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WO/2024/084388A1 |
Methods and systems for cooling conditioned spaces (e.g., data centers) are provided. The cooling system includes a radiative cooling component disposed outside of the housing and including a radiative cooling surface configured to provi...
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WO/2024/085324A1 |
The present invention relates to a Pickering emulsion composition for heat dissipation, a heat dissipation paste using same, and a method for manufacturing same and, more specifically, provides a Pickering emulsion composition for heat d...
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WO/2024/085958A1 |
A cooling system may include a tank filled with a first cooling fluid. The cooling system may include a container including a chamber, the chamber receiving a heat-generating component, the container being sealed, the container being at ...
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WO/2024/083749A1 |
The invention relates to a housing (10) for an electronic power device (1) of an electric powertrain, for example for an inverter, the housing (1) comprising a body (13) including a bottom (11) and a set of peripheral walls (12) which de...
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WO/2024/086772A1 |
Systems, methods, and devices are provided for extended thermal transfer from a heat plane. Consistent with this disclosure, a device can include at least one cooling device configured to transfer heat to a fluid, where the cooling devic...
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WO/2024/082915A1 |
Provided in the present application is a heat dissipation device, comprising an evaporator and a condenser. The evaporator comprises a casing and a partition plate; the casing is provided with a sealed inner chamber; the partition plate ...
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WO/2024/085051A1 |
A heat dissipation substrate comprising: a base body that contains a carbon material; a cover member that is positioned on the outer surface of the base body; and a pipe mounting part that is a groove or a through hole positioned across ...
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WO/2024/082678A1 |
A small-size double-redundancy electric power steering motor controller structure, comprising a sealing cover cap, a ventilation valve, a connector, a power joint connector, a bendable PCBA board, screws, a stud screw, a magnet, a radiat...
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WO/2024/085103A1 |
This radiation cooling structure is provided with a reflective layer (13) and a transparent protective layer (14) provided on the reflective layer. A relief surface (16) configured by providing a large number of protrusions (15) differen...
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WO/2024/083244A1 |
A working module (100) and an electronic device (200). The working module (100) is suitable for operating in a heat-dissipating air passage, the direction from an air inlet of the heat-dissipating air passage to an air outlet thereof bei...
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WO/2024/083241A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) comprises: a circuit board (110), the circuit board (110) being provided with a plurality of heating components (111); a first heat dissipator (123), pro...
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WO/2024/085462A1 |
An electronic device according to one embodiment comprises: a housing; a printed circuit board including an insertion hole; at least one electronic component; and a fastening member inserted into the insertion hole, wherein the printed c...
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WO/2024/083239A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) comprises: a circuit board (110) and a heat sink (120); the heat sink (120) comprises a heat dissipation body (121) and a plurality of heat dissipation f...
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WO/2024/085050A1 |
This heat dissipation substrate comprises a base body containing a carbon material, and a plurality of pipe mounting parts positioned on the base body. When the direction in which the plurality of pipe mounting parts are aligned is defin...
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WO/2024/083233A1 |
An electronic device (200). The electronic device (200) comprises: a housing (210), a heat dissipation air duct having an air inlet and an air outlet being defined in the housing (210), and at least one working assembly (100) being provi...
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WO/2024/085125A1 |
This bolt holding structure (100) comprises a bolt (13) and a holder (12). The bolt (13) holds a conductor (bus bar (14) and terminal (15)) between a nut (17) and the bolt (13). The holder (12) holds the bolt (13). The bolt (13) comprise...
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WO/2024/084045A1 |
System (10) for distributing generated electricity to an electrical network (17) and comprises at least one generator (11). A power carrying link (12) from the generators (11) to the grid is also connected to at least one service module ...
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WO/2024/084689A1 |
The present invention addresses the problem of providing a fixed structure, a fixing method, and a fixing device with which a high-precision surface can be held and manufacturing costs can be reduced. Provided is a structure that fixes...
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WO/2024/083717A1 |
A heat sink comprises first coolant channels and second coolant channels. The first coolant channels comprise first inflow sections and are adapted to guide first coolant flows. The second coolant channels comprise second inflow sections...
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WO/2024/082600A1 |
Provided in the present utility model is a bendable vapor chamber, comprising a bending section, wherein several bending-section support columns are arranged in an array on a housing plate of the bending section, and the cross sections o...
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WO/2024/085770A1 |
A system and method for interfacing a module for computation with local 5 infrastructure is provided. The object of the invention is achieved using a receptacle (300) for a module (400) for computation, wherein the receptacle (300) compr...
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WO/2024/082675A1 |
A refrigeration system, comprising a condensation heat exchanger, a switch valve, an evaporation heat exchanger, an adsorption bed and a compressor, wherein the condensation heat exchanger, the switch valve and the evaporation heat excha...
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WO/2024/084972A1 |
[Problem] To prevent, in a surface contact heat exchanger, a brazing material and flux from flowing onto a seal surface of a flange plate. [Solution] In the present invention, an annular protrusion 7 is formed along the edge of a second ...
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WO/2024/084837A1 |
The present invention is a heat radiation composite film that includes a heat radiating layer and an adhesive layer, the film being characterized in that: the thickness of the heat radiating layer is 5-200 μｍ; one surface of the heat ...
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WO/2024/083228A1 |
A circuit board (110), provided with a chip array. The chip array comprises a plurality of power taking units (114), each power taking unit (114) comprises at least one chip (111), and the distances between at least some of the adjacent ...
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WO/2024/083236A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) comprises: a circuit board (110); a first heat sink (123) provided on a first surface of the circuit board (110); and screws (172) and springs (171), whi...
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WO/2024/083229A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) is suitable for working in a heat-dissipating air duct. The working assembly (100) comprises: a circuit board (110), multiple heating components (111) be...
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WO/2024/082664A1 |
The present application relates to the technical field of energy, and provides a charging apparatus and a charging system, for use in solving the problems of complex heat dissipation structure, high cost, etc. in charging apparatuses. Th...
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WO/2024/083231A1 |
An electronic device (200). The electronic device (200) comprises: a housing (210), a heat dissipation air duct having an air inlet and an air outlet being defined in the housing (210), and at least one working assembly (100) being provi...
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WO/2024/085520A1 |
According to an embodiment of the present disclosure, a wireless power transmission apparatus may comprise: a resonator including at least one coil and at least one capacitor; an inner space formed inside the at least one coil; and a pow...
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WO/2024/083242A1 |
A working assembly (100) and an electronic device (200). The working assembly (100) comprises: a circuit board (110), a plurality of heating components (111) being provided on the circuit board (110); and a heat dissipator (120), compris...
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WO/2024/080466A1 |
The invention relates to an electric compressor comprising a compression mechanism for compressing a refrigerant by receiving power from a motor, and an inverter for controlling the motor, wherein: a housing for accommodating the motor a...
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WO/2024/078206A1 |
Disclosed in the embodiments of the present application are a computing device and a computing node. A housing of the computing node comprises a bottom casing and a top cover, the top cover and the bottom casing being matched to form an ...
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WO/2024/078948A1 |
The invention relates to a method for producing an assembly (1) with a converter and to an assembly (1) with a converter for converting electric current types and voltage types, comprising at least one power module (2) and at least one i...
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WO/2024/077925A1 |
A bent specially shaped ultra-thin vapor chamber, a manufacturing process therefor, and an application. The manufacturing process comprises: cleaning upper and lower housing plates, and drying; preparing a liquid absorption core material...
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WO/2024/080624A1 |
An electronic device may comprise: a first substrate including a first hole; a second substrate including a second hole; a shield can attached to another side opposite to one side of the first substrate facing the second substrate; an in...
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WO/2024/080652A1 |
An electronic device according to an embodiment of the present disclosure comprises: a heating unit including an electronic component in which heat is generated during the operation of the electronic device; and a heat dissipation struct...
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WO/2024/081808A1 |
A manifold assembly is provided for a server rack. The manifold assembly can include a manifold tube including at least one side wall. A channel can have a top portion and a bottom portion, each including at least one attachment aperture...
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WO/2023/019030A8 |
An apparatus includes a base; a mount attached to the base, the mount including a backplate, a bottom platform formed perpendicular to the backplate along a bottom of the backplate, the bottom platform including a retention wall formed a...
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WO/2024/080710A1 |
The present invention relates to a circuit board coupling structure and, more specifically, provides a circuit board coupling structure comprising: a circuit board having an asymmetric portion which is one edge formed asymmetrically with...
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WO/2024/077816A1 |
A rapid cooling device for a server cabinet. The rapid cooling device comprises: a cabinet body; a support mechanism, which is fixedly connected to inner sides of the cabinet body; and a heat dissipation mechanism, which is arranged on a...
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WO/2024/080762A1 |
Disclosed is a vapor chamber having a porous filler portion forming a gas diffusion path. According to the present invention, the heat transmitted via a metal chamber housing quickly vaporizes a phase change liquid even at a relatively l...
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WO/2024/080455A1 |
The present invention relates to a method for manufacturing a heat-dissipating film, comprising the steps of: preparing a first mixture by mixing hexagonal boron nitride and an organic solvent; conducting first surface-modification of th...
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WO/2024/081409A1 |
The fluoroether 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane ("HFE-347mcf") may be used as a refrigerant and/or heat transfer composition, such as in single phase and two phase cooling systems, and a method of heating and/or cooling ...
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WO/2024/081394A1 |
Methods of heating and/or cooling electronic components, articles and devices during operation thereof and/or during manufacture thereof by providing a refrigerant comprising 2-(1,1,2,3,3,3-hexafluoropropoxy)-1,1,1,3,3,3-hexafluoroprop
a...
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WO/2024/080458A1 |
A server processor of a server device, according to an embodiment of the present invention, can be configured to: calculate a predicted communication traffic volume processed through a telecommunication building in which a cooling system...
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WO/2024/080589A1 |
The present invention relates to a BMS assembly comprising: a circuit board which has a first fastening hole for grounding; a first casing mold which accommodates the circuit board and includes a bushing portion formed inside a second fa...
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WO/2024/077512A1 |
An electronic device comprises a heat sink and a cooling structure, the cooling structure comprising a heat obtaining module, a Stirling engine, a transmission component and a fan, wherein the heat obtaining module obtains heat energy an...
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WO/2024/075933A1 |
This electronic device comprises an antenna board designed for massive multiple input multiple output (massive MIMO). The antenna board is coupled to a filter board by means of elastic signal contacts and elastic ground contacts. The con...
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WO/2024/076556A1 |
A system and method for operating an immersion tank for cooling electronics is provided. The system comprises an immersion tank configured to house a dielectric fluid and at least one electronic device; a cooling tank configured to house...
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