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WO/2023/070864A1 |
Disclosed are a flexible stretchable gold film electrode based on reactive ion etching and a preparation method therefor, relating to the technical field of electrode materials. The preparation method comprises the following step: magnet...
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WO/2023/074330A1 |
This vapor deposition device (1) has: a mask holding part (2) that holds a vapor deposition mask (7) made of a magnetic material; a substrate disposition part (3) on which a substrate (11) is disposed so as to be in contact with the vapo...
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WO/2023/074052A1 |
Provided is a film forming method by which a metal film having a high melting point can be formed in a state where a stress difference is as small as possible and which is suitable in the case of using a cylindrical target. A film form...
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WO/2023/072371A1 |
An apparatus (10) for transportation of a thin film substrate (12) under vacuum conditions is described. The apparatus (10) for transportation includes a rotatable roller (100) with a substrate facing surface (102) including a first subs...
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WO/2023/075871A1 |
Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises supplying pulsed DC power to a target disposed in a processing volume of a processing chamber for depositing...
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WO/2023/074331A1 |
This vapor deposition device (1) has a mask holding unit (2) which holds a deposition mask (7) formed from a metal material, a substrate arrangement unit (3) which arranges the substrate (11) such that the substrate (11) contacts the upp...
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WO/2023/069156A1 |
Methods and apparatus for processing a substrate are provided herein. For example, a processing chamber for processing a substrate comprises a sputtering target, a chamber wall at least partially defining an inner volume within the proce...
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WO/2023/066491A1 |
A glazing (1) in the form of a window glass or vehicle glass, comprises a transparent glass substrate (11), and a coating (10), comprising, in order outward from the transparent glass substrate (11): optionally, a diffusion barrier layer...
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WO/2023/069230A1 |
An adapter for a deposition chamber includes an adapter body extending longitudinally about a central axis between an upper side and lower side opposite the upper side. The adapter body has a central opening about the central axis. The a...
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WO/2023/069158A1 |
A plasma vapor deposition (PVD) chamber used for depositing material includes an apparatus for influencing ion trajectories during deposition on a substrate. The apparatus includes at least one annular support assembly configured to be e...
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WO/2023/067602A1 |
Disclosed is a non-metalized blank having superior barrier properties and processes for maintaining such properties.
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WO/2023/067371A1 |
This patent relates to a method for depositing metallic coatings on a substrate comprising : - an annealing step, in an annealing furnace, forming on said substrate, a ferritic surface layer having a thickness from 10 µm to 50 µm and a...
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WO/2023/066732A1 |
The invention relates to a method for producing a coated flat steel product, comprising the following steps: producing or providing a steel substrate, optionally degreasing, optionally pickling, applying the anti-corrosion coating of zin...
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WO/2023/069190A1 |
Apparatus and methods for improving film uniformity in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a PVD chamber includes a pedestal disposed within a processing region of the PVD chamber, the pede...
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WO/2023/067406A1 |
This patent relates to a method for depositing metallic coatings on a substrate comprising : - an annealing step, in an annealing furnace, forming on said substrate, a ferritic surface layer having a thickness from 10 µm to 50 µm and a...
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WO/2023/067863A1 |
A production method for a frame with a film, said frame comprising a glass frame portion 5 having a through portion H, and a film 7 formed on one end surface 5b of the frame portion 5, wherein the production method includes a preparation...
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WO/2023/066510A1 |
The invention relates to a method for forming a coating on a substrate with the help of a coating device and a device for providing non-reactive ions characterized in that a negative bias is applied to the substrate for effecting an ion ...
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WO/2023/066030A1 |
The present application provides an unmanned aerial vehicle (UAV) surface coating, a preparation method therefor, and a UAV. The coating at least comprises: an adhesive layer, an anti-oxidation layer, an oxygen barrier transmission layer...
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WO/2023/066840A1 |
The present invention relates to a nano layered coating comprising alternating first and second layer stacks wherein the average layer period thickness in the first and second layer stacks are different from each other. The nano layered ...
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WO/2023/064015A1 |
A method for dielectric filling of a feature on a substrate yields a seamless dielectric fill with high-k for narrow features. In some embodiments, the method may include depositing a metal material into the feature to fill the feature f...
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WO/2023/063394A1 |
This antimicrobial substance comprises a base material and a copper-tin alloy layer that is disposed on the base material and that contains 60−90 at% of copper and 10−40 at% of tin with respect to a total of 100 at% of copper and tin...
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WO/2023/063766A1 |
The present invention relates to a composite structure which makes it possible to realize an ultra-fine semiconductor device. In particular, the composite structure according to the present invention comprises: a laminate in which two-di...
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WO/2023/062410A1 |
The invention relates to a vapour jet coater for depositing, on a running substrate, coatings formed from metal or metal alloy, said vapour jet coater comprising successively : - a repartition chamber, configured to be connectable to an ...
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WO/2023/063774A1 |
The present invention provides an oxide sintered body comprising a molybdenum oxide as a main component, a sputtering target comprising the sintered body, and an oxide thin film formed therefrom. The present invention can improve sintera...
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WO/2021/191285A9 |
The present invention relates to a method and to a system for producing a starting material for a silicon solar cell with passivated contacts.
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WO/2023/063352A1 |
A crystalline oxide thin film having In as a main component, the crystalline oxide thin film being such that 50% or more of Fourier transform images obtained by processing each of a plurality of lattice images of image regions, which are...
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WO/2023/062454A1 |
The invention relates to a vapour jet coater for depositing, on a running substrate, coatings formed from metal or metal alloy, said vapour jet coater comprising successively : - a repartition chamber, configured to be connectable to an ...
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WO/2023/063771A1 |
The present invention provides an oxide sintered body comprising molybdenum oxide as a main component, a sputtering target comprising the sintered body, and an oxide thin film formed therefrom. According to the present invention, by addi...
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WO/2023/062305A1 |
The invention relates to an optical element (30) comprising: - a transparent substrate (32), - an intermediate coating (38) extending over at least one main surface (36) of the substrate (32), the intermediate coating (38) comprising a p...
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WO/2023/064080A1 |
Embodiments include a gas distribution assembly for a semiconductor processing chamber. In an embodiment, the gas distribution assembly comprises a flow ratio controller (FRC). In an embodiment, a first line from the FRC goes to an ampou...
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WO/2023/062227A1 |
A method of manufacturing a pump element for a chamber (3) under partial gas pressure, the pump element comprising a substrate covered with a getter layer based on metallic material, the method being characterised in that comprises the f...
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WO/2023/063672A1 |
The present disclosure relates to a method for preparing a metal-CNT nanocomposite, a water-electrolysis catalyst electrode comprising a metal-CNT nanocomposite prepared by the preparation method, and a method for manufacturing the water...
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WO/2023/064122A1 |
Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to an optical device layer stack, an optical device formed from the optical device layer stack, and a metho...
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WO/2023/060733A1 |
Disclosed in the present invention is an evaporation boat baffle assembly. The evaporation boat baffle assembly comprises an annular bottom plate, an annular cover plate and a plurality of arc-shaped baffles. The annular cover plate rota...
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WO/2023/064016A1 |
Methods for selectively depositing on metallic surfaces are disclosed. Some embodiments of the disclosure utilize a hydrocarbon having at least two functional groups selected from alkene, alkyne, ketone, alcohol, ester, or combinations t...
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WO/2023/059510A1 |
Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to a system and method of forming an optical device film. In an embodiment, a method is provided for positi...
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WO/2023/056761A1 |
An evaporative coating apparatus and a baffle of an evaporative coating apparatus. The baffle of an evaporative coating apparatus comprises a baffle assembly and an adjustment assembly. The adjustment assembly comprises an inner shaft an...
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WO/2023/058890A1 |
An embodiment of a fine metal mask may comprise: a base sheet, a mask sheet which is formed on the base sheet and has pattern regions in which cells are formed, and cut regions formed between the base sheet and the mask sheet, wherein th...
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WO/2023/058706A1 |
The present invention aims to provide at least either: a laminate comprising a silicon substrate that comprises a gallium nitride that has higher crystallinity than a laminate comprising a silicon substrate comprising conventional galliu...
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WO/2023/057656A1 |
The invention relates to a new kind of electrocatalyst to be incorporated as part of the electrodes, anode and cathode, in water electrolysers aimed for hydrogen production through the electrochemical splitting of water into oxygen and h...
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WO/2023/057706A1 |
This device for heating a substrate (2) in a vacuum chamber for multilayer deposition on said substrate (2) comprises a heat source (5) intended to be in contact with the substrate (2), a support (6) for the heat source (5), a thermal in...
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WO/2023/057464A1 |
It is an object of the invention to provide a decontamination bath for decontaminating plastic articles comprising a contaminant, wherein the decontamination bath comprises - water, - a non-polar organic solvent component, - optionally a...
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WO/2023/058507A1 |
Provided is a sputtering apparatus comprising: a placement table on which a target material that is manufactured in a treatment container and that is made of a low melting point metal or a low melting point alloy is to be placed; a holdi...
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WO/2023/059405A1 |
Apparatus and methods for flipping substrates in vacuum between PVD sputtering of each side for increasing throughput are provided herein. In some embodiments disclosed herein, a module of a processing system for flipping a substrate in ...
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WO/2023/058698A1 |
This sputtering target contains crystal grains, contains 3 vol% or less of an amorphous phase, and contains at least one metal selected from the group consisting of chromium, molybdenum, and chromium-molybdenum alloys.
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WO/2023/059071A1 |
The present invention provides a molybdenum oxide sintered compact exhibiting excellent low reflection, chemical resistance and heat resistance, a thin film using the sintered compact, a thin film transistor comprising the thin film, and...
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WO/2023/051514A1 |
Provided in the present application is a manufacturing method for an aluminum-scandium alloy target material with a high scandium content. By mixing an Sc powder and an intermetallic compound Al3Sc powder, the powder sintering temperatur...
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WO/2023/053340A1 |
This hard coating 32 comprises: a first layer 34 provided on the surface of a base material 30; and a second layer 36 provided on the surface of the first layer 34. The first layer 34 is composed of AlCrαN, and the second layer 36 is co...
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WO/2023/051496A1 |
The present application discloses a semiconductor processing device and a wafer processing method. The semiconductor processing device comprises a processing chamber, and further comprises a heating chamber in communication with the proc...
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WO/2023/054044A1 |
This surface treatment device comprises: a treatment target material placement part (50) (placement part) for placing a treatment target material (W); a load lock chamber 55 (first accommodation unit) which accommodates the treatment tar...
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