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Patent Searching and Data


Matches 701 - 750 out of 10,388

Document Document Title
WO/2006/046474
Disclosed is a solvent-free, room temperature-curable composition which has excellent water-resistant adhesion, storage stability and curability and does not generate fumes or odors during application. Specifically disclosed is a curable...  
WO/2006/046726
Disclosed is a sheet adhesive which is characterized by consisting of a transparent adhesive layer containing a synthetic resin and a heat ray-cutting layer arranged on the transparent adhesive layer wherein fine particles of a metal oxi...  
WO/2006/046473
Disclosed is a curable composition characterized by containing a bituminous substance (A) and a saturated hydrocarbon polymer (B) having a reactive silicon group which is represented by the following general formula (1): -Si(R13-a)Xa. (I...  
WO/2006/046472
A curable composition which comprises (A) natural asphalt and/or petroleum asphalt and (B) a polyoxyalkylene polymer having a reactive silicon-containing group represented by the following general formula (1): -Si(R13-a)Xa (wherein R1 re...  
WO/2006/043612
This invention provides an electromagnetic steel sheet, which, after lamination, can be bonded by pressing and heating, can realize strain relieving annealing, and has a surface covered with a heat resistant adhesive insulating film, an ...  
WO/2006/040945
An adhesive sheet is provided with a peeling base material (10), a base material film (14), and a first adhesive layer (12) arranged between the peeling base material (10) and the base material film (14). On the peeling base material (10...  
WO/2006/030945
The electroconductive resin composition comprising 1 to 30 mass % of carbon fiber having a hollow structure, an average filament diameter of 50 to 500 nm and an average aspect ratio of 50 to 1000 and 99 to 70 mass % of resin, wherein the...  
WO/2006/019650
Polymer bonding compositions having greater than about 1 milliequivalent primary amine/100 grams of the polymer, more preferably greater than about 3 milliequivalent non-tertiary amine/100 grams of the polymer. Preferably the polymer is ...  
WO/2006/013616
A process for producing an IC chip as thin as 50 µm or less, such as an IC chip having a thickness of 25-30 µm, with high productivity. The process for producing an IC chip comprises a step 1 for fixing a wafer to a supporting plate by...  
WO/2006/014204
An adhesive composition includes a polymer adhesive material and a thickener. The adhesive composition has a stringing length of 9 cm or less and a phase lag of 45 degrees or less or a sag distance of 5 mm or less. The adhesive can be fo...  
WO/2006/013842
A work subject material (W) comprising a metal plate for use in punching and/or curving work and, attached thereto, a surface protection sheet, characterized in that the surface protection sheet comprises a support base material and, sup...  
WO/2006/006512
A two-pack type curable composition in which agent (A) is easy to handle and which has excellent inner-part curability and satisfactory storage stability. The two-pack type curable composition is characterized by being composed of: agent...  
WO/2006/006265
A self-tacky film which includes a base layer and adherent thereto an adhesive layer comprising a carboxylic-acid-modified thermoplastic elastomer, a thermoplastic elastomer not modified with a carboxylic acid, a crosslinking agent, and ...  
WO/2006/001548
The present invention relates to an adhesive compound composition having an appropriate degree of tackiness suitable for a packaging material that can be opened easily and sealed again, a laminated film using such adhesive compound compo...  
WO/2006/002297
Process to generate a water based adhesive by mixing a re-dispersible powder adhesive and water, optionally together with other components, characterized by mixing a re-dispersible powder adhesive, water and optionally other components s...  
WO/2005/121266
Disclosed is an adhesive composition containing a thermoplastic resin, a radically polymerizable compound, a radical polymerization initiator and a radical polymerization modifier. The adhesive composition can be cured sufficiently quick...  
WO/2005/121255
[PROBLEMS] To provide a curable composition which contains a non-organotin catalyst and has satisfactory curability and adhesion. [MEANS FOR SOLVING PROBLEMS] The curable composition comprises an organic polymer (A) having silicon-contai...  
WO/2005/118679
The invention provides an adhesive or sealant composition comprising a cross-linkable polymer, a cross-linking catalyst for the polymer, a rheology controller, a waterscavenger, wherein said cross-linkable polymer is silyl-end capped and...  
WO/2005/116157
A pressure-sensitive adhesive sheet constituted of a base sheet and a pressure-sensitive adhesive layer formed thereon, wherein the pressure-sensitive adhesive layer has concave channels which are open-ended in the extremities of the pre...  
WO/2005/113701
An adhesive composition for sealing containing spacer particles of diameter as large as 110 to 400 μm, which adhesive composition realizes manufacturing of an organic EL apparatus having an adsorbent drying agent layer disposed thereins...  
WO/2005/114270
Disclosed is an optical film with surface protection film wherein a surface protection film composed of a base film and an adhesive layer is so arranged on the surface of an optical film that the adhesive layer is in contact with the opt...  
WO/2005/111169
A liquid or paste-form connecting material capable of realizing connection with high reliability and having, imparted thereto, excellent storability and desirable moisture absorption reflow resistance such that no floating would occur ev...  
WO/2005/111150
[PROBLEMS] To provide a curable composition which can be of the one-pack type which cures at room temperature through reaction with moisture in the air, and gives a cured article excellent in strength, elongation at break, weatherability...  
WO/2005/108500
[PROBLEMS] To provide a curable composition containing a non-organotin catalyst and having good adhesiveness. [MEANS FOR SOLVING PROBLEMS] A curable composition comprising an organic polymer (A) having a silicon-containing group capable ...  
WO/2005/109479
The purposes of this invention are to reduce bonding wire deterioration generated when semiconductor chips are being stacked, and to eliminate variance in semiconductor device heights due to thickness accuracy failure of an adhesive agen...  
WO/2005/108494
[PROBLEMS] Disclosed is a curable composition which exhibits good curability, adhesiveness and weather resistance and is free from coloring while using a catalyst other than organic tin catalysts. [MEANS FOR SOLVING PROBLEMS] Specificall...  
WO/2005/108499
[PROBLEMS] Disclosed is a curable composition which exhibits good curability and good adhesiveness while using a catalyst other than organic tin catalysts. [MEANS FOR SOLVING PROBLEMS] Specifically disclosed is a curable composition cont...  
WO/2005/108520
The invention relates to a two-component adhesive/sealant, comprising a component A, with at least one silane-terminated pre-polymer, at least one catalyst for silane cross-linking and low molecular weight, organofunctional silanes and a...  
WO/2005/108498
[PROBLEMS] Disclosed is a curable composition which exhibits good curability and good adhesiveness while using a catalyst other than organic tin catalysts. [MEANS FOR SOLVING PROBLEMS] Specifically disclosed is a curable composition cont...  
WO/2005/108491
[PROBLEMS] To provide a curable composition having good curability and adhesiveness. [MEANS FOR SOLVING PROBLEMS] A curable composition characterized by comprising (A) an organic polymer containing a reactive silicon group, (B) a titaniu...  
WO/2005/108493
[PROBLEM] Disclosed is a curable composition which exhibits high thixotropy and good curability while using a catalyst other than organic tin catalysts. [MEANS FOR SOLVING PROBLEMS] Specifically disclosed is a curable composition which i...  
WO/2005/108492
[PROBLEMS] Disclosed is a curable composition which exhibits good curability and adhesiveness with use of a non-tin curing catalyst, and hardly suffers from deterioration in mechanical characteristics after storage. [MEANS FOR SOLVING PR...  
WO/2005/105633
An anisotropic conductive film layer is adhered on an anisotropic conductive film holding tape (1). A splice tape (5) is bonded by an adhesive tape (6) on one edge part or both edge parts in a longitudinal direction of a base film (3) wh...  
WO/2005/103185  
WO/2005/103186
A gel adhesive composition comprising a crosslinked water-soluble polymer, water, a moisture retention agent, an amphipathic polymer, a sticky water-insoluble polymer and an electrolyte salt, wherein based on the total amount of composit...  
WO/2005/097909
Transparent curable compositions which can be of the one-pack type and give a cured article excellent in strength, elongation at break, weatherability, and adhesion. One of the curable compositions comprises 100 parts by weight of a viny...  
WO/2005/097934
A curable adhesive composition kit and method of adhering substrates is provided having three basic adhesives and up to three additional optional adhesives. The basic adhesives include: at least one curable silicone end group-containing ...  
WO/2005/095485
A hardenable composition that despite a low viscosity, yields elastomers with a wide range of properties from hardness to softness and yields a transparent hardened matter excelling in weather resistance and thermal stability, which tran...  
WO/2005/096442
An anisotropic conductive film, which is applicable to a narrower pitch of an object to be connected, while maintaining connection reliability, is provided at a low cost compared with the conventional ones. A method for manufacturing suc...  
WO/2005/090510
A resin composition useful as the adhesive for bonding semiconductor chips or heat-dissipating members, characterized by comprising at least (A) a filler, (B) a compound which contains a structure represented by the general formula (1) i...  
WO/2005/087865
A moisture-curable composition having excellent performance required of the adhesives or fixatives for use in assembling electrical or precision appliances for which flame retardancy is required. The composition comprises as essential in...  
WO/2005/087888
A heat-peelable pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive layer can be prevented from being deformed by pressing and which can improve unsusceptibility to chipping during grinding or cutting. After proces...  
WO/2005/087887
A heat-peelable pressure-sensitive adhesive sheet in which the pressure-sensitive adhesive layer can be prevented from being deformed by pressing in a pressing step and which, after processing, enables the processed work to be easily sep...  
WO/2005/087822
A liquid composition containing no solvent, which comprises a low molecular weight organic compound having at least one reactive group (with the proviso that an ionic liquid having a polymerizable group is excluded) and/or at least one p...  
WO/2005/085309
The invention relates to a method for hardening a photosensitive filler material, in particular, an adhesive and a hardening device, whereby a photosensitive material for hardening is irradiated with UV light and a narrow-band UV laser l...  
WO/2005/077996
The invention relates to a tackifier dispersion comprising a resinous material and an emulsifier, the emulsifier being obtainable by a method comprising providing an ester of one or more fatty acids containing at least two conjugated dou...  
WO/2005/078037
Adhesives comprising up to about (40) wt % of an ionomer can be applied at low temperatures and exhibit good bond strength. The adhesives are particularly useful as elastic attachment adhesives.  
WO/2005/076376
[Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode d...  
WO/2005/075552
A thermoplastic resin composition which comprises a thermoplastic resin (A) having a specific moisture permeability, at least one unvalcanized rubber (B) selected from the group consisting of a halogenated product of a copolymer of p-met...  
WO/2005/073334
A pressure sensitive adhesive composition which comprises (A) an organic polymer containing a hydrolyzable silyl group which has 1.3 or more pieces of a hydrolyzable silyl group in one molecule thereof and has a number average molecular ...  

Matches 701 - 750 out of 10,388