Document |
Document Title |
WO/2024/085324A1 |
The present invention relates to a Pickering emulsion composition for heat dissipation, a heat dissipation paste using same, and a method for manufacturing same and, more specifically, provides a Pickering emulsion composition for heat d...
|
WO/2024/086140A1 |
A method to maintain the durability of silicone-thermoplastic composite articles, which comprise flame-retardant free thermoplastic materials and silicone elastomeric materials, with age by incorporating a stabilizing additive in the sil...
|
WO/2024/086136A1 |
The present disclosure relates to hydrosilylation (addition) curable silicone rubber compositions, to silicone elastomeric materials with an improved high temperature (175oC) compression set in accordance with ISO 815-1 method A which ar...
|
WO/2024/086137A1 |
The present disclosure relates to hydrosilylation (addition) curable silicone rubber compositions, to silicone elastomeric materials with an improved high temperature (greater than or equal to (≥175oC)) compression set in accordance wi...
|
WO/2024/086139A1 |
A method to maintain the durability of silicone-thermoplastic composite articles, which comprise flame-retardant thermoplastics and silicone elastomeric materials, with age by incorporating a stabilizing additive in the silicone elastome...
|
WO/2024/085413A1 |
The present invention relates to a curable silicone composition and a cured product thereof, and more specifically, to an optical curable silicone composition and a cured product thereof, wherein the composition can be used to manufactur...
|
WO/2024/084897A1 |
This invention provides a curable organopolysiloxane composition that gives a cured product free from the occurrence of cracks or voids during curing, wherein a necessary and sufficient amount of a material excellent in thermal conductiv...
|
WO/2024/086138A1 |
The present disclosure relates to hydrosilylation (addition) curable silicone rubber compositions, to silicone elastomeric materials with an improved high temperature (greater than or equal to (≥190oC)) compression set in accordance wi...
|
WO/2024/081360A1 |
The present disclosure relates to decreasing migration of materials from thermal management and/or electromagnetic interference (EMI) mitigation materials (e.g., thermal interface materials (TIMs), EMI absorbers, thermally-conductive EMI...
|
WO/2024/077887A1 |
Provided in the present invention are a modified bismaleimide prepolymer, and a resin composition and the use thereof. The modified bismaleimide prepolymer is obtained by reacting a bismaleimide compound with an aminosilicone resin A and...
|
WO/2024/080179A1 |
The present invention addresses the problem of providing a siloxane resin that has improved mechanical strength. As a solution, the present invention provides a siloxane resin obtained by polymerizing component (A), component (B), and co...
|
WO/2024/077435A1 |
A thermally conductive silicone composition comprises: (A) an organopolysiloxane having at least one alkenyl group with 2 to 12 carbon atoms per molecule and having a viscosity at 25 ℃ of from 10 to 10,000 mPa·s; (B) a hydrophobic fum...
|
WO/2024/079186A1 |
The invention relates to a composition obtainable by mixing (a) a crosslinker or a crosslinker mixture, obtainable by reacting (HX(CRc 2)oY(CRc 2)oX(CRc 2)o)4-pSiKp, and (b) metal catalyst and (c) aminosilane.
|
WO/2024/080049A1 |
The present invention is an emulsion composition of a film-forming organopolysiloxane, the emulsion composition being characterized by comprising: 100 parts by mass of (A) an organopolysiloxane which is represented by average composition...
|
WO/2024/075661A1 |
[Problem] To provide: a curable organopolysiloxane composition from which an organopolysiloxane cured product having viscoelastic properties (particularly, reversion characteristics after deformation by an external stress) that are parti...
|
WO/2024/075610A1 |
Provided is a water-based composition which contains a tetrafluoroethylene-based polymer, is capable of forming a shaped article having excellent properties including heat resistance and electrical properties (low coefficient of linear e...
|
WO/2024/076870A1 |
The present invention is a composition comprising a TR-(RMeSiO2/2)n copolymer and a mica, where each R is independently phenyl or methyl. The composition of the present invention is useful as a coating for a metal substrate, wherein the ...
|
WO/2024/075319A1 |
This thermally conductive silicone composition, which is a liquid silicone and is curable, comprises: (A-1) an organopolysiloxane which has an alkenyl group at each terminal of the molecular chain; (A-2) an organopolysiloxane which has a...
|
WO/2024/075472A1 |
A first aspect of the present invention is a liquid addition-curable fluorosilicone composition characterized by comprising: (A) a vinyl group-containing organopolysiloxane represented by general formula (1) and having a viscosity at 25Â...
|
WO/2024/075543A1 |
Provided are: a room-temperature-curable organopolysiloxane composition that makes it possible to bring unpleasant odors and storage stability under control; and an adhesive agent and a coating agent containing the composition. The room-...
|
WO/2024/073886A1 |
A defoamer composition is provided. It comprises I) an oil phase, II) a water phase, III) at least one O/W emulsifier, and IV) at least one W/O emulsifier as co-emulsifier wherein the amount of the water phase is 20-90 wt. %, preferably ...
|
WO/2024/071152A1 |
[Problem] To provide: an electrode-layer-forming composition that can be utilized in a substantially solvent-free process, that can be applied to a variety of steps, including an electrode printing step (printing), that can render the el...
|
WO/2024/070069A1 |
The present invention pertains to a thermally conductive grease composition containing a matrix resin and a thermally conductive filler. The matrix resin contains a liquid dimethylpolysiloxane (A) having a kinematic viscosity of 100-10,0...
|
WO/2024/070200A1 |
A silicone composition contains (A) an organopolysiloxane having at least three (meth)acrylic groups in one molecule, (B) an organopolysiloxane having at least two alkenyl groups in one molecule and not having a (meth)acrylic group, (C) ...
|
WO/2024/070866A1 |
An addition reaction-curable organopolysiloxane composition containing: (A) (A-1) an organopolysiloxane that has a silicon atom-bonded alkenyl group in one molecule and does not have a (meth)acrylic group and (A-2) an organopolysiloxane ...
|
WO/2024/070068A1 |
The present invention pertains to a thermally conductive grease composition containing a matrix resin and a thermally conductive filler. The matrix resin contains: liquid dimethylpolysiloxane (A) having a kinematic viscosity of 100-10,00...
|
WO/2024/065299A1 |
This relates to a one-part condensation curable silicone sealant composition suitable for use as a construction sealant for silicone structural glazing (SSG) applications, in particular for use in curtain wall facade systems. The composi...
|
WO/2024/068268A1 |
The invention relates to a method for producing SiOC-linked, linear polydialkylsiloxane-polyoxyalkylene block copolymers having repeating (AB) units, comprising the reaction of a linear, α,ω-(SiH)-functional polydialkylsiloxane (a) wit...
|
WO/2024/071151A1 |
[Problem] To provide: a composition for forming an electrode layer, the composition being able to be applied by a hot melt process and being capable of forming an electrode layer which exhibits extremely excellent adhesion and followabil...
|
WO/2024/067719A1 |
The present invention relates to a compound of formula (I), wherein the variables of n, m, p, q, R1, R2, R3, R4 and R5 therein are as defined in the description. The compound of formula (I) is photopolymerizable; and after being photocur...
|
WO/2024/071150A1 |
[Problem] To provide: a composition for forming an electrode layer, the composition being capable of forming, through a curing reaction, an electrode layer which has a low temperature dependence of the viscoelasticity, while exhibiting e...
|
WO/2024/067229A1 |
Provided is a polyamide composite material, which comprises, in parts by weight, 77.2-94.8 parts of PAXI/XT, 5-20 parts of semi-crystalline polyamide, and 0.2-0.8 parts of organosilicone elastomer powder containing a methacryloyloxy func...
|
WO/2024/070556A1 |
The present invention provides a millable silicone rubber compound comprising (A) an organopolysiloxane crude rubber, (B) a reinforcing silica that has a specific surface area of 50-450 m2/g, (C) a partial hydrolysate of an organoalkoxys...
|
WO/2024/070199A1 |
This heat-curable and photocurable silicone composition comprises: (A) an organopolysiloxane having at least three (meth)acrylic groups per molecule; (B) an organopolysiloxane having at least two alkenyl groups per molecule and having no...
|
WO/2024/062392A1 |
A composition includes a non-fluorinated thermoplastic and a branched silsesquioxane polymer having terminal -Si(R3)3 groups and units having formula (I), in which * represents a bond to another silicon atom in the branched silsesquioxan...
|
WO/2024/063066A1 |
[Problem] To provide: an organopolysiloxane that has a good fine patterning property (including coatability), alkali solubility, and high energy ray curability and that forms a cured film having high transparency and adequate mechanical ...
|
WO/2024/060459A1 |
Embodiments of the present invention provide modified silicone rubber and a preparation method therefor. A raw material composition of the modified silicone rubber comprises a raw material capable of forming silicone rubber and a raw mat...
|
WO/2024/063067A1 |
[Problem] To provide an organopolysiloxane that has good fine patterning property (including coatability), alkali solubility and high energy ray-curability and, when cured, that is capable of forming a cured film having high transparency...
|
WO/2024/062659A1 |
Provided is a release agent/lubricant composition which exhibits excellent lubricity and release properties, exhibits high heat resistance, prevents seizure between a material to be processed and a mold, and exhibits good release propert...
|
WO/2024/064735A1 |
The present invention relates to a composition comprising a TPh resin and a TPh‑poly(phenylmethylsiloxane) copolymer. The composition is useful as a coating for metal substrates, wherein the coating has excellent clarity, adhesion, res...
|
WO/2024/063070A1 |
[Problem] To provide a multi-part sponge-forming silicone rubber composition which has excellent storage stability and is agitated to form a sponge having fine and uniform open cells. [Solution] Provided is a multi-part composition compr...
|
WO/2024/058210A1 |
One embodiment of the present invention relates to a sliding composition film or a method for producing a sliding composition; the sliding composition contains an ethylene/α-olefin/non-conjugated polyene copolymer (A), a propylene rando...
|
WO/2024/057678A1 |
A thermally conductive composition according to the present invention contains: as component A, 100 parts by mass of an addition-curable organopolysiloxane that has a kinematic viscosity of 100 to 3,000 mm2/s at 25°C; as component B, 60...
|
WO/2024/057924A1 |
[Problem] To provide: a curable silicone composition having UV-light delayed curability, transparency, and low yellowing under high temperature conditions, and being capable of exhibiting high adhesive strength even to a base material, s...
|
WO/2024/056948A1 |
The invention relates to an additive manufacturing method for producing a silicone elastomer article, the method comprising the following steps: i) providing a photocrosslinkable silicone composition X and an irradiation source, said pho...
|
WO/2024/057911A1 |
This conductive silicone rubber composition contains conductive particles (A1), a silicone compound (B) that has an alkenyl group, a silicone compound (C) that has a hydrosilyl group, and a hydrosilylation catalyst (D). At least one of t...
|
WO/2024/056507A1 |
The invention relates to curable compositions based on polyorganosiloxanes with silicon-containing terminal groups, a polymer having at least one silane-functional group, and optionally at least one curing catalyst. The invention also re...
|
WO/2024/055232A1 |
Embodiments of the present disclosure are directed to polycarbonate-based compositions comprising, based on a total weight of the polycarbonate-based composition, 15 wt%to 35 wt%of polycarbonate, 50 wt%to 75 wt%of polysiloxane-polycarbon...
|
WO/2024/058165A1 |
The purpose of the present invention is to provide a silicon oxide gel dispersion that has excellent ease of handling. The present invention is a silicon oxide gel dispersion that includes a silicon oxide gel and a solvent, wherein the v...
|
WO/2024/056569A1 |
The present invention relates to a composition comprising a polysiloxane.
|