| Document |
Document Title |
|
JP7296010B2 |
Roughness measurement corrects a machine difference utilizing first PSD data indicating power spectral density of a line pattern measured for a line pattern formed on a wafer for machine difference management by a reference machine in ro...
|
|
JP7290828B2 |
To provide a device and a method that can measure an object at high sensitivity and high resolving power.A device measuring an object 10 having a first plane 11 comprises: a transmission/reception unit that has a first antenna 241 and a ...
|
|
JP2023080920A |
To provide a pitch measurement system, a pitch measurement device, a pitch measurement method and a pitch measurement program, which achieve improvement in accuracy for pitch measurement of a diffraction grating.A pitch measurement syste...
|
|
JP7288144B2 |
A misregistration metrology system and method useful in the manufacture of semiconductor devices, the multilayered semiconductor devices including a first periodic structure having a first pitch along a first axis, the first periodic str...
|
|
JP7286485B2 |
A measurement X-ray CT apparatus calibrates a geometrical positional relationship between a focus of an X-ray source, an X-ray detector, and a rotation center of a rotating table in advance. The measurement X-ray CT apparatus then obtain...
|
|
JP7285902B2 |
A coin battery testing device, including a bottom base, an upper cover, a positive conducting structure, and a negative conducting structure, is provided. The bottom base has an observation region and is adapted to carry a coin battery b...
|
|
JP7284813B2 |
A metrology system is disclosed. In one embodiment, the system includes a characterization sub-system configured to acquire one or more images of a specimen. In another embodiment, the system includes a controller configured to: receive ...
|
|
JP2023075027A |
To provide a film thickness calculation method for a grain boundary oxide layer that can calculate a film thickness of a grain boundary oxide layer remaining on a steel plate after acid cleaning processing with high precision.A film thic...
|
|
JP2023074503A |
To provide a non-destructive method for measuring film thickness of an object exceeding 1 μm in thickness, even in a complex shape or a micro area.The intensity of characteristic X-rays (Kα rays) generated from an element in a base mat...
|
|
JP7281892B2 |
To allow a user to observe a nailing test on a lithium ion battery with a lamination structure, for example, and at the same time check the position where the nail is entering, the state of each electrode, and the short-circuit voltage, ...
|
|
JP7271496B2 |
An X-ray imaging method includes the following steps: (a) performing a first object imaging and obtaining a first object intensity signal by detecting an X-ray passing through a first object; (b) performing baseline imaging process, obta...
|
|
JP2023519471A |
The present invention is a device for determining the temperature of a tubular strand (12) conveyed from an extruder (10), comprising a first temperature outside the tubular strand (12) at a first location on the tubular strand (12). A f...
|
|
JP7267882B2 |
A pattern according to an embodiment includes first and second line patterns, each of the first and second line patterns extends in a direction intersecting a <111> direction and has a side surface, the side surface has at least one {111...
|
|
JP7262409B2 |
The invention provides a sample observation system including a scanning electron microscope and a calculator. The calculator: (1) acquires a plurality of images captured by the scanning electron microscope; (2) acquires, from the plurali...
|
|
JP7257925B2 |
A calibration method of an X-ray measuring device includes: mounting a calibration tool 102 on a rotating table 120; a moving position acquisition step of parallelly moving a position of an j-th sphere 106 with respect to a position of a...
|
|
JP7257924B2 |
A calibration method of an X-ray measuring device includes: a front-stage feature position calculation step of parallelly moving spheres disposed in N places a plurality of times, and identifying centroid positions ImPos(1 to Q)_Dis(1 to...
|
|
JP7255517B2 |
To improve the measurement accuracy of a nondestructive measurement method.The nondestructive measurement method includes: acquiring reference data in advance by destructive measurement; acquiring a measured data group by measuring the p...
|
|
JP7254940B2 |
The present invention enables an overlay error between processors to be measured from a pattern image, the SN ratio of which is low. To this end, the present invention forms a secondary electron image 200 from a detection signal of a sec...
|
|
JP7251911B2 |
In certain embodiments, a system (100) comprises a robot (120), a spray gun (130) coupled to the robot (120) and operable to spray a first predefined number of passes of a material (11) onto a substrate (180) at a first flow rate, and a ...
|
|
JP2023043296A |
To provide a radiation thickness measuring device capable of reducing heat generation of a rotary solenoid.A radiation thickness measuring device in one embodiment comprises a radiation generation part, an arm, a rotary solenoid, and an ...
|
|
JP2023042980A |
To provide a surface profile detection device of an object charged into a blast furnace, capable of detecting the surface profile of an entire surface of a charged object, by securing a scanning region over the entire face of the charged...
|
|
JP2023036023A |
To provide a method and apparatus for measuring thickness of each layer of a tire tread or a tire component, having conductive and non-conductive layers.One or more sensors configured to emit radiation beams or pulses that travel through...
|
|
JP7234228B2 |
The invention concerns a method for measuring the dimensions of empty glass containers (2) consisting in:selecting at least one region to be inspected of the container,transporting the containers,positioning, on either side of the region...
|
|
JP2023028110A |
To provide a three-dimensional shape positioning method capable of accurately performing positioning between a subject in CT data and the subject in design data without depending on the shape of the subject.A three-dimensional shape posi...
|
|
JP2023508538A |
The metrology target is a first target structure formed in at least one of the first region and the third region of the first layer of the sample, the first target structure comprising: a first target structure comprising a plurality of ...
|
|
JP7228323B2 |
A device for detecting an object conveyed through a measuring region comprises a transmission apparatus configured to emit measuring radiation onto the outer contour of the object. The measuring radiation comprises a frequency in a range...
|
|
JP2023024118A |
To provide a system for estimating nugget thickness generated at a fusion point of spot welding by using an X-ray with good transmittance among non-destructive inspection methods.The system for estimating nugget diameter includes: an X-r...
|
|
JP2023024511A |
To provide a measurement apparatus (10) and method for determining a substrate grid describing a deformation of a substrate (12) prior to exposure of the substrate (12) in a lithographic apparatus (LA) configured to fabricate one or more...
|
|
JP2023024030A |
To provide a system for estimating nugget diameter generated at a fusion point of spot welding by using an X-ray with good transmittance among non-destructive inspection methods.The system for estimating nugget diameter includes: an X-ra...
|
|
JP2023021705A |
To provide a charged particle beam scanning module capable of correcting an INL error in DAC circuits in real time, a charged particle beam device and a computer.A charged particle beam scanning module contains a scanning controller whic...
|
|
JP7219334B2 |
A method for process control of a semiconductor structure fabricated by a series of fabrication steps, the method comprising obtaining an image of the semiconductor structure indicative of at least two individual fabrication steps; where...
|
|
JP7216953B2 |
An isosurface mesh M is generated by extracting voxels having a certain CT value from volume data obtained by X-ray CT. A gradient vector g of a CT value is calculated at each vertex p of the isosurface mesh M. A plurality of sample poin...
|
|
JP2023014480A |
To provide a measuring system and the like that enable the selection of an appropriate new measurement target by performing measurement for a limited number of measurement points.A system includes a measuring tool and a computer system t...
|
|
JP2023012913A |
To provide a measurement device and a measurement method with which it is possible to model the three-dimensional shape of a deep hole having a complex cross sectional shape with good accuracy while reducing the number of parameters.The ...
|
|
JP2023012844A |
To provide a technique capable of reducing operations such as taking an actual image in observing a sample.In a learning phase S1, a processor of a sample observation device stores sample design data 250 in a storage resource, creates a ...
|
|
JP2023012227A |
To measure the shape of a cyclically arranged pattern with high accuracy.With a shape measurement method according to an embodiment, the convergence value of parameters included in a first parameter group is computed by a first fitting p...
|
|
JP7211627B2 |
Provided is technology for measuring a pattern and inspecting the measured pattern without relying on empirical assumptions by an operator of a pattern inspecting device. This pattern inspecting device for inspecting a plurality of typ...
|
|
JP7211392B2 |
To provide a wheel for a thickness gauge that can prevent derailment and be easily introduced also into an existing facility.A wheel for a thickness gauge has a V-shaped groove that engages with a V-shaped rail. The V-shaped groove has i...
|
|
JP2023009475A |
To enable highly accurate roughness analysis about one specific line pattern.A method and information processing system generates one profile to be an object of roughness analysis from a measurement result of one specific line pattern, c...
|
|
JP7199290B2 |
The present disclosure provides a pattern cross-sectional shape estimation system which includes a charged particle ray device which includes a scanning deflector that scans a charged particle beam, a detector that detects charged partic...
|
|
JP2022190525A |
To optimize calibration timing by detecting a variation in a detection value of the amount of radiation by a temperature factor.A thickness measuring device includes: a radiation generator for applying radiation beams; multiple radiation...
|
|
JP7194758B2 |
A device for performing a measurement of a strand-shaped object comprises at least one transmission apparatus configured to emit measuring radiation onto the strand-shaped object, which reflects the measuring radiation. At least one rece...
|
|
JP7193297B2 |
The invention relates to an inspection method of a shoe worn by a foot of an individual comprising the following steps: - acquiring (S1) a thermal image of the shoe when it is worn by a foot 10 of the individual by means of a thermal cam...
|
|
JP7192117B2 |
A method and apparatus for critical dimension measurement on a substrate is described. The method includes supporting the substrate with a major surface of the substrate being in an X-Y plane, cutting a notch with a focused ion beam colu...
|
|
JP2022182140A |
To provide a device, method and program for measuring a thickness of an adhesive in a short time by an X-ray two-dimensional image.There is provided an adhesive thickness measurement device of a sample which includes a first adhered obje...
|
|
JP7186315B1 |
It enables highly accurate dimension extraction for complex shapes that can occur in semiconductor processing. By setting a start point 110 and an end point 120 on the circumference of a figure formed by combining a plurality of ellipses...
|
|
JP7181274B2 |
Methods and systems for performing measurements of semiconductor structures based on high-brightness, polychromatic, reflective small angle x-ray scatterometry (RSAXS) metrology are presented herein. RSAXS measurements are performed over...
|
|
JP2022176371A |
To provide an eccentricity calculation device and method usable for calculating an eccentricity amount without relatively requiring labor.An eccentricity calculation device (100) includes: radiating means (110) for radiating a terahertz ...
|
|
JP2022173810A |
To achieve reduction in an installation space of a device for monitoring the deposition shape of blast furnace burden, and to reduce an enormous installation cost that is necessary for the installation of the device, including the openin...
|
|
JP7175319B2 |
Disclosed are apparatus and methods for performing overlay metrology upon a target having at least two layers formed thereon. A target having a plurality of periodic structures for measuring overlay in at least two overlay directions is ...
|
