consisting of an epoxy resin and a bismaleimide resin, (B) a curing agent, (C) an inorganic filler, and (...
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WO/2021/035383A1 |
A method to prepare a thermal conductive filler, particularly a thermal conductive filler for preparation of a thermal conductive material with reduced viscosity, comprising the step of dry mixing a platelet boron nitride with a fumed si...
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WO/2021/039480A1 |
The present invention provides a cationic curing agent which comprises porous particles and a compound represented by general formula (1), said compound being held by the porous particles. In general formula (1), R1 represents an optiona...
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WO/2021/038772A1 |
A thermally curable resin composition for light reflection according to the present invention comprises an epoxy resin, a hardener, an inorganic filler, and a white pigment, wherein the hardener comprises a tetracarboxylic dianhydride ha...
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WO/2021/036533A1 |
An epoxy resin composite form-stable phase change material, a preparation method therefor, and an application. The epoxy resin composite form-stable phase change material is prepared from a cured epoxy resin, a phase change material, a s...
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WO/2021/037349A1 |
The invention relates to multi-component crosslinkable materials of silane-crosslinking prepolymers, characterized in that component (K1) contains 20 to 250 parts by weight of compounds (A) of formula (I) and 1 to 50 parts by weight of a...
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WO/2021/036612A1 |
A glass fiber-reinforced polycarbonate composite material, comprising the following components in parts by weight: component A: 70 parts - 90 parts of a polycarbonate; component B: 3 parts - 55 parts of a glass fiber; component C: 0.01 p...
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WO/2021/036972A1 |
A method to prepare a thermal conductive filler, particularly a thermal conductive filler for preparation of a thermal conductive material with reduced viscosity, comprising the step of dry mixing a platelet boron nitride with a fumed si...
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WO/2021/038771A1 |
A thermosetting resin composition for optical reflection according to the present disclosure includes an epoxy resin, a curing agent, an inorganic filler, and a white pigment. The inorganic filler contains inorganic hollow particles havi...
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WO/2021/040758A1 |
Coated particles include a particulate substrate, a surface copolymer layer surrounding the particulate substrate, and a resin layer surrounding the surface copolymer layer. The surface copolymer layer includes a copolymer of at least tw...
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WO/2021/039732A1 |
The present invention addresses the problem of providing a composition for forming a heat-conducting material, the composition being capable of providing a heat-conducting material having excellent heat-conducting properties. The present...
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WO/2021/039202A1 |
The present invention aims to provide a thermally conductive resin having excellent thermal conductivity. This thermally conductive resin: comprises resin, alumina fibers included in the resin, and inorganic oxide particles covering the ...
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WO/2021/037273A1 |
Disclosed in the present invention are a covalent organic frame flame retardant having a Schiff base-containing vanillin group, and a preparation method therefor. In the present invention, the covalent organic frame flame retardant is pr...
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WO/2021/035816A1 |
Disclosed is a two-component thermal storage potting material, comprising the following components in parts by weight: component A: 20-70 parts of a resin and 20-70 parts of a phase change material; and component B: 20-70 parts of a resi...
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WO/2021/037446A1 |
The invention relates to a hybrid material with fibre reinforcement for producing a moulded body, such as is used, for example, as insulation and/or a reinforcing support/spacer/filling element in electric machines. For the first time, t...
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WO/2021/039201A1 |
The objective of the present invention is to provide a thermally conductive resin which has excellent thermal conduction. This thermally conductive resin comprises a resin and inorganic fibers contained in the resin and is characterized ...
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WO/2021/040865A1 |
Disclosed are systems for treating a substrate comprising a deoxidizing composition and a coating composition. The deoxidizing composition comprises a Group IVA metal and/or a Group IVB metal and free fluoride, optionally may comprise a ...
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WO/2021/039630A1 |
The insulating resin composition comprises an epoxy resin, an amine-based curing agent, and an inorganic filler, the amine-based curing agent containing a first amine compound represented by formula (A-1) and a second amine compound repr...
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WO/2021/040864A1 |
The present invention is directed to compositions comprising a first component, a second component, and elastomeric particles. The first component comprises an epoxy-containing compound. The second component comprises a diamine comprisin...
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WO/2021/039111A1 |
[Problem] The present invention addresses the problem of providing an epoxy resin composition capable of achieving both thermal resistance and lowered elasticity or both thermal resistance and toughening, depending on the purpose, and is...
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WO/2021/038766A1 |
A thermosetting resin composition for light reflection according to the present disclosure comprises an epoxy resin, a curing agent, an inorganic filler, a white pigment, and a mold-releasing agent, wherein the mold-releasing agent inclu...
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WO/2021/039123A1 |
Provided are: a resin composition for polarizer protection that has excellent adhesion to a polarizer and can prevent defects such as decoloration from an edge or whitening of a protective layer; and a polarizing plate comprising a prote...
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WO/2021/032865A1 |
An adherable element is disclosed, comprising a decorative element having a support surface, and a pressure activated adhesive system pre-coated on the support surface of the decorative element for adhering the decorative element to a su...
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WO/2021/033327A1 |
The present invention pertains to: an epoxy resin composition which is cured in a short time even under a low-temperature condition and from which a cured product is formed, which has a low glass transition point (Tg) and an almost const...
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WO/2021/033584A1 |
An epoxy resin composition which contains: an epoxy resin (1) having a structure represented by formula (1); and an epoxy resin (2) having a structure represented by formula (2) and/or an epoxy resin (3) having a structure represented by...
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WO/2021/032612A1 |
A resin or curing agent composition for making a coating composition, a kit for making a coating composition, and a dry coating composition, particularly for application to flooring materials, and methods for making said compositions.
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WO/2021/029108A1 |
In the present invention, higher pressure resistance is achieved in a resin composition used for electrical insulation and in an electrical device obtained using the resin composition. A resin composition 10 contains a base polymer 11 an...
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WO/2021/029170A1 |
Provided are: an epoxy resin composition containing an epoxy resin, an epoxy resin curing agent including an amine-based curing agent, and an acidic compound, wherein in the epoxy resin composition, the ratio (basic nitrogen/acid group) ...
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WO/2021/026987A1 |
The present invention provides a resin composition. The resin composition comprises the following components in parts by mass: 65-80 parts of a reactive functional group-terminated modified polyphenylene ether copolymer; 20-35 parts of g...
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WO/2021/024956A1 |
Provided is a polymerizable composition which comprises a cycloolefin-based monomer having a specific structure, a silane coupling agent having at least one hydrocarbon group having a norbornene structure, and a metathesis polymerization...
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WO/2021/024817A1 |
A multiple package-type curable composition comprises: an agent A that contains a polyoxyalkylene polymer (A) having a reactive silicon group represented by general formula (1), a (meth)acrylic acid ester polymer (B) having a reactive si...
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WO/2021/024576A1 |
Disclosed is a method for producing a prepreg, the prepreg comprising: a reinforcing fiber layer, which contains reinforcing fibers and a resin composition which contains a component (A), a component (B) and a component (C) and is impreg...
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WO/2021/025117A1 |
To provide a fluorine-containing polymer for a metal-clad laminated sheet that is highly compatible with an epoxy resin. A fluorine-containing polymer for a metal-clad laminated sheet, said fluorine-containing polymer comprising a polyme...
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WO/2021/023226A1 |
Provided is a method for preparing a graphene oxide functionalized with a nitrogen-rich group; a simple and convenient method is used to synthesize a compound containing phosphorus and nitrogen; by means of an esterification reaction bet...
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WO/2021/023230A1 |
Disclosed are a method for synthesizing a phosphorus-containing silicon-containing organic or inorganic internal-hybridized activated monomer, and a use thereof. The method comprises: by using a Kabachnik-Fields reaction, preparing a pho...
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WO/2021/025146A1 |
A sealing resin composition that is to be used for collectively sealing a circuit board (10) and at least a part of a connector part (20). The connector part (20) is provided with a terminal (21) for electrically connecting the circuit b...
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