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WO/2024/004728A1 |
Disclosed is a circuit structure that makes it possible to directly draw heat without requiring a busbar to be routed from a terminal section of a heat-generating component, and to build a heat dissipation route for a heat-generating com...
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WO/2024/003325A1 |
The invention relates to a switching cell (100) comprising: - at least one power module (102) comprising a housing (305), a switch (306, 308) in the housing (305), and a pin (312) for controlling the switch (306, 308), the control pin (3...
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WO/2024/004460A1 |
[Problem] To provide a novel structure of a usage state of a fiber body. [Solution] This unit has a housing having a spiral groove formed such that a cooling liquid flows along the circumferential direction, a rotary-electric machine tha...
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WO/2024/004655A1 |
This cooler comprises: a housing that includes an opening, an inner space section, and a bottom section; and a partition wall that extends up from the bottom section in a first direction and is accommodated in the inner space section. Th...
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WO/2024/004324A1 |
The present disclosure provides an electronic control device in which the heat dissipation property of electronic components is improved while suppressing radiation noise. This electronic control device comprises: a circuit board 110 whi...
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WO/2024/001199A1 |
Embodiments of the present application provide a vapor chamber, a heat sink, and an electronic device. The vapor chamber comprises: a bottom plate, a top plate, side plates and a backflow piece. The bottom plate comprises a first heat di...
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WO/2024/001042A1 |
Provided in the present invention is a sliding-rail cabinet. The cabinet comprises a cabinet body, wherein a plurality of apparatus boxes are arranged in the cabinet body, and two ends of each apparatus box are connected to the cabinet b...
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WO/2024/005976A1 |
A computing system and related methods are described. The computing system includes a heat-generating component. The computing system includes an evaporation plate thermally connected to the heat-generating component. The computing syste...
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WO/2023/248811A1 |
One embodiment of the present disclosure provides a wire harness that makes it possible to suppress the damage of an electric wire member due to a twist caused in association with the opening/closing of an opening/closing body. The wire ...
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WO/2023/248235A1 |
The present invention provides an electronic component enclosure (100) and a method (1100) of assembling thereof. The enclosure (100) comprises a casing (102) for accommodating Printed Circuit Board (PCB) (104) having electronic componen...
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WO/2023/248566A1 |
In the present invention, an electric power conversion device comprises a semiconductor module that has a built-in semiconductor element, a flat tube in which a coolant flows, and a pair of headers that are mounted to both ends of the fl...
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WO/2023/250109A1 |
A computing device includes a housing having a plurality of apertures therein, an active cooling system, and at least one of a plurality of membranes or a plurality of valves. The membranes and/or valves are coupled with the apertures. E...
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WO/2023/248999A1 |
A semiconductor module according to one aspect of the present disclosure comprises a semiconductor device, a cooling plate, and a flow path forming member. The cooling plate is provided on one main surface of the semiconductor device. Th...
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WO/2023/249691A1 |
The disclosed technology is generally directed to vapor-air transition detection for two-phase liquid immersion cooling. In one example of the technology, a first device is cooled via two-phase liquid immersion cooling, such that the fir...
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WO/2023/247219A1 |
A circuit board arrangement (14) comprises a first circuit board section (140A), a second circuit board section (140B), and a standoff element (2) comprising a body (20) having a first end (21) and a second end (22). The standoff element...
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WO/2023/249381A1 |
An electronic device according to various embodiments disclosed in the present document may comprise: a first housing; a second housing rotatably connected to the first housing; a display disposed on the front surface of the electronic d...
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WO/2023/247063A1 |
The invention relates to a cooling system (1) for the liquid immersion cooling of electronic components (2), comprising - a container (3) having a container wall (31) which, in the interior, can be filled with two-phase heat transfer flu...
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WO/2023/246717A1 |
Disclosed are a liquid cooling system control method and apparatus, a device, and a system, relating to the field of computers. The method comprises determining a cooling policy according to energy consumption parameters of a heat dissip...
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WO/2023/249767A1 |
A power controller allocates input power to a datacenter between computing power for computing services, backup power, and overhead power for overhead systems. The power controller reallocates the overhead power and/or the backup power t...
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WO/2023/248989A1 |
A cooling device, according to one embodiment of the present disclosure, is for cooling heating elements, and comprises: a housing; a first flow path; and a second flow path. The housing has an inflow port and an outflow port for a refri...
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WO/2023/246095A1 |
The present application provides a heat dissipation device and communication equipment comprising same. The heat dissipation device comprises: a substrate (100); and a plurality of heat dissipation fins (200), at least one surface of eac...
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WO/2023/246229A1 |
A liquid cooling device, comprising: a housing (1) having an accommodating chamber (11) and a cooling component (2) accommodated in the accommodating chamber (11). The housing (1) has assembly seams (12) being in communication with the a...
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WO/2023/245360A1 |
The present disclosure relates to a heat dissipation part and a manufacturing method therefor, a middle frame part, a housing part, and a terminal device. The heat dissipation part comprises a heat dissipation assembly and a heat dissipa...
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WO/2023/248707A1 |
The purpose of the present invention is to provide an electric compressor capable of improving assembling workability of an inverter including a switching element. An electric compressor (1) is provided with an inverter (3) that has a sw...
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WO/2023/246877A1 |
A heat dissipation system and a medical system. The heat dissipation system comprises a circulation pipeline (40) and a cooling device (30). The circulation pipeline (40) is used for conveying a cooling medium to a medical system. The me...
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WO/2023/249000A1 |
A semiconductor module according to one aspect of the present disclosure comprises a first substrate, a second substrate, and a cooler. The first substrate is provided with a first semiconductor element on one main surface thereof, and i...
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WO/2023/248704A1 |
[Problem] To provide an electric compressor that makes it possible to stably press and thereby fix switching elements to a heat sink. [Solution] An electric compressor 1 comprising an inverter 3 that has switching elements 5 and supplies...
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WO/2023/247854A1 |
The invention relates to a high-voltage DC electrical distribution panel for the installation of two electromechanical power contactors either in series or in parallel. Locations for the installation of the chambers for the fixed and mob...
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WO/2023/243025A1 |
Provided is a programmable logic controller that can maintain waterproofness or dustproofness. A base unit (1) includes a substrate (10), a base case (12) where the substrate (10) is housed, and a holding section (14) where a connection ...
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WO/2023/244120A1 |
There is disclosed an energy system (1) for data centre (10), the energy system (1) including: - a water circuit (2) for cooling and/or condensing a cooling medium, the cooling medium provided in a closed loop (13) in the data centre (10...
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WO/2023/243184A1 |
Provided is a cooling device for cooling an object to be cooled, the cooling device being characterized by having a circulation system for circulating a refrigerant for cooling the object to be cooled, wherein: the circulation system is ...
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WO/2023/240614A1 |
A display module and an electronic device. The display module comprises a display film layer (1), a heat dissipation film layer (2), a support plate (3), and elastic heat-conducting sheets (4). Each of the display film layer (1) and the ...
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WO/2023/243137A1 |
An electric switchboard according to the present disclosure includes: a power converter housed in a casing; an intake port and an exhaust port; a fan that causes air in the casing to flow from the intake port to the exhaust port; a first...
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WO/2023/241580A1 |
Provided in the present application are a heat dissipation device, a circuit board, and a communication base station. The heat dissipation device comprises a substrate (100), a first heat dissipation fin (200) and a second heat dissipati...
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WO/2023/241824A1 |
A passive fluid cooling system is provided including an immersion cooling tank including a volume of fluid and a plurality of fluid cooling channels attached to exterior sidewalls of the immersion cooling tank. The flow of the fluid thro...
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WO/2023/243194A1 |
This heat exchanger (1) comprises a flow path forming plate (10) and a temperature adjustment plate (20). The flow path forming plate (10) has a flow path surface (11) and a groove (13) recessed into the flow path surface (11). The tempe...
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WO/2023/244781A1 |
A power supply module including a first substrate, first electronic components on a principal surface of the first substrate, second electronic components above the first electronic components, and a heat sink located above the first ele...
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WO/2023/241419A1 |
Provided in the embodiments of the present disclosure are an immersion liquid cooling device and a liquid cooling system. The liquid cooling device comprises: a cabinet, which comprises a first cavity and a second cavity, which is integr...
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WO/2023/244663A1 |
Thermal management systems and methods are provided for managing thermal energy of a power converter and components thereof. In one example, a cooling jacket is coupled to a circuit board, where the cooling jacket has an inner surface th...
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WO/2023/242992A1 |
A control panel according to an embodiment comprises a housing, an article placement board, and a pull-out mechanism. The front surface of the housing is open. The article placement board is disposed along the front-back direction inside...
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WO/2023/244297A1 |
Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generat...
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WO/2023/242723A1 |
The power conversion electronic appliance (1) for electric or hybrid vehicles, comprises: a printed circuit board (2); a plurality of power components mounted on said printed circuit board (2) and comprising a MOSFET device (3) of the SM...
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WO/2023/240913A1 |
The present application provides an air conditioning unit, a data center machine room, and a control method for the air conditioning unit. The air conditioning unit comprises a heat exchange module (11), a condensation module (12), a pre...
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WO/2023/243400A1 |
This electrical junction box comprises a housing to which a relay (400) that emits heat when electrified is provided. The electrical junction box comprises a cover member (40) that covers the surroundings of a terminal (405) that is prov...
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WO/2023/243082A1 |
This electric power conversion unit is provided with a housing, a plurality of fans, a heat sink, and a plurality of semiconductor elements. The fans cause an air flow inside the housing. The heat sink forms an air flow passageway upstre...
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WO/2023/243799A1 |
A display device is disclosed. The display device comprises: a display panel; a frame positioned behind the display panel and coupled to the display panel; and a communication box which is adjacent to one side of the frame, and which is ...
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WO/2023/243038A1 |
The present invention improves heat dissipation performance. This vehicle-mounted electronic control device comprises a circuit board, a first cover, a second cover, and a heat-conductive member. The circuit board is mounted with an elec...
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WO/2023/240395A1 |
A wiring adaptor passes along a communication bus to a neighboring electronic device while providing wiring terminals to the communication bus. The wiring adaptor includes a housing and a plurality of communication passthroughs that exte...
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WO/2023/243588A1 |
The light source module according to the present invention comprises: a board on which a light source is mounted; a board attachment part to which the board can be attached; a heat dissipation unit that dissipates heat transmitted via th...
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WO/2023/244302A1 |
A rack security system includes a locking mechanism connected to a server. The locking mechanism is configured to lock onto the busbar of a rack. When the locking mechanism is locked to the busbar, the locking mechanism may prevent remov...
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