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WO/2023/228278A1 |
A rack (110) comprises a first to a fourth column members (11 to 14), and a first and a second guide members (15A, 15B). A casing of an electric device (20) has a first and a second side surfaces in the width direction that are respectiv...
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WO/2023/226608A1 |
Provided in an embodiment of the present application is an electronic device, comprising at least a shell and a first display. The shell comprises a first frame body, a second frame body, and a hinge. The hinge is connected to the first ...
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WO/2023/227338A1 |
For an electronic assembly (1), in particular an electronic power assembly for hybrid vehicles or electric vehicles, comprising a printed circuit board (10), further comprising an electronics unit (20), in particular a power electronics ...
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WO/2023/227485A1 |
There is provided an industrial monitoring apparatus, comprising: a housing having walls, a top and a base; a computer assembly arranged in the housing, the computer assembly arranged to be conductively cooled and comprising: a computer ...
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WO/2023/227665A1 |
A base module (2) has a base-connection surface (13) with a first opening (22), wherein a protrusion (49) is formed so as to run around the first opening (22). A function module (3) has a function-connection surface (15) with a second op...
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WO/2023/227705A1 |
The invention relates to a frequency converter kit (100) comprising: - base units (1) comprising: - a first plug-in connector by means of which the base units (1) are connectable to an AC voltage grid; - a power electronics system; - a h...
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WO/2023/229618A1 |
A chassis is provided for a circuit board, the chassis having a heatsink. The chassis includes a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis. The plurality of fins are organize...
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WO/2023/226977A1 |
Provided in the present application are a heat exchange device and a heat exchange system. The heat exchange device has a first heat exchange mode and comprises a shell, a partition plate, an evaporator, and a compressor, and the partiti...
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WO/2023/229026A1 |
This cooling unit has: a first cold plate and a second cold plate; an inflow pipe; and an outflow pipe. The first cold plate and the second cold plate are respectively disposed on both sides of a heat-generating component in a first dire...
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WO/2023/228438A1 |
In the present invention, a plate-shaped heat dissipation fin installed on the main surface of a base plate comprises: a fin root part which extends from one end to the other end of the plate-shaped heat dissipation fin in the width dire...
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WO/2023/222846A1 |
The present invention is related to an apparatus and a process for distilling a solvent using the heat released by a semiconductor configured to be working at a predetermined operational temperature and pressure.
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WO/2023/221682A1 |
The present application relates to the technical field of communication. Disclosed are a circuit board module (210) and a communication device (1), with the aim of improving the heat dissipation performance of the circuit board module (2...
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WO/2023/221289A1 |
An air duct member (1) and a household appliance comprising same. The air duct member (1) comprises an air inlet channel (11) and air outlet channels (12) that are communicated with each other; the number of the air outlet channels (12) ...
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WO/2023/224015A1 |
This cooling structure comprises: an outer packaging material provided with an inlet and an outlet for a refrigerant; and an inner core material disposed in the outer packaging material. The inner core material has a shape having project...
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WO/2023/224254A1 |
A PCB cooling apparatus, for cooling a PCB by contacting one surface of the PCB, according to the present invention, comprises: a base member; a channel provided in the base member to allow a cooling medium to flow; an inlet provided in ...
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WO/2023/222346A1 |
A liquid cooling apparatus and system for the immersion cooling of electronic devices including in particular servers and other IT hardware nodes having an array of heat generating devices including microprocessors, RAM, motherboards etc...
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WO/2023/224017A1 |
This cooling structure has an outer covering material in which a coolant inlet and outlet are disposed. The outer covering material has a metal layer and a resin layer disposed on at least one side of the metal layer, and has a conductio...
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WO/2023/222168A1 |
The present invention relates to an electronic device (1) and to transport means comprising such an electronic device (1). The electronic device (1) comprises a support element (2) and at least one heat-producing electronic component (3 ...
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WO/2023/221638A1 |
Embodiments of the present application relate to a heat dissipation apparatus, a connecting structure, and an electronic device. A first heat dissipation device (110a) is in thermal contact with a first heating device (201a) on a first a...
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WO/2023/224203A1 |
The present invention relates to a power module cooling device comprising: a housing part having an inlet part through which a refrigerant flows in and an outlet part through which the refrigerant flows out, and having a flow space forme...
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WO/2023/224873A1 |
An example method of flattening a circuit board assembly includes attaching the circuit board assembly to a structure having dimensions that partly enclose a space, where attachment of the circuit board assembly to the structure creates ...
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WO/2023/223451A1 |
A subrack device (11) comprises a plurality of plug-in units (31), a backplane (41), and a subrack (21). A first ventilation hole (41a) is formed in the backplane (41). The subrack (21) has a box shape with an opening (21a) formed on one...
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WO/2023/221045A1 |
The present disclosure provides a composite heat dissipation structure and a display device. The composite heat dissipation structure comprises: a grid tape, a buffer layer and a ferrite layer stacked in sequence, and a flexible circuit ...
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WO/2023/222901A1 |
A system for controlling the temperature of a quantum circuit comprises an enclosure comprising enclosure walls made of temperature conductive material; a substrate for holding a quantum circuit; at least one source of cooling fluid; at ...
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WO/2023/222344A1 |
A liquid cooling apparatus and system for the immersion cooling of electronic devices including in particular servers and other IT hardware nodes having an array of heat generating devices including microprocessors, RAM, motherboards etc...
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WO/2023/225417A1 |
A modular, radio frequency ("RF") system includes one or more directional antennas and is configured with both hardware and software components to enable the RF system to monitor (e.g., detect or track signals or objects) and/or interact...
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WO/2023/221600A1 |
The present application discloses a motor controller, a power system, and an electric apparatus. The motor controller comprises a box body, a first power device, and a plurality of second power devices. The box body is provided with a co...
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WO/2023/222965A1 |
The invention relates to a connectors guide for an inverter comprising at least two power modules (28), namely at least a first power module and a second power module, the connectors guide (1) comprising a substantially flat rigid body (...
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WO/2023/225412A1 |
Systems, devices, and methods for providing a passive coolant distributions unit (pCDU) to promote refrigerant flow circulation, manage and monitor refrigerant inventory in a closed loop system.
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WO/2023/222345A1 |
A liquid cooling apparatus and system for the immersion cooling of electronic devices including in particular servers and other IT hardware nodes having an array of heat generating devices including microprocessors, RAM, motherboards etc...
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WO/2023/224137A1 |
An embodiment of the present invention comprises a wireless AV box comprising: a main PCB including a control unit and a temperature sensor; an RF PCB including a modem chip that communicates with the main PCB and determines the number o...
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WO/2023/223242A1 |
Server baskets for use in immersion tanks are described herein. In one example, a server basket may be configured to receive a computer server. The server basket may include a cable management housing that has one or more data and power ...
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WO/2023/224688A1 |
Systems with multi-finger planar circuit boards for interconnecting multiple chassis are described. A system includes: (1) a first chassis arranged in a first plane, (2) a second chassis arranged in a second plane, and (3) a third chassi...
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WO/2023/225092A1 |
Systems, devices and methods for providing cooling to hardware components, and more specifically to manifold systems, devices and methods for thermal management of hardware in computer server racks and related equipment in computer data ...
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WO/2023/223163A1 |
A twinax cable assembly comprising twinax cable sets is described. The assembly includes a connector housing a portion of the twinax cable sets. The connector has a connector shell which houses a connector printed circuit board (PCB) tha...
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WO/2023/221641A1 |
The present application provides a motor control apparatus, a driving apparatus, and an electric device. The motor control apparatus comprises a box body; a motor inverter and a heating power module are accommodated in the box body; a ho...
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WO/2023/224204A1 |
The present invention relates to a power module cooling device comprising: a housing unit having an inlet into which a refrigerant flows and an outlet from which the refrigerant is discharged, and having a flow space therein so that the ...
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WO/2023/222672A1 |
The invention relates to a device for reducing mechanical vibrations in an electronic component (1), comprising an assembly (2) of local resonators (3) which are matched such that each resonator has at least one natural frequency in a re...
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WO/2023/223449A1 |
This circuit connection device comprises: a connector that has a connection terminal that is connected to an external unit; a circuit board to which an electronic component is mounted, and has formed therein a terminal hole into which th...
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WO/2023/224690A1 |
The described technology provides implementations of a storage device carrier assembly adapted to removably mate with a chassis. The storage device carrier assembly includes a storage device carrier adapted to be coupled to a storage dev...
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WO/2023/217928A1 |
An electronic control system (3) for a vehicle (1) contains a first and a second ECU (5a, 5b) comprising a first and a second circuit carrier (6a, 7a, 6b, 7b), respectively, as well as a first and a second cooling channel (8a, 8b), respe...
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WO/2023/220345A1 |
A modular distributed cryogenic distribution system, comprising: a common chamber housing cryogenic fluid conduits; and a plurality of cryochambers connected to the common chamber. A method of operating a modular distributed cryogenic di...
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WO/2023/179120A9 |
Embodiments of the present application relate to the technical field of heat dissipation, and provide an electronic device, capable of quickly reducing heat of a chip and effectively solving the problem of heat dissipation of the electro...
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WO/2023/216279A1 |
Provided in the present application is a phase-change cooling energy storage converter, comprising a cabinet, a device, a condenser, an evaporator assembly, and a phase-change working medium. The device is arranged in the cabinet, the co...
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WO/2023/217925A1 |
The invention relates to a circuit board arrangement (10) with at least one housing (12), in which a plurality of circuit boards (14) is arranged, and with at least one cooling device (16), through which a cooling fluid can be passed and...
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WO/2023/218449A1 |
An electronic assembly with heat spreading coating is having a PCB carrying conducting traces heat producing electronic components. An electrically isolating polymeric coating is applied over the electric the traces and the heat producin...
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WO/2023/220686A1 |
A power module includes a first board comprising a first surface and a second surface opposite to each other and perpendicular to a bottom surface of the power module for mounting the power module to a circuit board, the bottom surface p...
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WO/2023/218964A1 |
This wavelength conversion member is characterized by comprising: a fluorescent body that emits fluorescent light by means of excitation light, and has an incident surface in which the excitation light enters, and a back surface position...
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WO/2023/216107A1 |
The present application provides a heat sink and an electronic device. A heat dissipation body (131) of the heat sink (13) defines a heat dissipation cavity (132); the heat dissipation body (131) is in heat conduction fit with a circuit ...
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WO/2023/217597A1 |
The invention relates to an electrical assembly comprising a first sub-module comprising a first electrical-connection part (202) and a second electrical-connection part (108B) each having a main plate, an electrical component mounted on...
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