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JP2021146465A |
To provide a dressing plate of a trimming blade and a dressing method of the trimming blade which can stably dress even when the blade is a trimming blade having a tapered part in a cutting edge.A dressing plate includes a plate-like pla...
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JP2021142606A |
To provide a method for manufacturing raceway rings capable of shortening the time required for forming a grindstone and improving the forming accuracy of the grindstone.The method for manufacturing raceway rings comprises the steps of: ...
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JP2021142616A |
To enable fixation and replacement of a cutting blade to be performed easily while enabling reduction of a cutting time of a workpiece in which a plurality of to-be-cut lines are set.A blade molding method is a method of molding a cuttin...
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JP6938853B2 |
To provide a grinder capable of confirming an appropriate implementation of truing.A grinder 1 comprises: a spindle stock 20 for rotatably supporting a work-piece W; a grinding wheel 50 for grinding the work-piece W; a truer 60 for truin...
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JP6939752B2 |
Provided is a method of chamfer machining a silicon wafer which makes it possible to increase the number of machining operations that can be performed using a chamfering wheel used for helical chamfer machining in the case of obtaining a...
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JP6938852B2 |
To provide a grinder capable of confirming an appropriate implementation of truing.A grinder 1 comprises: spindle stock 20 for rotatably supporting a work-piece W; a grinding wheel 50 for grinding the work-piece W; a truer 60 for truing ...
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JP2021133443A |
To provide a cutting device that can suppress the increase in size of the device even if a dressing material for dressing a cutting blade is provided.A cutting device 1 comprises a cutting unit 20 having a spindle 23 to which a cutting b...
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JP2021133428A |
To provide a surface grinding device enabling efficient and highly accurate grinding of a placoid workpiece made of hard brittle material such as SiC, GaN, sapphire, and diamond.A surface grinding device comprises: a work table 41 that f...
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JP2021130195A |
To provide a grinding device that facilitates mounting of dress means.The grinding device comprises a wafer chuck for holding a wafer, grinding means having a grindstone for grinding the wafer, and a dress unit for dressing the grindston...
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JP2021126709A |
To provide a dressing grinding device for a screw grinder, capable of effectively preventing grinding scorch and deterioration of a rotary diamond from occurring as well as being capable of sufficient dressing.A dressing grinding device ...
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JP2021126739A |
To perform chamfering of a polishing pad using a dresser that can be manufactured easily.A substrate processing method includes: a carrying step S100 of carrying a polishing pad having a polishing surface for polishing a substrate; a dre...
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JP6924992B2 |
To provide a grinder that can grasp a wear state of a grind stone in an in-process.A grinder 1 includes: a grinder body 10 for grinding a work W with a grinding wheel K while supplying grinding oil O thereto; a flow passage D through whi...
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JP6926626B2 |
To provide a grinder system capable of achieving enhancement of processing efficiency while executing truing at an optimum period.A grinder 1 has a truer 60 which carries out truing of a grinding wheel 50, a sensor 100 which detects surf...
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JP6926816B2 |
To provide a grinding device configured to accurately grasp a diameter of a grinding wheel at low costs so that the grinding wheel can be used to use limit.A control device comprises: a pin-length memorizing part 94; a pin-length renewin...
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JP6923342B2 |
Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing ...
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JP6918239B2 |
An elevator-guide-rail-machining apparatus, wherein a machining device body is moved along a guide rail. The machining device body also has a machining tool and a machining-tool-driving device. The machining tool scrapes off at least par...
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JP2021109270A |
To provide a new technique for reducing occurrence of poor products by improving a processing quality, in a processing method that applies grooving processing in a specific direction to a work-piece using a cutting blade.A processing met...
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JP6909598B2 |
In a surface grinding method in which a grinding wheel is dressed with a dressing board on a chuck table by advancing the grinding wheel from a dressing start position and a workpiece on the chuck table is ground by advancing the grindin...
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JP6910049B2 |
To provide a method for dressing a grindstone of external gear form for an internal gear, and a dresser set.A method for dressing a grindstone of external gear form comprises: a step at which a grindstone 1 of external gear form for proc...
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JP6906980B2 |
To provide a grinder which can simply mount dress means.A grinder 1 includes: a wafer chuck 3 holding a wafer W; grinding means 2 having a ground grindstone 21 grinding the wafer W; and a dress unit 8 dressing the ground grindstone 21. T...
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JP6906836B2 |
A method of using a laminated dressing board is provided. In the laminated dressing board, a shape adjustment dressing layer containing first abrasive grains and used for shape adjustment of a cutting blade and a setting dressing layer c...
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JP2021102247A |
To make it possible to easily and accurately perform discrimination of dress timing.When processing a work-piece by a rotary tool, a load in a tangential direction on a circumference of the rotary tool at a processing part between the wo...
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JP6903407B2 |
One or more workpieces having a desired gear geometry may be produced by means of a suitably dressed tool which is respectively dressed by a dresser after the carrying out of one or more machining steps before further machining steps are...
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JP6899182B2 |
To detect the shape of a polishing surface of a polishing tool.A polishing device 1 comprises a dressing mechanism 6 for dressing a polishing surface 401a of a polishing tool 40 in polishing means 4 for polishing a plate-like work W, pol...
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JP6900523B2 |
To provide a dresser which satisfies both of high pad grinding speed and high pad flatness.A dresser for a polishing cloth in which a single layer of plural diamond abrasive grains is firmly adhered to a surface of a metal support. In th...
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JP6895872B2 |
An even step elimination performance is obtained even when steps of various dimensions exist which are caused due to pattern structures existing in a chip or film forming methods. A planarizing apparatus is provided which is configured t...
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JP2021091039A |
To suppress increase in footprint of a substrate treatment apparatus, and to improve treatment efficiency of a processing unit of the substrate treatment apparatus.A dressing unit used in a substrate treatment apparatus includes: a dress...
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JP6887727B2 |
To provide a dressing board that can cooperate with a dressing table to prevent a dressing board from warping, and to provide a cutting device that includes a dressing table for fixing and holding the dressing board.A rectangle dressing ...
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JP6887846B2 |
To provide a grinding device that facilitates a setting operation for dressing.A grinding device 1 comprises: a dress board 51 that dresses a grind stone 21; first measuring means 8 that measures the height of the dress board 51; and sec...
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JP6888753B2 |
To provide a method for dressing a polishing pad with high accuracy using an existing dressing tool and a polishing device for making a thickness of a workpiece uniform by preventing partial excessive polishing of the workpiece.A double-...
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JP6886523B2 |
Provided is a disk-shaped electrodeposition grindstone (10) which has a circular arc-like outer periphery in a cross-section view that includes a central axis (GC) of the grindstone. The outer periphery has abrasive grains (16) bonded th...
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JP6884015B2 |
Provided is a polishing device for appropriately retaining a polishing member in an appropriate state in polishing. The polishing device for partially polishing a substrate includes a polishing member having a processing surface which co...
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JP6875675B2 |
To provide a machine tool capable of performing processing with high precision without being affected by fitting precision of a tool by providing a versatile on-machine tooling device.An on-machine tooling device 1 comprises: a tooling m...
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JP6873712B2 |
Disclosed herein is a dressing board for dressing a cutting blade. The dressing board is held on a chuck table in dressing the cutting blade. The dressing board includes a bar code formed on the front side of the dressing board for indic...
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JP6867759B2 |
In a method of producing a toothed workpiece having a modified surface geometry by a diagonal generating method by means of a modified tool, a tool may be used whose surface geometry comprises a modification which can be described at lea...
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JP6869051B2 |
To provide a grinder which dresses a ground surface of a ground grindstone into a curved shape according to a desired wafer shape.A grinder 1 includes: a wafer chuck 3 holding a wafer W; grinding means 2 having a ground grindstone 21 gri...
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JP2021070080A |
To extend lives of mechanisms such as a high pressure pump and a pressure control valve, and a seal resin rubber of a piping system.A polishing system 1 polishes workpiece made of super alloy with an outer peripheral surface 2a (polishin...
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JP6863076B2 |
To provide a polycrystalline diamond having high abrasion resistance which can form a protection film for surface protection.A polycrystalline diamond is composed of a plurality of crystal grains with a diamond single phase as a basic co...
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JP6862764B2 |
To provide a grinding device enabled being hardly impacted by heat deformation of a mechanical structure in a simple and low cost way.A first grinding device 1A is configured to: measure a first groove bottom radius Di and a first center...
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JP6863040B2 |
To provide a grinder system capable of achieving enhancement of processing efficiency while executing truing at an optimum period.A grinder has a control device 110 which controls truing with respect to a grinding wheel. The control devi...
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JP6858634B2 |
To simplify a structure, and to normalize the machining of held disc work.A holding table (10) includes: a work holding table (13) which has a diameter smaller than a base table (11) and has a holding surface (12) holding disc work (W) o...
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JP6851761B2 |
To provide a method for processing a plate-like object, capable of forming a uniform gettering layer to a wafer as the plate-like object.A method for processing a plate-like object, includes: a holding step of holding a wafer W with a ch...
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JP6850631B2 |
To provide a grinding device configured to accurately measure residual dressing amounts.The grinding device comprises: a wafer chuck for holding a wafer; grinding means having a grind stone 21 for grinding the wafer; and a unit comprisin...
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JP6846657B2 |
A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the ...
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JP6849389B2 |
A chemical mechanical polishing method is provided comprising: providing a substrate, wherein the substrate comprises a silicon oxide and a silicon nitride; providing a polishing slurry; providing polishing pad, comprising: a polishing l...
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JP6847484B1 |
To provide a method for polishing a work groove, which enables extremely accurate polishing when processing a lower groove or the like formed on a work. A polishing method for polishing a lower groove W1 of a work W. A pair of disc-shape...
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JP6843692B2 |
To provide a grinding wheel-dressing method capable of flatly forming the bottom face of a grinding wheel.A grinding wheel-dressing method comprises: a holding step ST1 of holding a dressing board on the holding surface of a chuck table;...
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JP6842859B2 |
A dressing device including: a disk that has an opening on an inside, the disk dressing a polishing surface for polishing a substrate; a rotatable holder, the disk being coupled to a lower surface side of the holder, the holder being pro...
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JP6843126B2 |
A substrate processing apparatus has a table on which a polishing surface for polishing a substrate is provided, and a discharge suction section which has a discharge port which communicates with a fluid supply source and through which a...
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JP6844985B2 |
To provide a dressing board capable of executing dressing by using a proper dressing board according to the kind of a cutting blade, without requiring complicated management; and to provide a method of application thereof.There is provid...
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