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WO/2021/032612A1 |
A resin or curing agent composition for making a coating composition, a kit for making a coating composition, and a dry coating composition, particularly for application to flooring materials, and methods for making said compositions.
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WO/2021/029108A1 |
In the present invention, higher pressure resistance is achieved in a resin composition used for electrical insulation and in an electrical device obtained using the resin composition. A resin composition 10 contains a base polymer 11 an...
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WO/2021/029170A1 |
Provided are: an epoxy resin composition containing an epoxy resin, an epoxy resin curing agent including an amine-based curing agent, and an acidic compound, wherein in the epoxy resin composition, the ratio (basic nitrogen/acid group) ...
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WO/2021/026987A1 |
The present invention provides a resin composition. The resin composition comprises the following components in parts by mass: 65-80 parts of a reactive functional group-terminated modified polyphenylene ether copolymer; 20-35 parts of g...
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WO/2021/024956A1 |
Provided is a polymerizable composition which comprises a cycloolefin-based monomer having a specific structure, a silane coupling agent having at least one hydrocarbon group having a norbornene structure, and a metathesis polymerization...
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WO/2021/024817A1 |
A multiple package-type curable composition comprises: an agent A that contains a polyoxyalkylene polymer (A) having a reactive silicon group represented by general formula (1), a (meth)acrylic acid ester polymer (B) having a reactive si...
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WO/2021/024576A1 |
Disclosed is a method for producing a prepreg, the prepreg comprising: a reinforcing fiber layer, which contains reinforcing fibers and a resin composition which contains a component (A), a component (B) and a component (C) and is impreg...
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WO/2021/025117A1 |
To provide a fluorine-containing polymer for a metal-clad laminated sheet that is highly compatible with an epoxy resin. A fluorine-containing polymer for a metal-clad laminated sheet, said fluorine-containing polymer comprising a polyme...
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WO/2021/023226A1 |
Provided is a method for preparing a graphene oxide functionalized with a nitrogen-rich group; a simple and convenient method is used to synthesize a compound containing phosphorus and nitrogen; by means of an esterification reaction bet...
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WO/2021/023230A1 |
Disclosed are a method for synthesizing a phosphorus-containing silicon-containing organic or inorganic internal-hybridized activated monomer, and a use thereof. The method comprises: by using a Kabachnik-Fields reaction, preparing a pho...
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WO/2021/025146A1 |
A sealing resin composition that is to be used for collectively sealing a circuit board (10) and at least a part of a connector part (20). The connector part (20) is provided with a terminal (21) for electrically connecting the circuit b...
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WO/2021/019784A1 |
A rare earth bonded magnet compound according to the present invention comprises: a resin composition containing an epoxy resin, a phenolic resin, a cure accelerator, and a silicon compound; and coated particles obtained by at least part...
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WO/2021/020095A1 |
[Problem] To enable a flame-retardant poly(butylene terephthalate) resin composition containing a halogenated epoxy-compound flame retardant as a flame retardant to give molded articles which are inhibited from containing foreign matter ...
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WO/2021/020094A1 |
[Problem] To enable a flame-retardant poly(butylene terephthalate) resin composition containing a halogenated epoxy-compound flame retardant as a flame retardant to give molded articles inhibited from containing foreign matter, and to im...
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WO/2021/020081A1 |
The present invention provides a composition, for forming a heat-conducting material, which can provide a heat-conducting material with excellent heat-conducting characteristics. Provided are a heat-conducting material, a heat-conducting...
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WO/2021/020563A1 |
Provided is a resin material whereby 1) the dielectric dissipation factor of a cured article thereof can be lowered, 2) the thermal dimensional stability of the cured article can be increased, 3) resin smear can be effectively removed by...
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WO/2021/018158A1 |
Provided are a re-moldable bismaleimide resin and an application thereof. The specific preparation method comprises blending 2-allylphenyl glycidyl ether and terephthalic acid in acetonitrile, carrying out an esterification reaction unde...
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WO/2021/013115A1 |
The present invention relates to a polyester resin composition and a molded product thereof. The polyester resin composition is obtained by compounding at least: (A) 100 parts by mass of a polybutylene terephthalate resin, (B) 15-100 par...
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WO/2021/015446A1 |
The present invention relates to an epoxy resin composition and a semiconductor device encapsulated using same.
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WO/2021/016101A1 |
Provided herein is a solid hardener composition comprising the reaction product of (a) a novolac resin component, (b) a liquid epoxy resin, and (c) an epoxidized polyalkylene glycol. Also provided herein is a method of preparing a harden...
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WO/2021/013770A1 |
A prepreg or semipreg precursor comprising a fibre reinforcement and a resin composition fused thereto, the resin composition containing at least one epoxy resin and a latent curing agent, wherein the epoxy resin and the latent curing ag...
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WO/2021/010334A1 |
The present invention provides a composition for dip molding, said composition containing at least: an elastomer which contains, in the polymer main chain, a structural unit derived from (meth)acrylonitrile, a structural unit derived fro...
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WO/2021/010431A1 |
One aspect of the present invention is a resin composition which contains: a polybutadiene compound having an epoxy group in each molecule; a polyphenylene ether compound having at least one of a group represented by formula (1) and a gr...
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WO/2021/009842A1 |
An insulating varnish composition containing two or more epoxy resins and a filler having an average primary particle diameter of 500 nm or less, wherein the two or more epoxy resins include, in relation to the total mass of the two or m...
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WO/2021/010654A1 |
The present invention relates to an anhydrous alcohol-alkylene glycol composition, an anhydrous alcohol-based urethane-modified polyol composition, and uses of same for an epoxy resin composition.
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WO/2021/010343A1 |
The first problem addressed by the present invention is to produce a glove having excellent tensile strength, elongation and fatigue endurance with use of a halohydrin crosslinking agent, which has not been used in the field of conventio...
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WO/2021/010291A1 |
The present invention provides a composition which is for forming a thermally conductive material and which can provide a thermally conductive material having excellent adhesion. In addition, provided are a thermally conductive material ...
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WO/2021/005914A1 |
Provided is a cured object highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. When examined by a pulse nuclear magnetic resonance method at a fr...
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WO/2021/005913A1 |
Provided is a curable composition highly effective in preventing flexible wiring boards from warping and in inhibiting the flexible wiring boards from suffering wiring breakage. The curable composition is for use in producing a flexible ...
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WO/2021/004976A1 |
The invention relates to an adhesive film that can be wound and punched, comprising an epoxy-based adhesive compound that can be activated by UV radiation or thermally and an expandable filler admixed to the adhesive compound to produce ...
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WO/2021/004624A1 |
The present invention is directed to a two component (2K) composition comprising: (A) a first component comprising: a) at least one epoxy resin different from said resin b); and, b) at least one elastomer modified epoxy resin; (B) a seco...
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WO/2021/005912A1 |
Provided is a polyurethane capable of imparting, to a curable composition, the property of resisting warping in an overcoating film and a flexible printed board, and the property of suppressing shorting of wires in a flexible printed cir...
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WO/2021/006114A1 |
The present invention provides a prepreg characterized by comprising the following constituent elements [A] to [E] and giving a cured object composed of a reinforcing-fiber layer lying from 8% to 92% in terms of thickness-direction depth...
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WO/2021/000551A1 |
The present embodiment relates to the technical field of polymer materials, and specifically relates to a graft-modified aluminum oxide and a preparation method therefor, an epoxy composite material and an application thereof. The prepar...
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WO/2021/001197A1 |
A description is given of a composite material with a matrix on the basis of an organic plastic containing solid fillers. This composite material is distinguished by the fact that the filler is a dried fermentation residue from the ferme...
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WO/2020/262314A1 |
[Problem] To provide a polyamide resin composition which is for a foam molded body and which has high performance in appearance, high load carrying capacity, and high impact resistant characteristics. [Solution] This polyamide resin comp...
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WO/2020/262350A1 |
Provided are: a resin composition containing (A) a polyester polyurethane resin, (B) an epoxy resin, and (C) a polyolefin resin; and a laminate with a resin composition layer, a laminate, or an electromagnetic shielding film using the re...
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WO/2020/262061A1 |
Provided is an epoxy resin composition: that produces a cured product having excellent adhesion with a metal while having low dielectric properties; that has good workability when used; and that and good shelf life. More specifically, pr...
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WO/2020/262205A1 |
This resin composition contains a polymer (A) and a crosslinking agent (B) including a compound represented by formula (1). Here, the polymer (A) contains a cyclic olefin polymer (A-1) having a protic polar group and satisfies a requirem...
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WO/2020/261087A1 |
The present invention relates to a process for preparing a bonding resin, lignin in solid form or in the form of a dispersion in water is mixed with a crosslinker; and optionally one or more additives followed by addition of a basic solu...
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WO/2020/259963A1 |
The invention relates to an impregnating formulation for a wrapping tape insulation of an electrical machine, comprising a resin formulation having at least one epoxy base resin and a hardener formulation having at least one hardener, wh...
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WO/2020/252681A1 |
A high pressure resin transfer molding composition and a composite is provided. The high pressure resin transfer molding composition has a viscosity <30mP·s (100℃), Tg>95℃, and 1mm UL94 V0 flame resistance.
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WO/2020/256005A1 |
Provided is a thermosetting resin composition containing an epoxy resin and thermally conductive particles. A cured product obtained by heating said thermosetting resin composition at 200°C for 90 minutes has a thermal conductivity λ20...
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WO/2020/256902A1 |
The present invention is a toughened one component epoxy adhesive composition demonstrating improved resistance to humidity. Wherein said one-part structural adhesive comprises: A) a blocked PU-polymer toughener compound; B) an epoxy res...
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WO/2020/255749A1 |
The present disclosure provides a composition for sealing capable of manufacturing a cured product less likely to warp during molding. The composition for sealing contains an epoxy resin (A) including an epoxy resin (a) having a fused-ri...
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WO/2020/250675A1 |
The present invention provides a resin-type conductive paste composition which uses a silver-based powder as a conductive powder, and which enables a cured product thereof to have a favorably decreased volume resistivity. A conductive pa...
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WO/2020/248501A1 |
The present invention provides an active ester compound, a resin composition, and a prepreg, an insulating film, a metal foil coated laminate and a printed circuit board having same. The active ester compound is an active ester compound ...
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WO/2020/249751A1 |
The present invention relates to an epoxy composition including – a waterborne hardener component containing an amine functional adduct, which is a reaction product of at least one polyether amine, at least one polyalkylene amine, at l...
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WO/2020/249741A1 |
The present invention relates to a two-component epoxy resin composition, consisting of - a first component K1 comprising at least one epoxy resin A that contains on average more than one epoxy group per molecule; and - a second componen...
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WO/2020/244084A1 |
The present invention relates to the technical field of composite insulating materials. Disclosed is a heat-resistant flexible polymer composite insulating material formula containing polyurethane, comprising the following components: 14...
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