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WO/2023/243903A1 |
Disclosed are a composite film, a rigid flexible printed circuit board, and an electronic device comprising same. The present invention relates to a composite film, a rigid flexible printed circuit board using same, and an electronic dev...
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WO/2023/242703A1 |
The present invention relates to a device for use with an electrical component, wherein the device is configured to surround at least a component portion of the electrical component at least partially around the axis thereby defining a r...
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WO/2023/242254A1 |
The invention relates to a method for manufacturing a sensor for an aerosol-generating device, wherein the method may comprise any of the following steps: providing a layer of a flexible dielectric substrate, printing or mounting a first...
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WO/2023/241123A1 |
Disclosed in the present application are a flexible circuit board and a manufacturing method therefor. The manufacturing method for the flexible circuit board comprises: preparing a film; providing an imprinting mold having a protruding ...
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WO/2023/244003A1 |
The present invention relates to a ceramic substrate and a method for manufacturing same, the ceramic substrate comprising: a ceramic base; a first electrode pattern and a second electrode pattern formed on the upper and lower surfaces o...
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WO/2023/203179A9 |
Printed-Circuit-Board structure (10), in particular for an RF generator, comprising: a heat spreader (14); a basic printed-circuit-board, PCB, (22) having an upper surface (18) and a lower surface (28), wherein the basic PCB (22) compris...
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WO/2023/238537A1 |
A module (101) comprises: a core substrate (1) having a first surface (1a) and a second surface (1b) that form the front and back thereof, and a through-hole (1e) that connects the first surface (1a) and the second surface (1b); a redist...
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WO/2023/238592A1 |
Provided are: a laminate which has excellent adhesiveness between a support and a metal layer (metal-plated layer) and with which a seed layer serving as a base of plating can be simply and inexpensively formed, without roughening a supp...
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WO/2023/239162A1 |
A circuit board according to an embodiment comprises: an insulating layer which includes an upper surface and a lower surface and has a recess which is recessed from the upper surface toward the lower surface; and a circuit pattern layer...
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WO/2023/237616A1 |
The invention relates to a circuit carrier, in particular a multi-layer printed circuit board. The circuit carrier has at least two electrically insulating layers, and at least one electrically conductive layer. The circuit carrier also ...
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WO/2023/238515A1 |
A composition containing a liquid crystal polymer that contains a structural unit represented by formula (1), a structural unit represented by formula (2), and a structural unit represented by formula (3), wherein the composition is char...
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WO/2023/239053A1 |
The present invention relates to a structure of a flexible printed circuit board for overcurrent protection comprising shape memory material, and specifically, to a structure of a flexible printed circuit board, the structure being chara...
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WO/2023/239076A1 |
An electronic device according to an embodiment comprises: a printed circuit board including a first side and a second side perpendicular to the first side; a plurality of solder balls arranged on one surface of the printed circuit board...
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WO/2023/237001A1 |
The present application provides a semiconductor device and electronic equipment. The semiconductor device comprises a substrate and a plurality of structural units; the plurality of structural units are all provided on one side of the s...
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WO/2023/236427A1 |
The present application relates to the technical field of electronic circuit manufacturing. Disclosed are an electronic structure and a manufacturing method therefor. The manufacturing method for an electronic structure comprises: provid...
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WO/2023/239172A1 |
A semiconductor package, according to an embodiment, comprises: an insulating layer; a pad unit arranged on the insulating layer; and a protective layer arranged on the insulating layer and including an open region overlapping the pad un...
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WO/2023/236119A1 |
The present disclosure relates to a circuit module and an electronic device. The circuit module comprises: a main circuit comprising a first voltage end and a second voltage end; a battery, the battery being connected to the first voltag...
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WO/2023/238349A1 |
This electronic unit that is mounted to a vehicle comprises: a printed circuit board to which a plurality of electronic components are mounted; a capacitor which is one of the electronic components and which is longer in a vertical direc...
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WO/2023/236412A1 |
The present invention relates to a high-precision multilayer circuit board and a 3D printing preparation method therefor. The method comprises: S1, forming a stereoscopic circuit layer on the upper surface of a substrate; S2, performing ...
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WO/2023/236772A1 |
Provided in the present disclosure are a power amplifier module and a manufacturing method therefor. The power amplifier module comprises: a radio-frequency input end, a radio-frequency output end, a power amplifier chip, and an output m...
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WO/2023/238763A1 |
Provided is glass cloth with which it is possible to reduce delay time differences in printed wiring boards and to heighten the production efficiency. The glass cloth is composed of warps and wefts, wherein the warps and the wefts each h...
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WO/2023/238082A1 |
The present invention relates to: a method for manufacturing a liquid crystal polymer film having excellent strength; a liquid crystal polymer film manufactured by the method; a method for manufacturing a high-frequency circuit board mat...
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WO/2023/232702A1 |
It is described a component carrier (100), wherein the component carrier (100) comprises: i) a stack (101) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure ...
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WO/2023/234023A1 |
The present invention provides a multilayer substrate which is not susceptible to cracking or separation at a connection part of an electrode that is provided on a ceramic layer and an interlayer connection conductor that is provided in ...
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WO/2023/233893A1 |
[Problem] To reduce transmission loss and improve heat dissipation of a substrate in a high-speed transmission system which is fast and has a high capacity. [Solution] This electronic component wiring structure is characterized in that a...
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WO/2023/231530A1 |
An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole exte...
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WO/2023/234411A1 |
This vehicle light source unit (31) comprises a circuit board (40), a light source (70) mounted on the front surface of the circuit board (40), and a board support member (91) on which the rear surface of the circuit board (40) is mounte...
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WO/2023/234286A1 |
Provided is a ceramic circuit substrate having a favorable adhesion with a mold resin. A ceramic circuit substrate according to an embodiment of the present invention comprises a ceramic substrate and a plurality of metal parts. The cera...
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WO/2023/234590A1 |
The present invention relates to a ceramic substrate and a manufacturing method therefor, the ceramic substrate comprising: a ceramic base; a first electrode pattern and a second electrode pattern formed on the upper and lower surfaces o...
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WO/2023/234414A1 |
Provided are: a method for bonding substrates containing polymers on the surfaces thereof; a bonding apparatus; and a laminate, applicable to high-frequency circuits in which substrates containing polymers on the surfaces thereof are fir...
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WO/2023/231776A1 |
A memory, comprising: a substrate (330), a first storage array (310) and a first redundant array (320). The first storage array (310) comprises a stack structure composed of at least one transistor and at least one capacitor unit, and th...
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WO/2023/233877A1 |
Provided is a film comprising a layer A and a layer B disposed on at least one surface of layer A. The ratio of the elastic modulus EB at 160°C of layer B to the elastic modulus EA at 160°C of layer A is 1.0 × 10-6 or greater and the ...
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WO/2023/233854A1 |
One embodiment relates to a polyamide-imide including: a structure that is derived from a compound including at least one type of compound selected from the group consisting of a diamine and a diisocyanate; and a structure that is derive...
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WO/2023/233459A1 |
This connection structure comprises a plurality of insulating wires, a base material, a plurality of to-be-connected sections disposed on the base material, and a sealing member. Each of the insulating wires has a center conductor and an...
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WO/2023/234377A1 |
This elongated laminated substrate has: a substrate that has a prescribed length; and two polymer layers that are respectively provided to the two sides of the substrate, the two polymer layers each containing a tetrafluoroethylene-based...
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WO/2023/232862A1 |
A connector device (1) comprises a housing (10) having a housing wall (100) and an opening (101) formed therein, a circuit carrier (11A-11C), which is arranged in the housing (10), and a connector element (12A-12C) to which a mating conn...
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WO/2023/232400A1 |
For an electronic module (1), in particular an electronic power module for hybrid vehicles or electric vehicles, comprising a first circuit board (10) with an upper side (11) and an underside (12) facing away from the upper side (11), wh...
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WO/2023/232648A1 |
A power electronics converter is disclosed. The power electronics converter comprises a converter commutation cell comprising a power circuit and a gate driver circuit, the power circuit comprising at least one power semiconductor switch...
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WO/2023/231369A1 |
Provided in the embodiments of the present application are a heat dissipation structure, a vehicle-mounted device, and a terminal device, which are applied to the technical field of heat dissipation. The heat dissipation structure compri...
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WO/2023/225944A1 |
A light emitting substrate (01) and a display device (1000). The light emitting substrate (01) comprises a substrate (101), a reflecting layer (100), at least one pad (201), a light emitting element (102), and a connecting portion (105),...
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WO/2023/226092A1 |
Disclosed in the present application are a display module and a mobile terminal. The display module comprises a first binding section of a display panel and a second binding section on a flexible circuit board, a second binding terminal ...
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WO/2023/228852A1 |
This electronic device comprises: a circuit board; a wire; and a terminal that is disposed on the circuit board and that electrically connects the circuit board and the wire. The terminal integrally has a misalignment prevention part for...
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WO/2023/229360A1 |
Disclosed is an interface device. The interface device includes a substrate that interfaces signals between an electronic device and a display device, wherein the substrate includes a first connector connected to the electronic device, a...
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WO/2023/227458A1 |
An electronic device has an elongate printed circuit substrate arrangement and a row of electrical units on the elongate printed circuit substrate arrangement. An indicator unit is wireless powered for identifying a particular location o...
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WO/2023/228942A1 |
This electronic component module comprises: a base sheet; an IC chip which is mounted on one surface of the base sheet; a combination electrode which is provided on the other side surface of the base sheet and is electrically connected t...
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WO/2023/228829A1 |
Provided is a multilayer substrate which is not susceptible to fracture of a metal compound that is formed between a conductor part which is provided in a ceramic layer and an interlayer connection conductor which is provided in a thermo...
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WO/2023/225934A1 |
A printed circuit board, a display module and a driving method therefor, and a display apparatus, which relate to the technical field of display. The printed circuit board comprises a blank region and an encapsulation region. The printed...
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WO/2023/229350A1 |
A semiconductor package according to an embodiment comprises: an insulating layer; a protective layer disposed on the insulating layer; a through-electrode passing through the insulating layer; and a bump part disposed on the through-ele...
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WO/2023/229392A1 |
A semiconductor package according to an embodiment comprises: a first substrate comprising first and second pads; a first connection unit disposed on the first pad of the first substrate; a second substrate coupled to the first connectio...
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WO/2023/228626A1 |
This wiring circuit board comprises: a wiring part having a signal line; and a component mounting part on which an electronic component to be electrically connected to the signal line is to be mounted. The wiring part has a plurality of ...
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