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Matches 1 - 50 out of 2,957

Document Document Title
WO/2019/199073A1
Polishing compositions according to various embodiments of the present disclosure comprise a fluorine-containing compound, a pH adjuster, an additive, and water, wherein the content of the fluorine-containing compound may be 0.01-20 wt% ...  
WO/2019/181498A1
The present invention addresses the problem of providing a polishing agent recycle processing system and a polishing agent recovery/regeneration method for efficiently recovering a polishing agent from a used polishing agent slurry and r...  
WO/2019/159603A1
The present invention is a double-sided polishing method for a wafer, for holding the wafer in a work piece holding hole formed in a carrier in a double-sided polishing device, sandwiching the wafer between an upper surface plate and a l...  
WO/2019/149165A1
An efficient ultra-precise shear thickening and chemical synergy polishing method, comprising the following steps: 1) fixing workpieces (3) to a polishing and fixing disc (31) of implementation equipment; 2) preparing an efficient ultra-...  
WO/2019/131174A1
The present invention relates to a device for partially removing material constituting the surface of a substrate. In one embodiment, the substrate processing device comprises a holding mechanism unit (5) for holding the substrate (W), a...  
WO/2019/119816A1
A CMP polishing solution for polishing a GaAs wafer and a preparation method therefor. The CMP polishing solution comprises the following components in parts by weight: 0.1-50 parts of abrasive, 0.001-0.4 part of surfactant, 0.001-0.6 pa...  
WO/2019/108604A1
A grinding media handling system for a vertical grinding mill comprises: a reservoir; a pump, such as a sump pump or a horizontal pump, for pumping water and/or a slurry of material to be ground from the reservoir via an inlet in an uppe...  
WO/2019/093133A1
Provided is a dicing method with which it is possible to obtain a high yield even when a chip is cut with a narrow width. Provided is a method of dividing a substrate having a device formed thereon into individual chips. The methods incl...  
WO/2019/094227A1
Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments h...  
WO/2019/032234A1
Some embodiments include an apparatus having a polishing mechanism configured to polish a surface of a wafer. The polishing mechanism converts fresh slurry to used slurry during a polishing process. At least one emitter is configured to ...  
WO/2018/216721A4
Provided is an abrasive particle recovery system for an ultrasonic processing system in which it is possible to recover abrasive particles from a suspension to be discarded and to reuse said abrasive particles. An abrasive particle recov...  
WO/2018/216721A1
Provided is an abrasive particle recovery system for an ultrasonic processing system in which it is possible to recover abrasive particles from a suspension to be discarded and to reuse said abrasive particles. An abrasive particle recov...  
WO/2018/189239A1
The invention relates to a device (1) and a method for polishing a surface (2) of a strip (3) made of metal, in particular a continuous strip, the device (1) comprising at least one polishing head (4, 5) for polishing the surface (2), th...  
WO/2018/184658A1
The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, comprising a polishing disc (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for re...  
WO/2018/184657A1
The invention relates to a polishing machine (10) and to a method for polishing optical waveguides, comprising a polishing disc (13) having a plug socket (14) for holding a plug with an optical waveguide, a polishing platform (15) for re...  
WO/2018/173376A1
A grinding fluid regeneration device that regenerates used grinding fluid containing grinding dust, said device comprising a storage tank that stores the used grinding fluid, and a membrane separation module that has a filtration membran...  
WO/2018/169536A1
Disclosed herein are chemical mechanical polishing (CMP) conditioning disks, and related systems and techniques. For example, in some embodiments, a CMP conditioning disk may include: a support; a first pedestal extending from the suppor...  
WO/2017/160129A3
The present invention relates to a laminated sheet polishing method and a laminated sheet polishing device for performing the same and, more particularly, to a polishing method for laminating sheets to be polished and polishing the same ...  
WO/2018/135878A1
Disclosed is a method for producing a polishing pad, the method comprising the steps of: providing a polishing layer; forming a first through-hole penetrating the polishing layer; providing a support layer facing the polishing layer; int...  
WO/2018/122500A1
A polishing pad (1) formed from a foam body (2), provided with an attachment surface (21) for being attached to the rotary plate of a polishing machine and having an active surface (22) wet by the polishing liquid and coming into contact...  
WO/2018/101583A1
A slurry composition for polishing an organic film of the present invention comprises an oxidant, an organic acid, a polishing accelerator comprising a repeating unit derived from maleic acid or maleic anhydride, and water, wherein the p...  
WO/2018/052816A1
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, a...  
WO/2018/045039A1
A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is...  
WO/2018/030675A1
The present invention comprises: a holding jig for supporting a processing object; a brush rotating/driving portion arranged on the holding jig so as to rotate a brush such that the processing object is polished; an X-axis direction driv...  
WO/2018/020975A1
The purpose of the present invention is to provide a recycled medium for barrel polishing and a method for manufacturing such a recycled medium for barrel polishing, said recycled medium utilizing media for barrel polishing which have be...  
WO/2018/014568A1
Provided is a new process for the copper polishing processing of a sapphire wafer, belonging to the field of LED substrate processing. Scratches caused in the previous procedure are removed gradually by selecting three different polishin...  
WO/2017/222999A1
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The...  
WO/2017/218921A1
In described examples, a chemical mechanical polishing (CMP) system (200) includes a platen (214), a conduit (202) having a heating segment (205) and a delivery outlet (212), and a heater (206) coupled to the heating segment (205) of the...  
WO/2017/179066A1
Disclosed herein is a handheld automatic multifunctional buffing device which comprises a dispenser assembly for dispensing polishing compound from a cartridge, a compressible compartment for storing the polishing compound, a battery ope...  
WO/2017/169124A1
Provided are a substrate polishing device, a method of cleaning the same, and a device for supplying liquid to a substrate polishing device, with which it is possible to suppress agglomeration of a polishing liquid in a pipe. Provided is...  
WO/2017/160129A2
The present invention relates to a laminated sheet polishing method and a laminated sheet polishing device for performing the same and, more particularly, to a polishing method for laminating sheets to be polished and polishing the same ...  
WO/2017/139079A1
Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the s...  
WO/2017/098986A1
The present invention addresses the problem of providing a method for regenerating an abrasive slurry whereby an abrasive slurry showing a high abrasion speed can be efficiently regenerated. The method according to the present invention ...  
WO/2017/033409A1
The present invention is a polishing apparatus equipped with a surface plate on which a polishing fabric is affixed, a polishing head for holding a wafer, a tank for storing an abrasive, an abrasive supply mechanism for supplying the abr...  
WO/2017/011451A1
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.  
WO/2016/190128A1
Provided is a polishing method which achieves an excellent polishing result even when a polishing composition which has been used in polishing an object to be polished is collected and reused. The polishing method according to the presen...  
WO/2016/171018A1
[Problem] To provide a method for producing fine silicon powder which allows for collection of high-purity flaky fine silicon powder from silicon cutting scraps generated during slicing of a silicon ingot, without using a mechanical pulv...  
WO/2016/147968A1
Provided is a recovery method for an abrasive, with which it is possible to recover a highly pure abrasive from a recovery slurry that contains a used abrasive, by a simple method. This recovery method for an abrasive for recovering an a...  
WO/2016/140634A1
Present invention is a board surface (7) polishing application system (1) for wood-based panel furniture materials such as melamine-coated particleboard, MDF, plywood, parquet, fiberboard etc., wherein it contains at least one polishing ...  
WO/2016/103854A1
A method for evaluating abrasive grains used in a slurry for cutting ingots, wherein there are performed an evaluation-solution-preparation step (S1) for causing abrasive grains containing polishing abrasive grains and impurities to diss...  
WO/2016/098286A1
The present invention is a silicon wafer polishing method wherein a used slurry that contains abrasive polishing grains and that has been supplied to a silicon wafer and used for polishing is recovered and the recovered used slurry is ci...  
WO/2016/059142A1
The invention relates to a method for discharging solid pastes for surface working onto a working tool (16), comprising the steps of providing a solid paste (46) for the surface working, which contains abrasives, in particular a solid pa...  
WO/2015/198461A1
[Problem] The present invention provides a centrifuge for separating particles with differences in specific gravity such as when particles with a small specific gravity and particles with a large specific gravity, such as Si hydrates and...  
WO/2014/177898A8
Method for brushing at least one metal tubular member (100), comprising the step of a) abrading the outer surface of said at least one metal tubular member and, simultaneously, the step of b) removing the metal powders produced during sa...  
WO/2015/151408A1
Provided is a workpiece cutting method for cutting a workpiece by forming a wire column with a wire that travels in the axial direction and that is wound in a helical shape between a plurality of wire guides, and supplying a working flui...  
WO/2015/133516A1
The present invention relates to a substrate processing system and a substrate processing method that are capable of flushing the processing liquid supply line. The substrate processing system is provided with a substrate processing appa...  
WO/2015/115652A1
Provided is a regenerating method for used polishing slurry that can sufficiently crush solid content generated by way of centrifugal separation of used polishing slurry, and can thereby suppress damage from occurring to a glass substrat...  
WO/2015/107826A1
This coolant regenerating device (1) is provided with: a first tank unit (11A) at which a subject liquid containing a sludge (S2) is retained and at which a region having more sludge (S2) and a region having less sludge (S2) are formed i...  
WO/2015/097989A1
The present invention provides a slicing method wherein a wire saw is used; and a coolant is supplied to a wire wound around multiple wire guides, and a silicon ingot is pressed against the wire to cut the silicon ingot while the wire is...  
WO/2015/086544A1
A method of processing a super-hard material product (100) having a Vickers hardness of no less than 2000 kg/mm2, the method comprising: mounting the super-hard material product (100) with a surface of the super-hard material product (10...  

Matches 1 - 50 out of 2,957