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WO/2022/059373A1 |
This filter device (100) includes a dielectric substrate (110), ground electrodes (PG1, PG2) connected to a ground terminal (GND), and a plurality of resonators disposed between the ground electrodes and electromagnetically coupled to ea...
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WO/2022/057504A1 |
Disclosed by the embodiments of the present application are an electronic component and an electronic device, said electronic component being arranged on a printed circuit board (PCB), the electronic component comprising: an electronic c...
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WO/2022/059531A1 |
According to the present invention, a first busbar includes: a non-superposed part which is continuous to a first superposed part and is not superposed to a second superposed part of a second busbar; and a connection terminal part which ...
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WO/2022/059530A1 |
A first busbar and a second busbar include, respectively, a first plate-shaped overlapping part and a second plate-shaped overlapping part that overlap each other, the gap between the overlapping sections being insulated by an insulation...
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WO/2022/058528A1 |
Capacitor and method for the production of a capacitor, comprising a uniform dielectric layer, the dielectric layer (2) containing polyamidimide and a first electrode (3) being arranged directly adjacent to the dielectric layer (2).
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WO/2022/059390A1 |
Provided is a chip-type ceramic semiconductor electronic component 10 in which the interface B between a first external electrode 3 and a second external electrode 4 does not easily peel, even when the dimensions are small. This chip-typ...
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WO/2022/055841A1 |
Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external te...
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WO/2022/055853A2 |
a dielectric ceramic composition comprising a main component comprising an oxide represented by: UaXbYcZd((Ca1-x-ySrxMy)m(Zr1-u-vTiuHfv)O3)1-a-b-c-d wherein the elements defined by U, X, Y, Z and M and subscripts a, b, c, d, x, y, m, u a...
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WO/2022/054697A1 |
The present invention provides an oxide insulator film which is not susceptible to the occurrence of variation in the withstand voltage of an insulator. This oxide insulator film (10) contains a first metal oxide (1) and a second metal o...
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WO/2022/054729A1 |
This film capacitor is provided with a capacitor element, a first busbar and a second busbar, and a case including a housing portion housing the capacitor element. The first busbar has an electrode terminal portion and a connection termi...
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WO/2022/054698A1 |
The present invention provides an electronic component having excellent moisture resistance. The electronic component comprises an electronic component element 2 and a barrier layer 3 that seals the electronic component element 2. The ba...
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WO/2022/050317A1 |
Provided is an electroconductive film that contains MXene and is able to maintain high conductivity. An electroconductive film containing a layered material including one or a plurality of layers, wherein the layer includes a layer body ...
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WO/2022/042946A1 |
The invention relates to an EMC filter for a control device. The filter includes a multilayer circuit carrier comprising electrically conductive layers, in particular copper layers, and electrically insulating circuit board layers. Accor...
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WO/2022/044666A1 |
A vehicle-mounted wiring module 20 to be mounted to a plurality of power storage elements 11 having electrode terminals 12A, 12B. The vehicle-mounted wiring module 20 comprises a busbar 40 that connects to the electrode terminals 12A, 12...
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WO/2022/042871A1 |
The invention relates to a polyolefin composition, containing poly-(alpha-olefin) and 10 to 45 wt. %, in relation to the total mass of the composition, of cyclic olefin polymer with a glass transition temperature of at least 30°C. Said ...
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WO/2022/044766A1 |
Provided is a multilayer capacitor capable of easily and satisfactorily exposing the top surface of a first external electrode or a second external electrode to the outside, by polishing the outer surface of a resin, when embedded in the...
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WO/2022/044739A1 |
This metallized film includes a dielectric film and a metal film. The dielectric film includes a film-like substrate having linear protruding sections on a first surface thereof and linear recessed sections on a second surface on the opp...
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WO/2022/044725A1 |
This metallized film comprises a dielectric film and a metal film. The dielectric film contains a film-shaped base material having protruding portions on a first surface and recessed portions on a second surface which faces away from the...
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WO/2022/040987A1 |
Disclosed in the present application are a preparation method for a thin-film capacitor, and the thin-film capacitor. The preparation method comprises: providing a substrate; sequentially forming a sacrificial layer, a dielectric film la...
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WO/2022/036552A1 |
Disclosed are a power capacitor with fireproof functionality, and a method for manufacturing the same. The power capacitor comprises an inner capacitor unit comprising a capacitor casing (1), an elements package (2) arranged in the capac...
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WO/2022/039375A1 |
Disclosed is an electronic device comprising: a substrate which comprises a hole; and a capacitor which is provided so as to be inserted into and thus fixed in the hole of the substrate. The electronic device comprises: a substrate which...
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WO/2022/034797A1 |
This multi-terminal multi-layer capacitor (1) comprises: a plurality of first vias (21) and a plurality of second vias (22) that are arranged inside a first internal electrode (11) and a second internal electrode (12), and that penetrate...
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WO/2022/034870A1 |
A dielectric material according to the present invention, which contains a nematic liquid crystal compound that has dielectric anisotropy and an azo compound that exists as a trans-isomer in the ground state, wherein the azo compound is ...
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WO/2022/030210A1 |
The purpose of the technology of the present disclosure is to provide a structure for a capacitor that increases the strength of adhesion to a wiring board, for example, and also to suppress an increase in the manufacturing load of the c...
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WO/2022/024661A1 |
This film capacitor includes: at least one dielectric film containing a polyarylate film; a layered body in which a plurality of metal vapor deposition films are alternately layered; a cover film that contains a polyester-based hot-melt ...
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WO/2022/024895A1 |
This electricity storage module is provided with at least one cylindrical electricity storage device, and an upper holder for holding the upper end side of the electricity storage device, wherein: a positive electrode terminal and a nega...
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WO/2022/024893A1 |
This electric power storage module comprises at least one cylindrical electric power storage device (20) and an upper holder (30) that holds the upper-end side of the electric power storage device. A positive electrode terminal (26) and ...
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WO/2022/019087A1 |
A printing base 10 is provided with a support portion 1 of porous structure, and a function layer 2 provided in contact with the support portion 1 and including a plurality of resin particles 21 having a surface which is at least partly ...
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WO/2022/018634A1 |
The present invention concerns a capacitive feedthrough (1) hermetically sealable to a hybrid module for space applications, comprising a multilayer ceramic structure that has: two opposite external faces including a top face (10) and bo...
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WO/2022/013352A1 |
The present invention relates to a multi-layer capacitor (1) comprising a capacitor element (2) having at least two segments (2A, 2B), wherein: each segment comprises a plurality of layer planes, including ceramic dielectric layers (5) a...
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WO/2022/012880A1 |
The present invention relates to a ceramic material for a capacitor in multi-layer technology. The ceramic material has a composition according to the following general formula: Pb(y-1,5a-0,5b+c+0,5d-0,5e-f)CaaAb(Zr1-xTix)(1-c-d-e-f)EcFe...
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WO/2022/015201A1 |
The utility model relates to the field of micro- and nanoelectronics, in particular to a thin-film capacitor. The thin-film island capacitor consists of an upper plate and a lower plate and a dielectric layer, and comprises an additional...
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WO/2022/013713A1 |
An electrical device comprising: a metal barrier layer (102), an anodic porous oxide region (AAO) on the metal barrier layer, a trench (104) around the anodic porous oxide region reaching the metal barrier layer, a liner (107) at least o...
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WO/2022/009680A1 |
This film capacitor is provided with: a capacitor element; a bus bar which is connected to an electrode of the capacitor element; a case in which the capacitor element is contained; a filling resin with which the case is filled; a throug...
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WO/2022/009681A1 |
This film capacitor comprises: a capacitor element; a busbar connected to an electrode of the capacitor element; and a filler resin that fills a case which has an opening and in which the capacitor element is accommodated. The case inclu...
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WO/2022/003437A1 |
A grid array capacitor (108) can be used to physically and electrically couple an integrated circuit (IC) package (106) to a printed circuit board (PCB) (114). The grid array capacitor (108) includes an inner conductor (118) and an inner...
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WO/2022/004018A1 |
[Problem] To provide a highly reliable thin film capacitor. [Solution] A thin film capacitor 1 comprises: a metal foil 10 that has a roughened top surface 11; a dielectric film D that covers the top surface 11 of the metal foil 10 and ha...
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WO/2022/004021A1 |
[Problem] To provide a highly flexible thin film capacitor. [Solution] A thin film capacitor 1 comprises: a metal foil 10 that has a roughened top surface 11; a dielectric film D that covers the top surface 11 of the metal foil 10 and ha...
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WO/2022/004013A1 |
[Problem] To provide a thin film capacitor in which a pair of terminal electrodes can be disposed on the same surface. [Solution] A thin film capacitor 1 comprises: a metal foil 10, the upper surface 11 of which has been roughened; a die...
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WO/2022/004019A1 |
[Problem] To provide a thin film capacitor having high adhesiveness with respect to a multilayer substrate. [Solution] A thin film capacitor 1 comprises: a metal foil 10, the upper surface 11 of which has been roughened; a dielectric fil...
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WO/2022/004014A1 |
[Problem] To provide a thin film capacitor in which the peeling of an electrode layer does not readily occur. [Solution] A thin film capacitor 1 comprises: a metal foil 10 which has a roughened upper surface 11; a dielectric film D which...
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WO/2022/004017A1 |
[Problem] To provide a thin film capacitor in which short circuit faults are unlikely to occur. [Solution] A thin film capacitor 1 comprises: a metal foil 10 that has a roughened top surface 11; a dielectric film D that covers the top su...
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WO/2022/004020A1 |
[Problem] Provide a thin film capacitor with high adhesion to a circuit board. [Solution] This thin film capacitor 1 comprises: a metal foil 10 in which a top surface 11 is roughened; a dielectric film D that covers the top surface 11 of...
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WO/2022/004015A1 |
[Problem] To provide a thin-film capacitor which is less likely to warp. [Solution] A thin-film capacitor 1 is provided with: a metal foil 10 having an upper surface 11 and a lower surface 12 which are roughened; a dielectric film D cove...
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WO/2022/004016A1 |
[Problem] Provide a thin film capacitor with high adhesion to a circuit board. [Solution] This thin film capacitor 1 comprises: a metal foil 10 in which a top surface 11 is roughened; a dielectric film D that covers the top surface 11 of...
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WO/2021/261270A1 |
An electronic component (1) comprising: an insulating substrate (10) that has a first main surface (10a) and a second main surface (10b) which are opposite each other in the thickness direction, and is equipped with a plurality of ground...
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WO/2021/256281A1 |
In the present invention, a blade portion has a thickness T1 of 0.26-7.00 μm at a position of 3 μm going from a blade tip toward a base. When the thickness of the blade portion at a position of X μm (X being an integer from 3 to 25) f...
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WO/2021/256311A1 |
In the present invention, a blade part has a thickness T1 of 0.26-7.00 μm at a position 3 μm away from a blade edge toward a base. When the thickness of the blade part at a position X μm (X is an integer between 3 and 25) away from th...
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WO/2021/256253A1 |
A Ni paste characterized by containing an electroconductive powder (A) mainly comprising Ni, a binder resin (B), an organic solvent (C), and a coexisting material (D), and by furthermore containing a Ti-including additive (E) in the rang...
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WO/2021/256280A1 |
In the present invention, the ratio b/a is 0.30-1.00, where "a" represents a constant defined as a=Z1/(Y1)2 when an outer surface of a blade part is represented as YZ plane and a first point on the outer surface is assigned with the coor...
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