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Patent Searching and Data


Matches 701 - 750 out of 17,406

Document Document Title
WO/2012/026118A1
An acrylic adhesive composition contains: 100 parts by mass of an acrylic polymer (A); 1-70 parts by mass of a (meth)acrylic polymer (B) having a weight average molecular weight of at least 1,000 and less than 30,000; and 1-50 parts by m...  
WO/2012/026203A1
Disclosed is an aggregate of fibrous columnar structures with a high shear bonding strength. Further disclosed is an adhesive member using such an aggregate of fibrous columnar structures. The disclosed aggregate of fibrous columnar stru...  
WO/2012/022493A3
The present invention relates to a one-component, silane-modified, water-, solvent- and plasticizer-free parquet adhesive and also to its use for the bonding of parquet, wood floor coverings and wood-based material boards to all, includi...  
WO/2012/022494A1
The present invention relates to a silane-modified, one-component, water-, solvent- and phthalate-free parquet adhesive and also to its use for the highly dimensionally stable bonding of parquet, wood floor coverings and wood-based mater...  
WO/2012/018232A3
The present invention relates to an aqueous tackifier composition and to a method for preparing same. More particularly, when the aqueous tackifier composition of the present invention is mixed with glue or an adhesive, the physical prop...  
WO/2012/018123A1
An anisotropic conductive adhesive film which comprises: an organic binder that contains a cationically polymerizable substance; 0.01 to 15 parts by mass of a cation generator represented by general formula (1) per 100 parts by mass of t...  
WO/2012/017955A1
Provided is a method for manufacturing a semiconductor wafer provided with an adhesive layer, which includes: a step wherein a photosensitive adhesive layer is formed by applying a photosensitive adhesive to the whole one surface of a se...  
WO/2012/017568A1
Provided are a pressure-sensitive film and tape for semiconductor wafer processing, which are capable of reducing the occurrence of reflow cracks in packages, even if a package is picked up in a state in which a pressure-sensitive adhesi...  
WO/2012/018232A2
The present invention relates to an aqueous tackifier composition and to a method for preparing same. More particularly, when the aqueous tackifier composition of the present invention is mixed with glue or an adhesive, the physical prop...  
WO/2012/018720A3
An adhesive tape includes a backing comprising a foam core layer having opposed first and second major surfaces and pair of water impermeable layers arranged on opposite sides of the foam core layer, a scrim arranged on the backing, and ...  
WO/2012/018720A2
An adhesive tape includes a backing comprising a foam core layer having opposed first and second major surfaces and pair of water impermeable layers arranged on opposite sides of the foam core layer, a scrim arranged on the backing, and ...  
WO/2012/014563A1
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface. The disclosed adh...  
WO/2012/014562A1
Disclosed is an adhesive composition for connecting a first circuit member having first connection terminals on the primary surface, and a second circuit member having second connection terminals on the primary surface, wherein the first...  
WO/2012/011457A1
An anisotropic conductive film comprises an insulating adhesive agent composition comprising a (meth)acrylate monomer composition, a radical polymerization initiator and a film-forming resin and electrically conductive particles disperse...  
WO/2012/005144A1
Disclosed is an anisotropic conductive adhesive in which the conductive particles thereof exist in an insulating adhesive composition without aggregating in cases where magnetic powder particles, such as nickel-coated resin particles, ar...  
WO/2012/001900A1
A wheel protection film (30) is provided with a base material layer (32), and an adhesive layer (34) which is disposed on one surface of the base material layer (32). The adhesive layer (34) comprises a moisture dispersion type adhesive ...  
WO/2011/162125A1
Provided are a display panel equipped with a front plate and a display device in which the problem of striped irregularities around a display area is satisfactorily resolved. A display panel (100) equipped with a front plate has a front ...  
WO/2011/162256A1
A process margin can be improved, and high connection reliability can be achieved. Disclosed is an anisotropic conductive material comprising an adhesive agent composition and electrically conductive particles dispersed in the adhesive a...  
WO/2011/162191A1
It is possible to obtain an adhesive layer by coating and drying an aqueous dispersion adhesive composition. The surface of the adhesive layer has 5 or less per 1 m2 of concave sections having a depth in the thickness direction of 0.2 to...  
WO/2011/152002A1
Provided is a curable composition that uses a polymer having reactive silicon groups of low toxicity, wherein the curable composition is useful as a reactive hot melt adhesive having an excellent balance between storage stability at high...  
WO/2011/148917A1
Disclosed is a pressure-sensitive adhesive sheet which comprises an adhesive composition containing a carboxyl group-containing polymer containing a carboxyl group, a plasticizer, and a metal oxide-containing component containing a metal...  
WO/2011/148586A1
The disclosed terminally unsaturated polyolefin fulfills (1) to (4) below. (1) The meso pentad fraction [mmmm] of propylene chain units or butene-1 chain units is 20-80%. (2) The number of terminal vinylidene groups per molecule is 1.3-2...  
WO/2011/142043A1
A laminated composition includes a first polymer layer having a first surface and a second surface; a second polymer layer having a first surface and a second surface; and an adhesive layer joining the second surface of the first polymer...  
WO/2011/142325A1
Provided is method for evaluating the birefringence of a novel adhesive, also provided are a method for designing and a method for producing an adhesive using the evaluation method, additionally provided is an adhesive obtained by the pr...  
WO/2011/132578A1
Disclosed is an anisotropic conductive film which contains conductive particles, film-forming resin, a radical-polymerizable compound, a curing agent which generates free radicals, and an amine salt obtained from phosphoric acid (meth)ac...  
WO/2011/132749A1
Provided is an adhesive laminate with high-speed peeling properties that change little over time. The adhesive laminate has a backing layer and an adhesive layer, and the adhesive laminate is characterized by the adhesive layer being a l...  
WO/2011/129373A1
Disclosed is a light emitting device and a light-reflective anisotropic conductive adhesive agent capable of maintaining the light emitting efficiency of a light emitting element, preventing the generation of cracks, and achieving high c...  
WO/2011/129372A1
Disclosed is a curable resin composition which exhibits high adhesion, high conduction reliability, excellent crack resistance and increased resistance to thermal shock or similar in high-temperature high-humidity environments. The curab...  
WO/2011/125088A1
Disclosed is a bonding material for bonding together the layers of a fuel cell, said bonding material containing an adhesive resin, conductive particles, and a conductive resin.  
WO/2011/125683A1
Even when using a device that bonds a dicing sheet directly to the underside of a wafer, the disclosed adhesive sheet for semiconductor wafer processing can be easily peeled off after a dicing step is finished and can drastically reduce ...  
WO/2011/125778A1
Disclosed is an adhesive composition which contains (A) a thermoplastic resin that has a weight average molecular weight of 10,000-150,000 and a viscosity at 25˚C of 5-300 poises as dissolved in N-methyl-2-pyrrolidone such that the resi...  
WO/2011/125711A1
Disclosed is a sheet for forming a resin film for a chip, with which a semiconductor device provided with a gettering function is obtained without performing special treatment to a semiconductor wafer and the chip. The sheet has a peelin...  
WO/2011/118367A1
Disclosed is a laminated body that comprises an anti-reflection film on the surface of which a protective film is bonded, said protective film exhibiting excellent temporary adhesion and not easily leaving an adhesive residue after being...  
WO/2011/118488A1
Provided is an adhesive composition which has high adhesiveness but also good detachability, and which has excellent heat resistance. The adhesive composition contains an adhesive component, and a carboxylic compound represented by formu...  
WO/2011/118719A1
Disclosed is an adhesive composition for connecting a first circuit member having a first connection terminal on the main surface, and a second circuit member having a second connection terminal on the main surface, wherein the first cir...  
WO/2011/118506A1
Disclosed are an adhesive composition having high bond strength as well as being easily detachable and having superior heat resistance, adhesive tape using that adhesive composition as well as a semiconductor wafer treatment method using...  
WO/2011/114871A1
Disclosed is a polarizing plate in which a protective film is bonded to one surface of a polarizing film with an aqueous adhesive for the purpose of suppressing unevenness over the entire surface of the polarizing plate, said polarizing ...  
WO/2011/114993A1
Disclosed is a cross-linked polymer particle that can be obtained by a production method provided with a step (a) in which a mother particle formed from a cross-linked polymer having functional groups is brought into contact with an amin...  
WO/2011/111784A1
Disclosed is an adhesive reel which is provided with: a winding core; a pair of side plates provided on both the sides of the winding core so as to face each other; and an adhesive tape, which has a tape-like base material, and an adhesi...  
WO/2011/110384A1
The present invention relates to curable compositions comprising a) at least one organic polymer selected from polyurethanes, polyesters and polyethers, having at least one end group of the general formula (I) -An-R-SiXYZ (I), in which A...  
WO/2011/110305A1
The invention relates to combined radiation- and moisture-curing compounds, which are characterised in particular by rapid curing by means of moisture. The compounds can be used as adhesives, coatings or potting materials. The use of the...  
WO/2011/108490A1
Disclosed is an electrically conductive adhesive tape which can exhibit steady electrical conductivity even when used for a long period or when used under severe environmental conditions. The electrically conductive tape has an adhesive ...  
WO/2011/108442A1
A pressure-sensitive adhesive sheet (1) which is provided with a substrate (11) and a pressure-sensitive adhesive layer (12) and in which multiple through holes (2) that extend from one surface of the sheet (1) to the other surface there...  
WO/2011/105211A1
In order for the disclosed laminated glass lens for glasses to have excellent glare-prevention characteristics, a tetraazaporphyrin compound is combined at a required concentration with an extremely thin adhesive agent layer and is moreo...  
WO/2011/102170A1
Disclosed are a thermally conductive pressure-sensitive adhesive sheet which has a high thermal conductivity, a good flame retardancy and a high electric breakdown strength in a well-balanced manner, a thermally conductive pressure-sensi...  
WO/2011/090046A1
Disclosed is a curable resin composition which can be reduced in the burden on the environment, while securing safety and having extremely high curability at low temperatures. Specifically disclosed is a curable resin composition which c...  
WO/2011/087741A3
The present invention relates to new improved adhesives for binding books and related articles and the production of such adhesives. In particular, the adhesives have reduced content of monomeric diisocyanates or no monomeric diisocyanat...  
WO/2011/083809A1
Disclosed are: a TAC base for cycloolefin polymer bonding, which has extremely excellent air release during the bonding, excellent transparency and excellent bonding workability, while being capable of enhancing the bonding strength with...  
WO/2011/083824A1
Provided is a circuit connecting adhesion film having at least an adhesive layer (A) and an adhesive layer (B), wherein the adhesive layer (A) is an anisotropic conductive layer (11) containing a prescribed adhesive ingredient (3a) and c...  
WO/2011/082327A1
An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight p...  

Matches 701 - 750 out of 17,406