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WO/2024/049719A4 |
A fluid delivery system for dispensing slurry directly between a semiconductor wafer and a pad for a chemical mechanical polishing of the semiconductor wafer, the fluid delivery system comprising at least one fluid delivery nozzle affixe...
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WO/2024/083517A1 |
The invention relates to a polishing tool (1) for processing technical surfaces, consisting of a polishing main body (1a) and a polishing-means support (1b), wherein: the polishing-means support (1b) has at least one polishing grain; at ...
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WO/2024/036569A1 |
A polishing system (100), a fluid reuse system (500) and a method of polishing a substrate. The polishing system comprises a catch basin (200), a vacuum device (400), and a polishing fluid recycling module (501) for recycling polishing f...
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WO/2024/031914A1 |
Disclosed in the present invention is a magnetic field assisted powerful grinding minimal quantity lubricant supply and recovery apparatus, comprising a grinding wheel guard assembly, a controllable magnetic field assembly, a controllabl...
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WO/2024/025792A1 |
Exemplary polishing methods for chemical mechanical polishing may include engaging a substrate with a membrane of a substrate carrier. The methods may include chucking the substrate against a substantially planar surface defined by the s...
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WO/2024/015530A1 |
A chemical mechanical polishing system includes a support configured to hold a substrate face-up, a polishing article having a polishing surface smaller than an exposed surface of the substrate, a port for dispensing a polishing liquid, ...
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WO/2023/242481A1 |
The present invention relates to a device (100) for moistening a polishing pad (203). The moistening device (100) comprises measuring means (103, 104, 105, 106, 107, 108, 109, 110) for measuring a physical quantity that is indicative of ...
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WO/2023/229661A1 |
A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing sy...
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WO/2023/214986A1 |
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that ...
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WO/2023/214985A1 |
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that ...
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WO/2023/172336A1 |
A body is brought into contact with a polishing pad of a polishing system, a polishing liquid is supplied to the polishing pad, relative motion between the body and the polishing pad is generated while the body contacts the polishing pad...
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WO/2023/150991A1 |
A vibration grinding machine, comprising a support (1). A grinding mechanism (2) and a first vibration mechanism (3) for driving the grinding mechanism (2) to vibrate are arranged on the support (1), a separation mechanism (4) and a seco...
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WO/2023/137228A1 |
A buffer and self-feeding apparatus includes a polishing device, a pump assembly, a pressurized reservoir, a collapsible cartridge, and a backing plate. The polishing device provides rotational energy to the backing plate as the backing ...
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WO/2023/127279A1 |
Provided is a filter member having a filter that exhibits a long filter life and that can maintain a particle concentration in a particle-containing liquid being filtered. The filter member has a filter that has an opening diameter that ...
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WO/2023/104586A1 |
The present disclosure relates to a floor grinding machine (1) comprising an electric motor (2) which extends along an axis of rotation (x) and which is interconnected to a grinding unit (3). The grinding unit (3) comprises a housing (4)...
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WO/2023/091188A1 |
A CMP system includes a polishing apparatus configured to polish a wafer and roll cleaning apparatus, which includes a rotating roll brush configured to roll against a surface of the wafer during operation, a fluid supply system configur...
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WO/2023/076100A1 |
The invention provides methodology for final finishing of hard surfaces such as diamond surfaces. In this method, a smooth pad having a surface roughness of about 0.2 nm to about 100 nm, having, for example a thickness ranging from about...
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WO/2023/069160A1 |
Exemplary slurry delivery systems may include a slurry source. The systems may include a slurry line coupled with the slurry source. The systems may include a slurry dispensing nozzle. The nozzle may include a lumen having an inlet that ...
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WO/2023/052918A1 |
An apparatus (100) for removing an abrasive element (20) having a perimeter edge (26) delimiting an abrasive surface (22) in a machine (1) for finishing surfaces comprising a support body (10) for removably engaging the abrasive element ...
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WO/2023/022818A1 |
Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid...
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WO/2023/021521A1 |
This invention relates to a system for dispensing of abrasive powder and, water and oil mixture on polishing die for pavilion and crown processing and, table processing of natural and synthetic, single and poly crystal diamond at control...
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WO/2023/011979A1 |
The invention relates to a polishing tool (100) for polishing a spectacle lens (L) in a surface machining process, which comprises a tool body (110) for being rotatably supported about a rotational axis (RA1). The tool body (110) compris...
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WO/2023/003724A1 |
Exemplary substrate edge polishing apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include an edge ring seated on the chuck body. The apparatuses may include a retaining wall disposed radial...
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WO/2023/283582A1 |
Techniques for polishing and repairing a device's surface are disclosed. An applicator is coated with a paste using a CNC machine. The applicator is attached to a candle bit of the CNC machine, and a device is disposed on a staging area ...
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WO/2023/283526A1 |
A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and t...
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WO/2022/271492A1 |
Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein, In particular, embodiments herein relate to a CMP polishing method including urging a ...
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WO/2022/257489A1 |
A double-sided polishing method for an optical lens, where simultaneous polishing of upper and lower surfaces of a lens is implemented by means of arranging grinding tools at locations above and below the lens, and the grinding tools fit...
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WO/2022/257964A1 |
An active fluid jet polishing method having revolution and rotation functions. In the polishing process, a polishing liquid (5) having constant pressure passes through an eccentric nozzle of a polishing tool head (1). Under the action of...
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WO/2022/259833A1 |
The present invention improves uniformity of a supply range of a polishing liquid when supplying the polishing liquid while moving, over a polishing pad, a polishing liquid supply head having a plurality of polishing liquid supply ports....
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WO/2022/256059A1 |
The present disclosure describes an apparatus for chemical-mechanical polishing of a semiconductor wafer. Some embodiments of the present disclosure include a pad, a slurry introduction mechanism, a wafer carrier (e.g., carrying a wafer ...
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WO/2022/241414A1 |
A robotic paint repair system is disclosed. The system optionally including a robotic arm, a first tool system and a fluid removal tool. The first tool system can comprise a first end effector coupled to a first tool configured to contac...
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WO/2022/235588A1 |
A method of processing a substrate includes selectively dispensing a treatment fluid on a die-by-die basis to onto a substrate, and chemical mechanical polishing the substrate after dispensing the treatment fluid. The treatment fluid mod...
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WO/2022/222298A1 |
A grinding liquid supply system (1), a grinding apparatus, an air discharging method, and a grinding method. The grinding liquid supply system comprises: a grinding liquid filter (10); a sensor (11) used for monitoring whether there are ...
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WO/2022/224064A1 |
Methods and related systems include applying a first fluid to a hard surface, grinding the hard surface using at least one structured-abrasive pad while removing the first fluid, applying a second fluid to the hard surface, and scrubbing...
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WO/2022/216554A1 |
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image ...
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WO/2022/187259A1 |
A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the pla...
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WO/2022/187023A1 |
A method for removing material from a substrate includes dispensing an abrasive slurry on a polishing pad, storing an indication of a relative charge on the abrasive agent, contacting a surface of a substrate to the polishing pad in the ...
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WO/2022/170697A1 |
A jet strengthening and polishing integrated apparatus and process for performing surface strengthening on a workpiece to be machined. The jet strengthening and polishing integrated apparatus comprises: a storage (1) for storing water an...
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WO/2022/158538A1 |
[Problem] To provide a recycling method for a water-soluble coolant wherein a used coolant is changed into a condition that is easily separated into an oil phase, a water phase, and solids. [Solution] In a pressure release unit 16, fine ...
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WO/2022/156020A1 |
Disclosed is an adjustable quartz grinding device, comprising a machine body, a robotic arm, and a drive device disposed on the machine body. The drive device is connected to a grinding disc. The robotic arm is slidably mounted on a hold...
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WO/2022/132314A1 |
Embodiments herein include carrier loading stations and methods related thereto which may be used to beneficially remove nano-scale and/or micron-scale particles adhered to a bevel edge of a substrate before polishing of the substrate. B...
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WO/2022/133273A1 |
Provided herein are advanced substrate polishing methods that use a machine learning artificial intelligence (Al) algorithm, or a software application generated using the Al, to control one or more aspects of the polishing process, The A...
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WO/2022/121027A1 |
A high-precision steel-ball single-machine three-water-tank fine grinding production process in the field of 5G communications, in which a 3M4680 steel ball grinder (1) is used to grind steel balls; the steel ball grinder (1) is provided...
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WO/2022/075625A1 |
The present invention provides an abrasive comprising α-alumina particles having a polyhedral crystal structure, wherein the α-alumina particles have an average diameter (D50) of 300 nm to 10 μm and a bulk density of 0.2-0.5 g/mL, a [...
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WO/2022/072066A1 |
A method and apparatus for dispensing polishing fluids and onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP system with a first fluid deliver...
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WO/2022/053709A1 |
The invention relates to a device (8) for polishing and grinding surfaces of a workpiece comprising: a container (2) having an opening, an abrasive material (5) for polishing or grinding, and an element for moving the abrasive material (...
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WO/2022/009700A1 |
This liquid supply device comprises: a rocking arm that can horizontally rock the upper side of a polishing table; a slurry tube that extends in the longitudinal direction of the rocking arm and discharges slurry onto the polishing table...
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WO/2022/005884A1 |
A chemical mechanical polishing system includes a polishing a port to dispense polishing liquid onto a polishing pad and a liquid flow controller to control a flow rate of the polishing liquid to the port, a temperature control system to...
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WO/2022/004295A1 |
A slurry supply device 1 comprises a tank 11. The tank 11 includes a space 11a around a rotation axis RA which crosses a vertical direction. Moreover, the supply device 1 comprises an inflow portion (inflow passage 71) which causes slurr...
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WO/2021/262947A1 |
In a substrate processing system, such as a chemical mechanical system, updated controller configuration data is obtained for a plurality of liquid flow controllers of the substrate processing system. Each of a plurality of liquid flow c...
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