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WO/2023/095648A1 |
The present invention provides a titanium material for fuel cell separators, the titanium material being used for a fuel cell separator and being capable of decreasing the contact resistance between separators, while being also capable o...
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WO/2023/095102A1 |
Object of the present invention is a transparent composite material having antimicrobial properties in particular antibacterial, antiviral, anti-fungal and anti-protozoal activities, a method for its preparation and use in articles, surf...
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WO/2023/093011A1 |
The present invention discloses a copper alloy thin film, and a protective layer based on the service of the copper alloy thin film and a preparation method therefor. The copper alloy thin film is a binary alloy and comprises Cu and an a...
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WO/2023/095181A1 |
Roll (10) for industrial processes and related apparatus and method for producing it. The roll (10) is provided with a central body (11) on which is disposed, by means of at least one of a PVD, CVD and PECVD technique, a thick-film surfa...
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WO/2023/093089A1 |
Embodiments of the present application provide a mask. The mask is used for depositing a substrate to be deposited; the mask comprises a panel region; the panel region comprises a deposition portion and a non-deposition portion; at least...
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WO/2023/097079A1 |
There is provided markers, systems, and methods for creating and utilizing a marker containing identification information. The embodiments include an identifying marker comprised of high temperature material for tracking a component in a...
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WO/2023/095769A1 |
The purpose of the present disclosure is to provide a reflective photomask blank and a reflective photomask that maximize the effectiveness of a phase shift effect and that possess high transferability (especially resolution). A reflecti...
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WO/2023/096022A1 |
The present invention provides a vanadium oxide thin film as a thermochromic material that does not contain impurities and has high transmittance, wherein the vanadium oxide thin film is formed by using a rapid thermal process (RTP) tech...
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WO/2023/096187A1 |
A method for manufacturing a fine metal mask by using dry etching according to the present invention comprises: a metal film attachment step of attaching a metal film to the top of a glass substrate; a photoresist laminating step of lami...
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WO/2023/095872A1 |
This sputtering device is provided with a cathode unit for emitting sputter particles toward a surface to be treated of a substrate on which a film is to be formed. The cathode unit has a target, a magnet unit, a magnet scanning unit, an...
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WO/2023/087577A1 |
The present invention relates to a nano-cutter coating and a preparation method therefor. The nano-cutter coating of the present invention comprises a cutter base body, and a transition layer, a support layer, an interface layer, and a f...
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WO/2023/089388A1 |
This invention deal with a flaky effect pigment comprising as optical active layer a single platelet consisting of a semiconductor material with a band gap in a range of 0.1 to 2.5 eV and having an average atomic composition of: a) Si(1-...
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WO/2023/091595A1 |
Medium to high entropy alloys and methods for producing the same are disclosed herein. In accordance with a first aspect, provided is a method for producing a medium to high entropy alloy. The method may comprise mixing a feed compositio...
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WO/2023/090275A1 |
The present invention provides a solid lubricant material which has high durability. This solid lubricant material has a material that has a hexagonal crystal structure. The ratio of planes other than the (002) plane to the (002) plane a...
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WO/2023/090249A1 |
In this sputtering target material comprising a sintered body of an oxide containing potassium, sodium, niobium, and oxygen, when the volume resistivity at 25ºC is less than 6.0×1011 Ω·cm, the Vickers hardness is 460 or greater and t...
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WO/2023/091196A1 |
Embodiments of substrate supports for use in substrate processing chambers are provided herein. In some embodiments, a substrate support includes: an upper assembly having a base plate assembly coupled to a lower surface of a cooling pla...
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WO/2023/090835A1 |
A plasma sputtering apparatus is disclosed. The plasma sputtering apparatus comprises: a target having a cylindrical shape and provided to be rotatable; a bar magnet arranged to correspond to the base of an imaginary isosceles triangle i...
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WO/2023/087310A1 |
Provided in the present application are a method for forming a hole transport layer on the surface of a substrate, and a hole transport layer, a solar cell and a preparation method therefor, and a photovoltaic module. The method for form...
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WO/2023/089813A1 |
The following are layered in an alternating manner in this superlattice structure: a first crystal layer (101) in which Ca2Fe2O with a brownmillerite structure serves as a unit lattice; and a second crystal layer (102) in which CaCuO2 wi...
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WO/2023/090957A1 |
The main objective of the present invention is to provide an electron-beam-assisted sputtering device and a method therefor, the device adding, as an electron supply means, an electron beam supply module to a conventional plasma sputteri...
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WO/2023/087205A1 |
Embodiments of the present application relate to the technical field of semiconductors, and provide vapor deposition equipment and a method for depositing a thin film, which can solve the problem that, when depositing a thin film by mean...
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WO/2023/091330A1 |
A composite includes a substrate and a target material, wherein the target material includes indium oxide (In2O3), tin oxide (SnO2), and gallium oxide (Ga2O3), and a method for making the same. The method includes positioning the substra...
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WO/2023/088130A1 |
Provided in the present invention is a semiconductor cavity. The semiconductor cavity comprises a cavity body, and a first shielding member and a liftable base assembly, which are arranged in the cavity body, wherein the first shielding ...
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WO/2023/090777A1 |
The present invention relates to a method for manufacturing a pellicle for extreme ultraviolet lithography. More specifically, the present invention relates to a method for manufacturing a pellicle for extreme ultraviolet lithography, th...
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WO/2023/090620A1 |
The present invention provides a cutting tool having a hard coating capable of satisfying various physical properties such as wear resistance, toughness, oxidation resistance, and heat crack resistance in a well-balanced manner. In order...
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WO/2023/087307A1 |
Provided are a preparation method for a perovskite thin film, and a perovskite thin film, a solar cell and a solar cell device related thereto. The preparation method comprises the following steps: (1) providing a target material contain...
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WO/2023/082855A1 |
A vapor deposition device capable of rotating and lifting in a reciprocating manner comprises a vapor deposition cavity, a base table, a base shaft, a telescopic assembly, a passive lifting and rotating component, a rotating mechanism an...
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WO/2023/082790A1 |
The present application relates to an anti-contamination device, an ionization cavity, and a radio frequency ion source. The anti-contamination device is applied to an ionization cavity of a radio frequency ion source, and comprises a su...
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WO/2023/082540A1 |
A light-emitting device, an aluminum nitride product, an aluminum nitride single crystal, and a manufacturing method therefor and the use thereof, which belong to the field of semiconductor materials. The manufacturing method for the alu...
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WO/2023/084932A1 |
The present invention provides a mask chuck device which is capable of holding a mask member and a substrate in close contact without a gap therebetween, without limitations on the constituent materials of the substrate, and a vapor depo...
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WO/2023/085527A1 |
The present invention relates to a method for manufacturing a separator. The method for manufacturing a separator according to the present invention, which is a method for manufacturing a separator used for a polymer electrolyte membrane...
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WO/2023/079857A1 |
Provided is a Fe-Pt-C-based sputtering target member which is prevented from the formation of particles during sputtering. The Fe-Pt-C-based sputtering target member has a magnetic phase containing Fe and Pt and a non-magnetic phase, the...
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WO/2023/077737A1 |
The present application discloses a carrier plate cleaning method and a use thereof, relating to the technical field of carrier plate cleaning. The carrier plate cleaning method comprises: S100, performing pre-coating treatment on a carr...
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WO/2023/080937A1 |
Methods and apparatus for generating a magnetic field external to a physical vapor deposition (PVD) chamber to improve etch or deposition uniformity on a substrate disposed inside of the PVD chamber are provided herein. In some embodimen...
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WO/2023/079771A1 |
This invention is provided with: a film formation chamber (11) for forming a film on a substrate (S), the film formation chamber (11) being capable of being depressurized and having a discharge gas introduced thereinto; a substrate holde...
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WO/2023/079584A1 |
A vapor deposition mask according to the present invention is provided with: a housing sheet (13); and a mask sheet (15) that is superposed on the housing sheet (13), while being provided with a plurality of opening parts (151, 152). The...
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WO/2023/079770A1 |
The present invention is provided with: a light source (42) that irradiates a substrate (S), which is arranged on a rotor (25), with light; a light-receiving unit (46) that receives light transmitted through a thin film layer, which is f...
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WO/2023/078730A1 |
The invention relates to a press tool having a press surface (2), for producing a workpiece. The press tool comprises a main structure (10) and at least two ceramic layers (11, 12) arranged on the surface (31) one on top of the other and...
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WO/2023/078731A1 |
The invention relates to a press tool having a press surface (2), for producing a workpiece. The press tool comprises a main structure (10) and at least two ceramic layers (11, 12) arranged on the surface (31) and forming the press surfa...
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WO/2023/081540A1 |
A process for producing semiconductor structures comprising one of more layers of Group in/TV Compounds deposited onto a template using PVD sputtering the resulting semiconductor structures is provided according to the invention. The Gro...
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WO/2023/079856A1 |
Provided is a sputtering target member which is for a magnetic recording layer and can suppress the generation of particles. This sputtering target member for a magnetic recording layer contains 10-70 mol% of Co, 5-30 mol% of Pt, 1.5-10 ...
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WO/2023/072543A1 |
The invention relates to a device for producing a graphene layer (10), comprising a first electrode (12), which comprises carbon and is connected at least to a positive terminal (14) of a voltage source (16), a second electrode (20), whi...
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WO/2023/074118A1 |
The present invention provides an IGZO sputtering target which has a high relative density, while suppressing particle increase and arcing during sputtering. The present invention provides an IGZO sputtering target which contains indium ...
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WO/2023/072384A1 |
A methods of implanting atoms into a substrate, wherein the atoms are at least some of the constituent atoms of a molecule and wherein the molecule comprises one or more colour centre atom(s) and one or more satellite atom(s). In come em...
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WO/2023/073060A1 |
A methods of implanting atoms into a substrate, wherein the atoms are at least some of the constituent atoms of a molecule and wherein the molecule comprises one or more colour centre atom(s) and one or more satellite atom(s). In come em...
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WO/2023/074310A1 |
An insert (1) according to the present disclosure comprises a base material (2) and a coating layer (3) that covers the surface of the base material (2). The base material (2) is formed of a cermet. The coating layer (3) is formed of Ti1...
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WO/2023/073404A1 |
Methods and systems of heating a substrate in a vacuum deposition process include a resistive heater having a resistive heating element. Radiative heat emitted from the resistive heating element has a wavelength in a mid-infrared band fr...
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WO/2023/072184A1 |
Disclosed in the present invention is a production method for a galvanized plate. Double-sided differential plating is performed on a substrate by a physical vapor deposition method, wherein a plating layer formed by the double-sided dif...
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WO/2023/074374A1 |
A multilayer structure comprising an amorphous substrate, a buffer layered formed on the amorphous substrate, and one or more gallium-nitride-based semiconductor layers formed on the buffer layer, wherein the gallium-nitride-based semico...
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WO/2023/074277A1 |
An insert (1) of the present disclosure includes: a substrate (2); and a covering layer (3) that covers the surface of the substrate (2). The substrate (2) comprises a cermet. Further, an insert of one embodiment is configured so that an...
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