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WO/2012/053432 |
The disclosed method for recovering a cerium oxide polishing agent involves at least a crushing step of mixing caked polishing-agent waste containing a cerium oxide polishing agent and polished glass debris with an acid aqueous solution ...
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WO/2012/042769 |
A method for producing glass substrates for hard disks, wherein the amount of colloidal silica contained in a polishing liquid that is deposited on a glass substrate is reduced. The method for producing glass substrates for hard disks in...
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WO/2012/018175 |
The present invention relates to a method for regenerating a ceria-based abrasive from a polishing waste comprising a ceria-based abrasive, frit glass, a polishing pad and an inorganic coagulant, comprising the following steps: adding a ...
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WO/2012/018175 |
The present invention relates to a method for regenerating a ceria-based abrasive from a polishing waste comprising a ceria-based abrasive, frit glass, a polishing pad and an inorganic coagulant, comprising the following steps: adding a ...
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WO/2011/108419 |
Disclosed is a liquid filtration method that extends filter life and achieves high filtration efficiency, and also an abrasive slurry produced by said method. In this liquid filtration method, a filter is decompression-treated in a solve...
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WO/2011/108418 |
Disclosed is a filtration method that extends filter life and achieves high filtration efficiency, and also an abrasive slurry produced by said method. In the filtration method, a filter is dipped in a deaired solvent before a non-deaire...
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WO/2011/105255 |
Disclosed is a manufacturing method for semiconductor wafer whereby pure water not containing free abrasives is supplied during all treatment stages carried out by machining, except for polishing treatment, which results in reduced quant...
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WO/2011/099596 |
Disclosed is a technique which efficiently removes the glass component contained in a used Cerium-based abrasive slurry, restores the abrasion rate, and regenerates a Cerium-based abrasive which suppresses the occurrence of abrasion dama...
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WO/2011/099197 |
Disclosed is a technique which efficiently removes the glass component contained in a used Cerium-based abrasive slurry, restores the abrasion rate, and regenerates a Cerium-based abrasive which suppresses the occurrence of abrasion dama...
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WO/2011/061039 |
The invention relates to a plant for separating grinding slurry originating from grinding machines into metal chips and grinding oil. According to the invention, a carrier bowl (3) in a frame (1) is filled with a divided volume of the gr...
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WO/2011/042017 |
The invention relates to a recycling method and to a recycling device for recycling waste water containing slurry from a semi-conductor treatment process, in particular from a chemico-mechanical polishing process. Said method consists of...
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WO/2011/024241 |
Provided is an optical disc repairing apparatus wherein performance of repairing scratches on an optical disc is high, operational troubles of an operator are eliminated and manufacturing cost of the apparatus is suppressed. An optical ...
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WO/2011/003782 |
The invention relates to a method for preparing a suspension from a separation process, wherein the suspension is made of a particulate abrasive and a liquid slurrying agent. The method comprises the steps: a) thinning the suspension in ...
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WO/2010/150460 |
Provided are a silicon ingot cutting method and a cutting system. The method comprises: performing a primary and secondary centrifugal separations on waste slurry produced when a silicon ingot is cut by a wire saw and separating the wast...
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WO/2010/137228 |
Provided is a method for cutting a silicon ingot, with which the waste slurry generated when a silicon ingot is cut by a wire saw is subjected to primary centrifugation and separated into a primary separated liquid and a solid component,...
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WO/2010/120967 |
An abrasive slurry tool, the tool being attachable to a running string, the tool including a high-pressure assembly, the assembly including a nozzle assembly; and a low-pressure assembly in abrasive fluid communication with the high-pres...
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WO/2010/120967 |
An abrasive slurry tool, the tool being attachable to a running string, the tool including a high-pressure assembly, the assembly including a nozzle assembly; and a low-pressure assembly in abrasive fluid communication with the high-pres...
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WO/2010/101925 |
A system for magnetorheological finishing of a substrate. A spherical wheel meant for carrying a magnetorheological finishing fluid houses a variable-field permanent magnet system having north and south iron pole pieces separated by prim...
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WO/2010/101925 |
A system for magnetorheological finishing of a substrate. A spherical wheel meant for carrying a magnetorheological finishing fluid houses a variable-field permanent magnet system having north and south iron pole pieces separated by prim...
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WO/2010/084945 |
Provided is a method for processing a mixed material wherein second particles formed of a magnetic material or a non-magnetic material are mixed in a fluid medium which contains first particles formed of a magnetic material or a non-magn...
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WO/2010/084635 |
A method for treating a mixture produced by mixing second particles formed from a magnetic substance or a nonmagnetic substance into a fluid medium containing first particles formed from a magnetic substance or a nonmagnetic substance co...
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WO/2010/082447 |
A slurry regenerating device provided with a centrifugal separator (2) for allowing waste slurry to be inserted therein, a discharge opening (12) for discharging a primarily separated substance and a secondarily separated substance from ...
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WO/2010/001961 |
A method of regenerating a coolant is provided with which a regenerated slurry can be inhibited from having an increased viscosity. The method of coolant regeneration comprises subjecting a spent slurry discharged after the cutting of a ...
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WO/2009/153980 |
Disclosed is a magnetic particle separating device in which a cylindrical portion (2f) with an essentially constant inner diameter along the entire length in the vertical direction, an upper-side inverted conical portion (2b) narrowing i...
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WO/2009/145711 |
A method for maintaining a hard floor surface comprises applying a cleaning liquid onto the floor surface from a single cleaning liquid container, treating the floor surface, in the presence of the cleaning liquid, with a flexible pad co...
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WO/2009/142941 |
A waterjet system for generating and delivering fluid jets suitable for processing a workpiece has a cutting head body and a mixing tube. The cutting head body includes a mixing chamber and a bore. The bore is positioned downstream of th...
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WO/2009/142941 |
A waterjet system for generating and delivering fluid jets suitable for processing a workpiece has a cutting head body and a mixing tube. The cutting head body includes a mixing chamber and a bore. The bore is positioned downstream of th...
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WO/2009/129765 |
The invention relates to a method and a device for working the surface of an extremely hard material, especially for cutting polycrystalline diamonds (PKD), enabling rapid and homogeneous removal of material. To this end, the method acco...
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WO/2009/084068 |
A process for the complete separation of the suspending fluid from the solid components container in an exhausted slurry, either abrasive or not, coming from the cutting operation or other mechanical working of materials of monocrystalli...
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WO/2009/056152 |
The present invention relates to a method and a system for treating spent abrasive slurry obtained from a process for cutting a body of a substrate material into wafer-like slices, said slurry comprising a lubricant fluid, unspent abrasi...
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WO/2009/053003 |
The invention relates to methods for classifying and separating solids. Said methods are characterized in that solids of different sizes and densities are applied to a thixotropic gel or are contained therein, the solids are sedimented o...
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WO/2009/022765 |
Disclosed is a continuous and uninterruptible slurry dispense device that includes: four pressure vessels (10,20,30,4), two of which respectively configure a pair, as a drive unit and a standby unit and in which level sensors (91,92,93,9...
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WO/2009/021364 |
The present invention provides a method of controlling scratching of the polished surfaces of silicon wafers, which comprises adhering silicon wafers onto the polishing discs of a polisher, then holding the polishing discs onto the polis...
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WO/2009/002351 |
Chemical mechanical planarization apparatuses with polishing assemblies that provide for the passive removal of slurry are provided. In accordance with an embodiment, a work piece polishing assembly comprises a polishing pad comprising a...
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WO/2008/149490 |
A method for cutting an ingot into a wafer by entraining a wire about a roller with a plurality of groove and, while supplying cutting slurry to the grooved roller, pressing the reciprocating wire against the ingot. A wire saw device cut...
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WO/2008/078349 |
Process and relative apparatus for recovering the reusable abrasive component contained in an abrasive slurry for the lapping of silicon wafers, or of quartz or ceramic components, when it becomes exhausted and enriched with undesired wa...
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WO/2008/069136 |
Disclosed is a method for removing a chelate complex from a chemical used in a semiconductor production process and containing a compound having a chelating ability. This method also enables to reduce the cleaning load. Specifically disc...
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WO/2008/035513 |
A method for cutting an ingot into wafers by winding a wire around a plurality of grooved rollers and pressing the traveling wire against the ingot while supplying cutting slurry to the grooved rollers. Only during a period after the cut...
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WO/2008/036108 |
An apparatus for the, delivery of slurry, solution comprising an ultrasonic flow meter (303) positioned between a fluid preparation manifold and a slurry delivery arm, and a shutoff valve (307) positioned between a proportional valve (30...
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WO/2008/036108 |
An apparatus for the, delivery of slurry, solution comprising an ultrasonic flow meter (303) positioned between a fluid preparation manifold and a slurry delivery arm, and a shutoff valve (307) positioned between a proportional valve (30...
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WO/2008/020507 |
Not only small-diameter foreign matter but also large-diameter foreign matter mixed in polishing is effectively removed from an abrasive slurry waste liquid to thereby attain recovery of abrasive. Recovery of abrasive from an abrasive sl...
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WO/2008/011014 |
Systems and methods for processing high purity materials are disclosed. A unit operation processes a material stream, an operational parameter of the unit operation is monitored, and a standby unit is charged with pressurized gas to achi...
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WO/2008/002812 |
A method and apparatus for retaining electrolyte on a rotating platen using directional air flow is provided. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surfa...
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WO/2007/105714 |
A method of recovering rare earth elements from a composition containing rare earth fluorides, characterized in that (1) hydrochloric acid, silicon oxide and a composition containing rare earth fluorides are mixed together, (2) the mixtu...
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WO/2007/087831 |
During processing of a semiconductor wafer bearing a structure including a low-k dielectric layer (120), a cap layer (130) and the metal-diffusion barrier layer (140), a chemical mechanical polishing method applied to remove the metal-di...
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WO/2007/087830 |
When performing a chemical mechanical polishing (CMP) process on a workpiece such as a semiconductor wafer (W), using a slurry (150) having small abrasive particles, notably abrasive particles of average diameter less than 50nm, polishin...
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WO/2007/054125 |
A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser a...
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WO/2007/010717 |
A double side polishing method for a wafer, for simultaneously polishing both sides of the wafer held by a carrier, with the wafer clamped between upper and lower surface plates to which polishing cloth is applied and with slurry supplie...
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WO/2006/137098 |
Process for completely recovering the reusable components of an abrasive slurry used in slicing crystalline materials of silicon, quartz or ceramics when it becomes exhausted and enriched with undesired waste matter. The process consists...
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WO/2006/076827 |
The present invention relates a blasting device for premixed abrasive slurry jet. The device includes a cylinder, in which defines a hydraulic oil side and a slurry side separated from each other hermetically, and the hydraulic oil side ...
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