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WO/2021/065595A1 |
Provided is a pressure-sensitive adhesive sheet which has excellent weather resistance over long durations while tight adhesion is kept between each layer, has high initial adhesive strength when being applied, enabling excellent suitabi...
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WO/2021/065518A1 |
Disclosed is an adhesive for semiconductors which comprises a thermoplastic resin, a thermosetting resin, a hardener having a reactive group, and a flux compound having an acid group. The adhesive for semiconductors, when examined by dif...
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WO/2021/065517A1 |
Disclosed is an adhesive for semiconductors, comprising a thermosetting resin, a curing agent, and a flux compound having an acid group. The calorific value at 60-155°C in a DSC curve obtained by differential scanning calorimetry in whi...
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WO/2021/065431A1 |
Provided is an adhesive sheet having an adhesive layer that has a thickness variation of less than 10% and contains an FeCo-type magnetic powder having an average primary particle size of not more than 100 nm and a coercive force Hc of a...
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WO/2021/066480A1 |
The present invention pertains to a coverlay adhesive composition and an FPCB coverlay including same. The coverlay adhesive composition contains an epoxy resin, a rubber resin, a thermoplastic resin, a curing agent, inorganic particles,...
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WO/2021/065593A1 |
Provided is a surfactant composition that can impart excellent polymerization stability, that makes it possible to yield a resin aqueous dispersion having excellent wettability, and that can improve the water resistance and the water-res...
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WO/2021/059602A1 |
Provided is a surface protective film that can be affixed to a resin substrate, the surface protective film making it possible, in a step for hot-pressing a resin substrate to which the surface protective film has been affixed, where the...
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WO/2021/060275A1 |
Provided is an antireflection structure which has excellent antireflection performance and transparency and is reduced in the formation of wrinkles on the surface thereof. In order to solve the problem, the present invention is an anti...
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WO/2021/060299A1 |
The present invention relates to a method for bonding a thread-like adhesive body, wherein a thread-like adhesive body is bonded to an object in a desired shape, said method comprising a process in which the thread-like adhesive body-sid...
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WO/2021/060241A1 |
Provided is an adhesive layer-attached optical film with which deficiency in adhesive in an irregular shape processing section is remarkably suppressed and peeling in a high-temperature and high-humidity atmosphere is remarkably suppress...
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WO/2021/060458A1 |
Provided are a laminate and a hot-melt adhesive label in which curling caused by expansion is suppressed while a texture of pulp paper is retained. A laminate having a porous base-material layer and an adhesive-resin-receiving layer pr...
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WO/2021/054112A1 |
Provided is a retardation film with a primer layer that does not break easily during production and has little unevenness in the retardation. The retardation film with a primer layer according to the present invention includes: a base fi...
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WO/2021/049570A1 |
The present invention relates to a method of manufacturing a semiconductor device using an adhesive sheet having, in the following order, an adhesive layer (X1) containing heat-expandable particles, a base material (Y), and an adhesive l...
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WO/2021/049229A1 |
The present invention provides an optical layered body in which adhesion between an adhesive layer and an adherend is enhanced, and a display device that includes the optical layered body. Provided is an optical layered body comprising a...
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WO/2021/048795A1 |
The present invention relates to a multilayer structure that includes a starch layer (A), an adhesive layer (B), and a base material layer (C) in the stated order, wherein the material constituting the starch layer (A) includes a starch ...
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WO/2021/044631A1 |
A resin paste composition according to the present invention includes: silver-coated particles having non-conductive particles and silver that coats said non-conductive particles; and silver particles. A semiconductor device according to...
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WO/2021/039790A1 |
Provided is an electrically conductive polymer which disperses well in a base resin and is capable of imparting high electrical conductivity. The present invention provides an electrically conductive polymer having at least one constit...
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WO/2021/039555A1 |
The present invention is a room temperature curable resin composition comprising: as the main agent, an organic polymer in which both molecular chain terminals are sealed by a silanol group and/or a hydrolyzable silyl group; and an organ...
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WO/2021/040253A1 |
The present invention relates to: an aqueous flame retardant adhesive composition which is eco-friendly, reduces costs through the replacement of an organic flame retardant, ameliorates layer separation of an adhesive caused by the addit...
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WO/2021/039583A1 |
The present invention provides: a polarizing film laminate which is capable of comprehensively solving the problems of polyene formation, decoloration and red discoloration by heating; and the like. A polarizing film laminate with an a...
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WO/2021/039878A1 |
The purpose of the present invention is to provide adhesive tape of superior drop impact resistance, and to provide adhesive tape that, in addition to having superior drop impact resistance, can be more easily and quickly removed from an...
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WO/2021/039687A1 |
This resin composition contains (A) a thermosetting component and (B) an ion trapping agent, wherein the (A) thermosetting component contains (A1) a maleimide resin, and the total amount of ionic impurities contained in extracted water o...
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WO/2021/039585A1 |
Provided is a polarization film laminate, etc., with which it is possible to comprehensively solve the problems of polyenization, decoloration, and heating reddening. A polarization film laminate comprising a polarization film that inc...
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WO/2021/033613A1 |
A transparent electroconductive sheet 2 with an adhesive layer according to the present invention is provided with: a first adhesive layer 3; a hard coating layer 4 that is arranged on one surface 32 of the first adhesive layer 3 in the ...
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WO/2021/033715A1 |
An electronic component processing film comprising an adhesive layer and a substrate layer, the electronic component processing film satisfying at least one of the following (1), (2), and (3). (1) The adhesive layer includes a terephthal...
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WO/2021/033406A1 |
Provided is an optical layered body that includes a thin polarizer, that has excellent transportability, and that is configured such that a surface protection film and a separator can be easily peeled. This optical layered body comprises...
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WO/2021/029280A1 |
An adhesive sheet (10A) according to the present invention comprises: a first polymer film (12) which has a first surface (11) having a plurality of projections (12p) and a second surface (13) that is on the reverse side of the first sur...
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WO/2021/029261A1 |
[Problem] To provide an adhesive tape comprising a porous base material such that bleed-through can be curbed even if a water-based coating solution is used as the adhesive, while a decrease in sound absorption characteristics can be sup...
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WO/2021/024862A1 |
Provided is a photocrosslinkable adhesive containing a polymer having a benzophenone structure at a side chain thereof. This photocrosslinkable adhesive is a cured product of an adhesive composition containing an ethylenically unsaturate...
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WO/2021/025114A1 |
Provided is a resin particle which makes it possible to bring about increases in the area of contact between the resin particle or a particle comprising the resin particle and an adherend and in the resistance of friction therebetween an...
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WO/2021/024542A1 |
A method for peeling an adherend according to the present invention includes a first step and a second step. In the first step, a bonded body (100) including an adhesive layer (10) and an adherend (20) bonded to the adhesive layer (10) i...
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WO/2021/024864A1 |
Provided is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer has a pressure-sensitive adhesive surface that can be adhered onto an adherend. The pressure-sensitive adhe...
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WO/2021/024541A1 |
A method for removing an adherend according to the present invention comprises a first step and a second step. In the first step, a bonded body (100) which comprises an adhesive layer (10) and an adherend (20) bonded to the adhesive laye...
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WO/2021/024849A1 |
This adhesive tape contains thermally expandable microspheres, the thermally expandable microspheres are configured from a shell and a volatile substance contained in the shell, and said shell is configured from a resin with a glass tran...
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WO/2021/024741A1 |
Provided is a layered article in which an adhesive layer can easily be peeled from a substrate layer using water or another water-based liquid while the substrate layer and the adhesive layer are bonded together in an excellent manner. A...
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WO/2021/024863A1 |
Provided is an adhesive sheet having an adhesive layer. The adhesive layer has a multilayer structure including an A-layer constituting one surface of the adhesive layer, and a B-layer disposed on the rear surface side of the A-layer. Th...
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WO/2021/024850A1 |
This adhesive tape comprises a base material and an adhesive layer disposed on at least one side of the base material. The adhesive layer contains thermally expanding microspheres and an adhesive. The thermally expanding microspheres are...
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WO/2021/026035A1 |
Methods are disclosed to prepare permanent materials that can be coated onto microelectronic substrates or used for other structural or optical applications. The materials are thermally stable to at least about 300°C, curable using a ph...
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WO/2021/025112A1 |
Provided is a resin particle whereby it becomes possible to increase the contact area and the friction resistance between the resin particle or a particle comprising the resin particle and an object of interest and therefore it becomes p...
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WO/2021/020581A1 |
A polyolefin-based resin foam sheet according to the present invention has a degree of MD shrinkage of 5% or less and/or a degree of TD shrinkage of 5% or less when aged at a temperature of 90°C for 1 hour, and has an interlaminar stren...
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WO/2021/020058A1 |
The purpose of the present invention is to provide a technology which enables a linear transmission member to be reliably bonded with an adherend having a surface that is composed of a layer of an inorganic material such as a metal. A wi...
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WO/2021/010171A1 |
Provided are: a bonding film that exhibits sufficient contact heat resistance and high reliability, achieves a preferable bond with respect to a substrate irrespective of the type of electrodes of a semiconductor element, and involves an...
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WO/2021/010487A1 |
Provided is an impact absorption sheet having excellent flex resistance even in a low-temperature environment while maintaining excellent impact absorption capability. This impact absorption sheet includes a resin foam layer, has at leas...
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WO/2021/005201A1 |
The present invention is directed to stabilizer compositions comprising at least one oxalanilide UV absorber, at least one hindered amine light stabilizer (HALS), at least one phenolic antioxidant and optionally further components. Said ...
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WO/2021/005838A1 |
A resin window panel (12) which is to be installed on a vehicle having a vehicle body provided with a peripheral edge part surrounding a window frame part and which is to be mounted on the peripheral edge part via an adhesive containing ...
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WO/2021/006186A1 |
Provided is a technology for improving the radio wave transmissivity of a dielectric member that reflects radio waves without requiring a design change of the dielectric member itself. An anti-reflective material is provided which reduce...
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WO/2021/006898A1 |
A reworkable optically clear adhesive composition, a method for adjoining a light source to a light guide plate by applying a reworkable optically clear adhesive composition to the light guide plate, and a lighting device comprising a li...
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WO/2021/006185A1 |
While an electromagnetic shielding film is being formed on an electronic component, equipped with a body that has a bonding face and an external connection terminal disposed on the bonding face, so as to cover the exterior surface of the...
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WO/2021/006233A1 |
This aqueous emulsion contains an ethylene-vinyl alcohol copolymer (A) as a dispersant and a polymer (B) that contains an ethylenically-unsaturated monomer unit and serves as a dispersoid, wherein the ethylene-vinyl alcohol copolymer (A)...
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WO/2021/002495A1 |
This adhesive tape is characterized by comprising: a plurality of fibers; and binding resin mixed with the plurality of fibers, wherein the fibers are arranged side-by-side in a first direction and extend longitudinally in a second direc...
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