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Matches 1 - 50 out of 2,852

Document Document Title
WO/2017/222999A1
An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The...  
WO/2017/218921A1
In described examples, a chemical mechanical polishing (CMP) system (200) includes a platen (214), a conduit (202) having a heating segment (205) and a delivery outlet (212), and a heater (206) coupled to the heating segment (205) of the...  
WO/2017/179066A1
Disclosed herein is a handheld automatic multifunctional buffing device which comprises a dispenser assembly for dispensing polishing compound from a cartridge, a compressible compartment for storing the polishing compound, a battery ope...  
WO/2017/169124A1
Provided are a substrate polishing device, a method of cleaning the same, and a device for supplying liquid to a substrate polishing device, with which it is possible to suppress agglomeration of a polishing liquid in a pipe. Provided is...  
WO/2017/160129A2
The present invention relates to a laminated sheet polishing method and a laminated sheet polishing device for performing the same and, more particularly, to a polishing method for laminating sheets to be polished and polishing the same ...  
WO/2017/139079A1
Implementations of the present disclosure generally relate to planarization of surfaces on substrates and on layers formed on substrates, including an apparatus for in-situ temperature control during polishing, and methods of using the s...  
WO/2017/098986A1
The present invention addresses the problem of providing a method for regenerating an abrasive slurry whereby an abrasive slurry showing a high abrasion speed can be efficiently regenerated. The method according to the present invention ...  
WO/2017/033409A1
The present invention is a polishing apparatus equipped with a surface plate on which a polishing fabric is affixed, a polishing head for holding a wafer, a tank for storing an abrasive, an abrasive supply mechanism for supplying the abr...  
WO/2017/011451A1
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka "slurry") and an abrasive pad, e.g., CMP processing.  
WO/2016/190128A1
Provided is a polishing method which achieves an excellent polishing result even when a polishing composition which has been used in polishing an object to be polished is collected and reused. The polishing method according to the presen...  
WO/2016/171018A1
[Problem] To provide a method for producing fine silicon powder which allows for collection of high-purity flaky fine silicon powder from silicon cutting scraps generated during slicing of a silicon ingot, without using a mechanical pulv...  
WO/2016/147968A1
Provided is a recovery method for an abrasive, with which it is possible to recover a highly pure abrasive from a recovery slurry that contains a used abrasive, by a simple method. This recovery method for an abrasive for recovering an a...  
WO/2016/140634A1
Present invention is a board surface (7) polishing application system (1) for wood-based panel furniture materials such as melamine-coated particleboard, MDF, plywood, parquet, fiberboard etc., wherein it contains at least one polishing ...  
WO/2016/103854A1
A method for evaluating abrasive grains used in a slurry for cutting ingots, wherein there are performed an evaluation-solution-preparation step (S1) for causing abrasive grains containing polishing abrasive grains and impurities to diss...  
WO/2016/098286A1
The present invention is a silicon wafer polishing method wherein a used slurry that contains abrasive polishing grains and that has been supplied to a silicon wafer and used for polishing is recovered and the recovered used slurry is ci...  
WO/2016/059142A1
The invention relates to a method for discharging solid pastes for surface working onto a working tool (16), comprising the steps of providing a solid paste (46) for the surface working, which contains abrasives, in particular a solid pa...  
WO/2015/198461A1
[Problem] The present invention provides a centrifuge for separating particles with differences in specific gravity such as when particles with a small specific gravity and particles with a large specific gravity, such as Si hydrates and...  
WO/2015/151408A1
Provided is a workpiece cutting method for cutting a workpiece by forming a wire column with a wire that travels in the axial direction and that is wound in a helical shape between a plurality of wire guides, and supplying a working flui...  
WO/2015/133516A1
The present invention relates to a substrate processing system and a substrate processing method that are capable of flushing the processing liquid supply line. The substrate processing system is provided with a substrate processing appa...  
WO/2015/115652A1
Provided is a regenerating method for used polishing slurry that can sufficiently crush solid content generated by way of centrifugal separation of used polishing slurry, and can thereby suppress damage from occurring to a glass substrat...  
WO/2015/107826A1
This coolant regenerating device (1) is provided with: a first tank unit (11A) at which a subject liquid containing a sludge (S2) is retained and at which a region having more sludge (S2) and a region having less sludge (S2) are formed i...  
WO/2015/097989A1
The present invention provides a slicing method wherein a wire saw is used; and a coolant is supplied to a wire wound around multiple wire guides, and a silicon ingot is pressed against the wire to cut the silicon ingot while the wire is...  
WO/2015/086544A1
A method of processing a super-hard material product (100) having a Vickers hardness of no less than 2000 kg/mm2, the method comprising: mounting the super-hard material product (100) with a surface of the super-hard material product (10...  
WO/2015/081461A1
A minimal quantity lubrication grinding device capable of controllably transporting a nanoparticle jet flow under a magnetically enhanced electric field. The charge quantity of liquid drops is increased through the addition of a magnetic...  
WO/2015/072569A1
A method for manufacturing a glass substrate for a magnetic disk comprises polishing treatment for pressing main surfaces on both sides of a glass substrate by polishing pads, and relatively moving the main surfaces and the polishing pad...  
WO/2015/060265A1
Provided is a magnetic filter device for preventing the reduction in magnetic field strength at positions at a distance from the magnet unit. The magnetic filter device (1A, 1B) is provided with: a processing vessel (6) having a processi...  
WO/2015/004973A1
A scattering plate (4) for scattering a supplied solution supplied via a supply tubing is characterized by the following: being provided with a planar member (41) that can be disposed at a position facing an opening end of the supply tub...  
WO/2014/178280A1
The present invention addresses the problem of providing a diamond abrasive recovery method which enables a high-purity reclaimed polishing material to be obtained from a polishing material slurry which includes used diamond abrasives. T...  
WO/2014/177898A1
Method for brushing at least one metal tubular member (100), comprising the step of a) abrading the outer surface of said at least one metal tubular member and, simultaneously, the step of b) removing the metal powders produced during sa...  
WO/2014/177898A8
Method for brushing at least one metal tubular member (100), comprising the step of a) abrading the outer surface of said at least one metal tubular member and, simultaneously, the step of b) removing the metal powders produced during sa...  
WO/2014/173934A1
A method of lapping a super-hard material product having a Vickers hardness of no less than 2000 kg/mm2, the method comprising: mounting the super-hard material product with a surface of the super-hard material product in contact with a ...  
WO/2014/168113A1
[Problem] To provide a method for regenerating used cerium oxide-based abrasive particles in which treatment can be performed using a small amount of chemicals without the use of fluorides, the method for regenerating used cerium oxide-b...  
WO/2014/162708A1
A slurry regeneration apparatus for regenerating to reusable condition used slurry containing swarf generated when cutting an ingot using a wire saw, the apparatus being provided with: an air supply unit capable of supplying air to the u...  
WO/2014/083590A1
A coolant regeneration method for making coolant, which has been used when cutting an ingot using a wire saw, reusable is characterized in that coolant is supplied respectively into the respective hollow sections of one or multiple hollo...  
WO/2014/074612A1
A method of chemical mechanical polishing (CMP) a diamond containing surface includes providing a slurry including a plurality of particles, at least one oxidizer, and at least one acid, wherein the slurry has a pH ≤ 3 or pH greater th...  
WO/2014/040125A1
A pump for the delivery of particulate material, the pump comprising a storage chamber having a top and a bottom arranged to contain particulate material, the chamber having an outlet port and an inlet aperture, the chamber having an air...  
WO/2014/042494A1
The present invention relates to a method for recycling a waste abrasive material containing ceria, which effectively removes impurities from the waste abrasive material containing ceria and ensures the safety of a recycling process, thu...  
WO/2014/042431A1
The present invention relates to a method for regenerating spent ceria-containing polishing agent, the method allowing the regeneration process, comprising a cleaning process, to be efficient and suppressing re-coagulation of the ceria-c...  
WO/2014/033243A3
The present invention relates to a method for the treatment and/or recycling of sawing slurries, particularly of semiconductor materials, arising in mechanical cutting methods. The sawing slurries contain particles of semiconductor mater...  
WO/2014/017531A1
The purpose of the present invention is to obtain a highly pure reclaimed polishing material from a polishing-material slurry including already used polishing material. A polishing material, namely at least one selected from cerium oxide...  
WO/2014/017534A1
The purpose of the present invention is to obtain a highly pure reclaimed polishing material from a polishing-material slurry including already used polishing material. A polishing material, namely at least one selected from cerium oxide...  
WO/2013/186199A1
The invention relates to a device and a method for separating grinding oil from grinding slurry. The device has an agitation container (1) having an agitator (3) which is movable upward and downward in said container. Furthermore, grindi...  
WO/2013/177251A1
The invention provides a chemical-mechanical polishing composition containing wet-process silica, an oxidizing agent that oxidizes nickel-phosphorous, a chelating agent, polyvinyl alcohol, and water. The invention also provides a method ...  
WO/2013/173998A1
A method and apparatus for pulse electrochemical polishing a wafer are disclosed. The method comprises steps of: establishing a duty cycle table showing all points on the wafer, a removal thickness corresponding to every point and a duty...  
WO/2013/141225A1
[Problem] To provide a polishing material for a lapping process, and a method for manufacturing a substrate using the material, in which polishing speed and surface roughness are simultaneously improved. [Solution] A polishing material f...  
WO/2013/122128A1
The purpose of the present invention is to provide an abrasive regeneration method which, from a used abrasive slurry, can recover an abrasive by an efficient method and can thereafter obtain a high-purity regenerated abrasive by a simpl...  
WO/2013/122123A1
The purpose of the present invention is to provide an abrasive regeneration method which, from a used abrasive, can recover an abrasive by an efficient method and can thereafter obtain a high-purity regenerated abrasive by a simple metho...  
WO/2013/099143A1
Provided is a manufacturing method of an abrasive agent which contains a dispersant and which has, as the abrasive material component, cerium oxide as the main component. This abrasive agent manufacturing method is characterized by invol...  
WO/2013/099666A1
The present invention addresses the problem of providing: a method for separating a polishing material, which is capable of separating and recovering cerium oxide from a used polishing material that is mainly composed of cerium oxide by ...  
WO/2013/099595A1
The present invention relates to an additive for a polishing agent that is added to a repeatedly used polishing agent from time to time between repeated uses, whereby the decrease in polishing characteristics, and particularly polishing ...  

Matches 1 - 50 out of 2,852