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WO/2022/045087A1 |
Provided is an elastic wave device that suppresses degradation of resonance characteristics. The elastic wave device is provided with a piezoelectric layer and a pair of electrodes. In a cross section including a first direction and a se...
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WO/2022/044869A1 |
Provided is an elastic wave device that is able to increase element capacity, and that is capable of spurious suppression.　This elastic wave device 10 of the present invention comprises: a piezoelectric layer 16 that has a first main s...
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WO/2022/044810A1 |
Provided is a composite elastic wave filter device that can expand the attenuation amount of the low frequency side in an elastic wave filter having a frequency range with a high passband, and that can improve isolation characteristics.ã...
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WO/2022/047406A1 |
An acoustic resonator is fabricated by bonding a first piezoelectric plate to a substrate and spans locations for a first and second cavity in the substrate. A top surface of the first piezoelectric plate is planarized to a first thickne...
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WO/2022/044397A1 |
Provided are a resonance device, a collective board, and a resonance device manufacturing method with which it is possible to suppress propagation of noise through a holding portion.　A resonance device 1 is provided with: a MEMS board ...
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WO/2022/044655A1 |
A high-frequency module according to the present invention is provided with: a structured body (1); a filter element (2) arranged on the structured body (1); and a switch element (3) and an impedance element (4) connected to the switch e...
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WO/2022/044580A1 |
A high frequency circuit (1a) comprises: an antenna terminal (101); a filter (10) the passband of which is variable; and a surface-mounted type of first impedance element connected between the antenna terminal (101) and the filter (10), ...
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WO/2022/042756A1 |
Disclosed in the present invention is a crystal filter element, comprising: multiple bulk resonators, a first input end point, a second input end point, a first output end point, and a second output end point. The multiple bulk resonator...
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WO/2022/045307A1 |
Between a piezoelectric layer and a support, a cavity which overlaps an IDT electrode in a see-through plan view is formed. An intersection region in which first electrode fingers overlap second electrode fingers has a central region and...
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WO/2021/013574A9 |
An electro acoustic filter component with improved acoustic and/or electro acoustic performance is provided. The component comprises a piezoelectric material (PM) the sides of which are plane and preferably free from chipping defects. Th...
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WO/2022/046392A1 |
A package (200) that includes an integrated device (201), an integrated passive device (203) and a void (215). The integrated device (201) is configured as a filter. The integrated device (201) includes a substrate (210) comprising a pie...
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WO/2022/042463A1 |
The present invention relates to the technical field of filters, and relates in particular to a method for optimising the out-of-band suppression of a filter, and a filter, a multiplexer, and a communication device. In the present method...
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WO/2022/040991A1 |
Disclosed is a preparation method for a Bragg acoustic wave reflective layer structure, comprising preparing, on a substrate, each reflective layer group formed by sequentially stacking a first dielectric layer and a second dielectric la...
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WO/2022/044524A1 |
The present invention pertains to: a first band, for FDD, constituted by a first downlink operation band and a first uplink operation band; and a second band, for FDD, constituted by a second downlink operation band and a second uplink o...
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WO/2022/045088A1 |
Provided is an elastic wave device that suppresses degradation of resonance characteristics. The elastic wave device is provided with a piezoelectric layer and a plurality of electrodes including at least a pair of electrodes facing each...
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WO/2022/042464A1 |
The present invention relates to the technical field of filters, and relates in particular to a temperature compensating filter optimization method, a temperature compensating filter, a multiplexer, and a communication device. In the pre...
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WO/2022/045086A1 |
Provided is an elastic wave device which suppresses a deterioration in resonance characteristics. This elastic wave device comprises a piezoelectric layer, a pair of electrodes, and a protective film. When the upper surface of the protec...
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WO/2022/039210A1 |
Provided is an elastic wave device that is not prone to deterioration of device characteristics.　An elastic wave device 1 is provided with an IDT electrode 7 on a piezoelectric film 6 the Z-axis crystal direction of which differs from ...
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WO/2022/039897A1 |
Certain aspects of the present disclosure provide a bulk acoustic wave (BAW) resonator having a substrate with a heatsink region and an electrical insulator region. An example electroacoustic device generally includes a piezoelectric lay...
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WO/2022/037572A1 |
A bulk acoustic resonator and a manufacturing method therefor. The resonator comprises a base, an acoustic lens, a bottom electrode, a piezoelectric layer, a top electrode, and a covering layer, which at least covers a non-electrode conn...
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WO/2022/035600A1 |
Certain aspects of the present disclosure generally relate to a filter, such as an acoustic resonator filter. An example filter generally includes a first series resonator coupled between a first port of the filter and a second port of t...
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WO/2022/032699A1 |
Disclosed are a manufacturing process of an acoustic resonator, and an acoustic resonator. The acoustic resonator comprises a substrate, an acoustic mirror, and a resonant thin film layer composed of a bottom electrode layer, a piezoelec...
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WO/2022/034823A1 |
The present invention improves heat dissipation. A high-frequency module (100) is provided with a mounting substrate (130), a first transmission filter (11, 12), a second transmission filter (13, 14), a resin layer (15), and a shield lay...
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WO/2022/034716A1 |
This circuit board has mounted thereon an electronic component and is provided with: a base board having a first surface on which the electronic component is mounted, a second surface opposite to the first surface, and a side surface pro...
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WO/2022/036299A1 |
The disclosure is directed to an electronic device with a solder interconnect and multiple material encapsulant. The electronic device (10) includes a die last assembly with the die (14) assembled to an electronic packaging substrate (12...
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WO/2022/028402A1 |
The present disclosure relates to a bulk acoustic wave resonator assembly, which comprises: a substrate; at least two resonators, the at least two resonators being bulk acoustic wave resonators, and said resonators being stacked in a thi...
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WO/2022/028403A1 |
The present disclosure relates to a semiconductor structure, comprising: k filters, k being a natural number not less than 2, wherein each of the k filters comprises Mi bulk acoustic resonators, and each of the Mi bulk acoustic resonator...
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WO/2022/028080A1 |
Embodiments of the present application provide a wafer-level surface acoustic wave filter and a packaging method. The surface acoustic wave filter comprises a wafer, an electrode layer, a supporting enclosing wall, and a cover plate, whe...
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WO/2022/025039A1 |
Provided is an elastic wave device that enables suppression of ripples between a resonance frequency and an anti-resonance frequency.　An elastic wave device 1 is configured such that: an IDT electrode 7 is provided on a piezoelectric s...
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WO/2022/021468A1 |
Disclosed is an interdigital electrode structure. The interdigital electrode structure is arranged on a substrate, wherein the tail ends of interdigital electrodes in the interdigital electrode structure are subjected to ion implantation...
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WO/2022/025235A1 |
Provided is an elastic wave element having excellent electrical characteristics. An elastic wave resonator comprises: a piezoelectric substrate including a piezoelectric body and an IDT electrode; a support substrate; and a first interme...
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WO/2022/022438A1 |
The present invention relates to the technical field of filters, and relates in particular to a filter designing method, a filter, a multiplexer, and a communication device. The method is used to appropriately configure, according to des...
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WO/2022/024807A1 |
An elastic wave filter (1) comprises: a first input terminal (120) and a first output terminal (130); and a longitudinally-coupled resonation device (M1) connected between the first input terminal (120) and the first output terminal (130...
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WO/2022/022264A1 |
A surface acoustic wave resonator and a production method therefor. The surface acoustic wave resonator comprises: a substrate (1) and a piezoelectric layer (2) configured on the substrate (1); interdigital transducers (3), configured on...
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WO/2022/024440A1 |
This resonator is provided with a vibrating portion, a holding portion provided in at least a portion of the perimeter of the vibrating portion, and a holding arm provided between the vibrating portion and the holding portion, wherein: t...
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WO/2022/024438A1 |
This resonator is provided with a vibrating portion, a holding portion provided in at least a portion of the perimeter of the vibrating portion, and a holding arm provided between the vibrating portion and the holding portion, wherein: t...
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WO/2022/026507A1 |
Systems and methods are disclosed for improving broad bandwidth performance of CMUT elements and arrays using negative capacitance-based impedance matching. The disclosed systems and methods provide a controllable compromise balance betw...
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WO/2022/025040A1 |
Provided is an elastic wave device capable of suppressing ripples at or around the upper end of a stop band.　An elastic wave device 1 in which IDT electrodes 7 are provided on a piezoelectric substrate 2, the IDT electrodes 7 having an...
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WO/2022/024880A1 |
This piezoelectric device comprises a piezoelectric element, a mounting plate, an electronic element incorporating a temperature sensor, a substrate on which the piezoelectric element is mounted with the mounting plate therebetween and o...
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WO/2022/021893A1 |
Provided is a filter assembly based on the combined application of SAW-BAW technologies. The filter assembly comprises a first acoustic wave filter and a second acoustic wave filter, which are coupled to a common node. The first acoustic...
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WO/2022/025147A1 |
Provided is an elastic wave resonator comprising a piezoelectric body, and IDT electrodes and a pair of reflectors which are positioned on the piezoelectric body. The IDT electrodes include a plurality of first electrode fingers arrayed ...
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WO/2022/019072A1 |
An acoustic wave filter (1) is provided with: a first filter circuit (10) which has a prescribed frequency band as a passband, and which is disposed on a first pathway (r1) linking a first signal terminal (T1) and a second signal termina...
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WO/2022/017486A1 |
An adjustable resonator and a manufacturing method therefor. The resonator comprises: resonant cavities in a substrate, the resonant cavities at least including a central first resonant cavity and a peripheral second resonant cavity; a f...
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WO/2022/019169A1 |
Provided is a ladder-type filter in which the deterioration of insertion loss due to unnecessary waves is unlikely to occur.　A ladder-type filter according to the present invention comprises: a piezoelectric substrate 2; and a series a...
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WO/2022/019170A1 |
Provided is an elastic wave device that can suppress a response by an unwanted wave.　An elastic wave device 10 is provided with: a piezoelectric layer 14 that is made of one of lithium niobate and lithium tantalite and that has a first...
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WO/2022/016536A1 |
An ultrasonic sensor (500, 1200) preparation method, an ultrasonic sensor (500, 1200), and an electronic device. The method comprises: forming an entire surface electrode (5230, 1224) on a substrate layer (510, 1210), a first surface of ...
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WO/2022/019284A1 |
According to the present invention, a filter (10) comprises a series resonator (S2) or vertically coupled resonator (D1) arranged on a path connecting a first input/output terminal (110) and a second input/output terminal (120), and a pl...
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WO/2022/014495A1 |
The present invention provides an acoustic wave device that is capable of inhibiting ripples in the frequency characteristics.　This acoustic wave device 1 comprises: a support substrate; a piezoelectric layer 14 that is provided upon t...
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WO/2022/014608A1 |
Provided is an elastic wave device that enables suppression of ripples in frequency response characteristics.　This elastic wave device 10 comprises: a support substrate 13; a piezoelectric layer 14 provided on the support substrate 13;...
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WO/2022/014493A1 |
Provided is an elastic wave device that can increase heat dissipation in a situation in which a cavity is provided to a support substrate.　An elastic wave device 1 according to the present invention comprises: a cavity 10; a support su...
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