Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1 - 50 out of 2,944

Document Document Title
WO/2019/149165A1
An efficient ultra-precise shear thickening and chemical synergy polishing method, comprising the following steps: 1) fixing workpieces (3) to a polishing and fixing disc (31) of implementation equipment; 2) preparing an efficient ultra-...  
WO/2019/131174A1
The present invention relates to a device for partially removing material constituting the surface of a substrate. In one embodiment, the substrate processing device comprises a holding mechanism unit (5) for holding the substrate (W), a...  
WO/2019/119816A1
A CMP polishing solution for polishing a GaAs wafer and a preparation method therefor. The CMP polishing solution comprises the following components in parts by weight: 0.1-50 parts of abrasive, 0.001-0.4 part of surfactant, 0.001-0.6 pa...  
WO/2019/108604A1
A grinding media handling system for a vertical grinding mill comprises: a reservoir; a pump, such as a sump pump or a horizontal pump, for pumping water and/or a slurry of material to be ground from the reservoir via an inlet in an uppe...  
WO/2019/093133A1
Provided is a dicing method with which it is possible to obtain a high yield even when a chip is cut with a narrow width. Provided is a method of dividing a substrate having a device formed thereon into individual chips. The methods incl...  
WO/2019/094227A1
Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments h...  
WO/2019/032234A1
Some embodiments include an apparatus having a polishing mechanism configured to polish a surface of a wafer. The polishing mechanism converts fresh slurry to used slurry during a polishing process. At least one emitter is configured to ...  
WO/2018/216721A4
Provided is an abrasive particle recovery system for an ultrasonic processing system in which it is possible to recover abrasive particles from a suspension to be discarded and to reuse said abrasive particles. An abrasive particle recov...  
WO/2018/216721A1
Provided is an abrasive particle recovery system for an ultrasonic processing system in which it is possible to recover abrasive particles from a suspension to be discarded and to reuse said abrasive particles. An abrasive particle recov...  
WO/2018/189239A1
The invention relates to a device (1) and a method for polishing a surface (2) of a strip (3) made of metal, in particular a continuous strip, the device (1) comprising at least one polishing head (4, 5) for polishing the surface (2), th...  
WO/2018/184658A1
The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, comprising a polishing disc (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for re...  
WO/2018/184657A1
The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, comprising a polishing disc (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for re...  
WO/2018/173376A1
A grinding fluid regeneration device that regenerates used grinding fluid containing grinding dust, said device comprising a storage tank that stores the used grinding fluid, and a membrane separation module that has a filtration membran...  
WO/2018/169536A1
Disclosed herein are chemical mechanical polishing (CMP) conditioning disks, and related systems and techniques. For example, in some embodiments, a CMP conditioning disk may include: a support; a first pedestal extending from the suppor...  
WO/2018/135878A1
Disclosed is a method for producing a polishing pad, the method comprising the steps of: providing a polishing layer; forming a first through-hole penetrating the polishing layer; providing a support layer facing the polishing layer; int...  
WO/2018/122500A1
A polishing pad (1) formed from a foam body (2), provided with an attachment surface (21) for being attached to the rotary plate of a polishing machine and having an active surface (22) wet by the polishing liquid and coming into contact...  
WO/2018/101583A1
A slurry composition for polishing an organic film of the present invention comprises an oxidant, an organic acid, a polishing accelerator comprising a repeating unit derived from maleic acid or maleic anhydride, and water, wherein the p...  
WO/2018/052816A1
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, a...  
WO/2018/045039A1
A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is...  
WO/2018/030675A1
The present invention comprises: a holding jig for supporting a processing object; a brush rotating/driving portion arranged on the holding jig so as to rotate a brush such that the processing object is polished; an X-axis direction driv...  
WO/2018/020975A1
The purpose of the present invention is to provide a recycled medium for barrel polishing and a method for manufacturing such a recycled medium for barrel polishing, said recycled medium utilizing media for barrel polishing which have be...  
WO/2018/014568A1
Provided is a new process for the copper polishing processing of a sapphire wafer, belonging to the field of LED substrate processing. Scratches caused in the previous procedure are removed gradually by selecting three different polishin...  
WO/2017/222999A1
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The...  
WO/2017/218921A1
In described examples, a chemical mechanical polishing (CMP) system (200) includes a platen (214), a conduit (202) having a heating segment (205) and a delivery outlet (212), and a heater (206) coupled to the heating segment (205) of the...  
WO/2017/179066A1
Disclosed herein is a handheld automatic multifunctional buffing device which comprises a dispenser assembly for dispensing polishing compound from a cartridge, a compressible compartment for storing the polishing compound, a battery ope...  
WO/2017/169124A1
Provided are a substrate polishing device, a method of cleaning the same, and a device for supplying liquid to a substrate polishing device, with which it is possible to suppress agglomeration of a polishing liquid in a pipe. Provided is...  
WO/2017/160129A3
The present invention relates to a laminated sheet polishing method and a laminated sheet polishing device for performing the same and, more particularly, to a polishing method for laminating sheets to be polished and polishing the same ...  
WO/2017/160129A2
The present invention relates to a laminated sheet polishing method and a laminated sheet polishing device for performing the same and, more particularly, to a polishing method for laminating sheets to be polished and polishing the same ...  
WO/2017/139079A1
Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the s...  
WO/2017/098986A1
The present invention addresses the problem of providing a method for regenerating an abrasive slurry whereby an abrasive slurry showing a high abrasion speed can be efficiently regenerated. The method according to the present invention ...  
WO/2017/033409A1
The present invention is a polishing apparatus equipped with a surface plate on which a polishing fabric is affixed, a polishing head for holding a wafer, a tank for storing an abrasive, an abrasive supply mechanism for supplying the abr...  
WO/2017/011451A1
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.  
WO/2016/190128A1
Provided is a polishing method which achieves an excellent polishing result even when a polishing composition which has been used in polishing an object to be polished is collected and reused. The polishing method according to the presen...  
WO/2016/171018A1
[Problem] To provide a method for producing fine silicon powder which allows for collection of high-purity flaky fine silicon powder from silicon cutting scraps generated during slicing of a silicon ingot, without using a mechanical pulv...  
WO/2016/147968A1
Provided is a recovery method for an abrasive, with which it is possible to recover a highly pure abrasive from a recovery slurry that contains a used abrasive, by a simple method. This recovery method for an abrasive for recovering an a...  
WO/2016/140634A1
Present invention is a board surface (7) polishing application system (1) for wood-based panel furniture materials such as melamine-coated particleboard, MDF, plywood, parquet, fiberboard etc., wherein it contains at least one polishing ...  
WO/2016/103854A1
A method for evaluating abrasive grains used in a slurry for cutting ingots, wherein there are performed an evaluation-solution-preparation step (S1) for causing abrasive grains containing polishing abrasive grains and impurities to diss...  
WO/2016/098286A1
The present invention is a silicon wafer polishing method wherein a used slurry that contains abrasive polishing grains and that has been supplied to a silicon wafer and used for polishing is recovered and the recovered used slurry is ci...  
WO/2016/059142A1
The invention relates to a method for discharging solid pastes for surface working onto a working tool (16), comprising the steps of providing a solid paste (46) for the surface working, which contains abrasives, in particular a solid pa...  
WO/2015/198461A1
[Problem] The present invention provides a centrifuge for separating particles with differences in specific gravity such as when particles with a small specific gravity and particles with a large specific gravity, such as Si hydrates and...  
WO/2015/151408A1
Provided is a workpiece cutting method for cutting a workpiece by forming a wire column with a wire that travels in the axial direction and that is wound in a helical shape between a plurality of wire guides, and supplying a working flui...  
WO/2015/133516A1
The present invention relates to a substrate processing system and a substrate processing method that are capable of flushing the processing liquid supply line. The substrate processing system is provided with a substrate processing appa...  
WO/2015/115652A1
Provided is a regenerating method for used polishing slurry that can sufficiently crush solid content generated by way of centrifugal separation of used polishing slurry, and can thereby suppress damage from occurring to a glass substrat...  
WO/2015/107826A1
This coolant regenerating device (1) is provided with: a first tank unit (11A) at which a subject liquid containing a sludge (S2) is retained and at which a region having more sludge (S2) and a region having less sludge (S2) are formed i...  
WO/2015/097989A1
The present invention provides a slicing method wherein a wire saw is used; and a coolant is supplied to a wire wound around multiple wire guides, and a silicon ingot is pressed against the wire to cut the silicon ingot while the wire is...  
WO/2015/086544A1
A method of processing a super-hard material product (100) having a Vickers hardness of no less than 2000 kg/mm2, the method comprising: mounting the super-hard material product (100) with a surface of the super-hard material product (10...  
WO/2015/081461A1
A minimal quantity lubrication grinding device capable of controllably transporting a nanoparticle jet flow under a magnetically enhanced electric field. The charge quantity of liquid drops is increased through the addition of a magnetic...  
WO/2015/072569A1
A method for manufacturing a glass substrate for a magnetic disk comprises polishing treatment for pressing main surfaces on both sides of a glass substrate by polishing pads, and relatively moving the main surfaces and the polishing pad...  
WO/2015/060265A1
Provided is a magnetic filter device for preventing the reduction in magnetic field strength at positions at a distance from the magnet unit. The magnetic filter device (1A, 1B) is provided with: a processing vessel (6) having a processi...  
WO/2015/004973A1
A scattering plate (4) for scattering a supplied solution supplied via a supply tubing is characterized by the following: being provided with a planar member (41) that can be disposed at a position facing an opening end of the supply tub...  

Matches 1 - 50 out of 2,944