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Patent Searching and Data


Matches 501 - 550 out of 19,707

Document Document Title
WO/2006/134744A1
An electronic component manufacturing method wherein troubles due to outgassing from a sacrificial layer and residuals after sacrificial layer removal are prevented. The electronic component manufacturing method has a first step of formi...  
WO/2006/131216A1
Disclosed is a surface-mounted electrical component that is provided with sensitive component structures (B51, B52) and is embodied on the front side of two substrates (51, 52). The substrates are joined to each other with facing front s...  
WO/2006/130777A2
A contour mode micromechanical piezoelectric resonator. The resonator has a bottom electrode (Pt) ; a top electrode (Al) ; and a piezoelectric layern (AIN) disposed between the bottom electrode and the top electrode. The piezoelectric re...  
WO/2006/130777A3
A contour mode micromechanical piezoelectric resonator. The resonator has a bottom electrode (Pt) ; a top electrode (Al) ; and a piezoelectric layern (AIN) disposed between the bottom electrode and the top electrode. The piezoelectric re...  
WO/2006/126382A1
A piezoelectric device which can be efficiently manufactured. A cover substrate (20) is bonded along the periphery of an element substrate (12) whereupon a piezoelectric element is formed, and the piezoelectric element is sealed. The mai...  
WO/2006/123653A1
A piezoelectric device which is thinned with excellent yield and has improved production efficiency. An element substrate (12) whereupon a piezoelectric element is formed, and a cover substrate (20) are placed and bonded one over another...  
WO/2006/120994A1
A composite piezoelectric substrate formed by bonding a piezoelectric substrate and a supporting substrate. A metal electrode for exciting a surface acoustic wave is formed on the surface of the piezoelectric substrate. The thickness of ...  
WO/2006/118192A1
Disclosed is a piezoelectric component (1) comprising a piezoelectric transducer (10) wherein a pair of electrodes (20a, 20b) are formed on both major surfaces of a piezoelectric substrate (11), a pair of frame members (30a, 30b) fitted ...  
WO/2006/114922A1
A surface acoustic wave element wherein an electrode for exciting and detecting surface acoustic waves is formed on a piezoelectric substrate is characterized in that the element is provided with at least a composite piezoelectric chip, ...  
WO2005008888A8
A tuning fork type vibrator comprises a basal part and leg parts extending therefrom. A groove is formed in a main surface of each leg part. An in-groove electrode is formed in the groove, while a side surface electrode is formed in a si...  
WO/2006/107961A3
Electrically responsive devices and methods for fabricating electrically- responsive devices involves applying an electrically responsive material (e.g. piezoelectric material) (132) over at least a portion of a surface of a substrate ma...  
WO/2006/107961A2
Electrically responsive devices and methods for fabricating electrically- responsive devices involves applying an electrically responsive material (e.g. piezoelectric material) (132) over at least a portion of a surface of a substrate ma...  
WO/2006/106831A1
A surface acoustic device is provided with a piezoelectric substrate and a cover which face each other at a prescribed interval. On a cover side main plane of the piezoelectric substrate, a comb-shaped electrode and a pad electrode are p...  
WO/2006/104265A1
A crystal vibrator (1, 51) includes an upper and a lower substrate (3, 4, 53, 54) overlaid on the upper and the lower surface of an intermediate crystal plate (2, 52) formed by a crystal vibration piece (5, 55) and an external frame (6, ...  
WO/2006/103921A1
A radio receiving apparatus for substantially A/D converting an RF signal to allow the reception process to be performed by use of digital signal process. A bandpass A/D converter (4) performs an A/D conversion of a received signal of a ...  
WO/2006/101762A1
A method for fabrication of single crystal silicon micromechanical resonators using a two-wafer process, including either a Silicon-on-insulator (SOI) (104) or insulating base and resonator wafers (108) , wherein resonator anchors (122, ...  
WO/2006/100457A1
A method of forming a Bragg reflector stack including depositing alternate Silicon Dioxide and Tungsten layers characterised in that a Tungsten Nitride layer is deposited at at least one Silicon Dioxide/Tungsten interface.  
WO/2006/101450A1
A method of producing a polycrystalline film of a metal compound, AlN or ZnO, on a substrate with a non-zero mean tilt of the c-axis relative to the surface normal of the substrate, is disclosed. The method comprises deposition of crysta...  
WO/2006/100807A1
This invention provides a piezoelectric element comprising an internal electrode (2) embedded in a piezoelectric ceramic element assembly (1). The piezoelectric ceramic element assembly (1) is composed mainly of a perovskite composite ox...  
WO2005055422A8
The invention relates to an electronic component (1) comprising at least one resonator element (5) which is disposed in a housing (8) of a case. The aforementioned case comprises: a main part (2) with a base (20) and at least one annular...  
WO/2006/092982A1
Disclosed is a surface acoustic wave device comprising a piezoelectric substrate, a comb-shaped electrode formed on a first major surface of the piezoelectric substrate, and a supporting substrate bonded to a second major surface of the ...  
WO2005074502A3
High-Q micromechanical resonator devices and filters utilizing same are provided. The devices and filters include a vibrating polysilicon micromechanical "hollow-disk" ring resonators obtained by removing quadrants of material from solid...  
WO/2006/087496A1
The invention relates to an acoustic wave device comprising a piezoelectric layer (41) on an omnidirectional acoustic mirror (32) and excitation and/or reception means (43, 44) which are provided on a surface of said piezoelectric layer ...  
WO2005026676A3
A sensor apparatus and method are disclosed herein, including a sensor element located on a base and a cover located proximate to the base. The cover generally includes a sensor diaphragm and a dimple that can form a part of the cover. A...  
WO/2006/082736A1
[PROBLEMS] To reduce frequency irregularities caused by a frequency constant change and suppress an unnecessary vibration when the frequency constant has an inclination in a piezoelectric substrate. [MEANS FOR SOLVING PROBLEMS] A piezoel...  
WO/2006/079765A1
The invention relates to a microresonator comprising a resonant element (160) which is made from monocrystalline silicon and at least one activation electrode (120, 121) which is positioned close to the resonant element, whereby the reso...  
WO/2006/080226A1
A process for producing a micromachine, in which the corrosion of structure can be inhibited; and a relevant micromachine. There is provided a process for producing a micromachine, characterized by including the step of conducting patter...  
WO2005034345A8
In order to provide a resonator structure (100) in particular a bulk-acoustic-wave (BAW) resonator, such as a film BAW resonator (FBAR) or a solidly-mounted BAW resonator (SBAR), comprising at least one substrate (10); at least one refle...  
WO/2006/067949A1
A piezoelectric thin film resonator wherein fluctuations of a resonance frequency and a resonance resistance are reduced by uniformly flattening a film constituting the resonator, and a method for manufacturing such piezoelectric thin fi...  
WO/2006/064414A1
The invention refers to a method for the fabrication of a thin film acoustic reflector stack with alternating layers of a first and a second material having different acoustic characteristic impedances, wherein the layers are deposited a...  
WO/2006/057128A1
A piezoelectric vibrator (10) has a first piezoelectric body substrate (1a) and a second piezoelectric body substrate (1c). The first piezoelectric body substrate (1a) has a first main surface (41) and a second main surface (42) that are...  
WO/2006/051610A1
Disclosed is a method for producing a lithium tantalate crystal having improved conductivity which is characterized in that a lithium tantalate crystal to be processed is arranged close to but not in contact with a material which has bee...  
WO/2006/043343A1
A utilization ratio of a target material, a tact time, maintenance easiness and film forming accuracy are improved by a thin film forming apparatus. The thin film forming apparatus is provided with a vacuum chamber, a sputter cathode for...  
WO/2006/043713A1
A piezoelectric device wherein planar sizes can be easily reduced and TAB tape resonance designing is easily performed. Further, a sealing hole can be surely sealed in the piezoelectric device. The piezoelectric device (10) has an IC chi...  
WO/2006/035762A1
A method for fabricating a resonance vibration device in which a structure consisting of a support, a vibratory beam extending from the support, and a vibration element supported by the beam to perform resonance vibration as the beam vib...  
WO/2006/034299A3
A resonator system (10) wherein a plurality of resonators (16, 18) each including piezoelectric material, are suspended relative to a substrate (12). An edge of each resonator (16, 18) is mechanically coupled to an edge of another resona...  
WO/2006/032335A1
The invention relates to a component which functions with the aid of acoustic waves, and which combines various measures in order to lower the temperature path, in particular the resonance frequency. Said component comprises a piezoelect...  
WO/2006/032363A1
The invention relates to a device and a method for influencing vibration of a planar element (1), comprising two opposing surfaces (15, 15') and a neutral fibre plane (2) running between both surfaces, comprising at least one actuator (9...  
WO/2006/034299A2
A resonator system (10) wherein a plurality of resonators (16, 18) each including piezoelectric material, are suspended relative to a substrate (12). An edge of each resonator (16, 18) is mechanically coupled to an edge of another resona...  
WO/2006/030900A1
As a corrosion resistant metal film to crystal etching, a Cr film is used as a base layer and an Au film is used as a surface layer. After outer shape patterning is performed to a photoresist layer, the Au film is etched, a groove part p...  
WO2005015735A3
A micromechanical resonator device and a method of making the micromechanical resonator device, as well as other extensional mode devices are provided wherein anchor losses are minimized by anchoring at one or more side nodal points of t...  
WO/2006/022072A1
A manufacturing method of an electronic component having an electronic component element bonded and secured onto a substrate using conductive adhesive, which provides an electronic component exhibiting excellent reliability in electrical...  
WO2005109639A3
There are many inventions described and illustrated herein. These inventions are directed to a method of fabricating a microelectromechanical resonator having an output frequency that may be adjusted, tuned, set, defined and/or selected ...  
WO/2006/018788A1
Thin-film bulk acoustic wave filters based on piezoelectric resonators operating in the thickness extensionally mode achieve relative band-widths in the order of to 4 % at a center frequency of 2 GHz. According to an exemplary embodiment...  
WO/2006/013301A1
The invention concerns an electromechanical resonator comprising a vibrating body (4), at least one excitation electrode (14, 16) and at least one detection electrode (10, 12), characterized in that the vibrating body comprises a first p...  
WO2004059837B1
An electronic component for improving temperature characteristics and electric characteristics, comprising a substrate (1), an interdigital electrode (2) provided on the top surface of the substrate (1), and a protection film (4) coverin...  
WO/2006/011417A1
Disclosed is a surface acoustic wave device wherein an insulator layer is so formed as to cover an IDT electrode and the surface of the insulator layer is planarized. In such a surface acoustic wave device, the electrode can have a suffi...  
WO/2006/011449A1
It is possible to provide a concatenated body of MEMS filters having a design flexibility and capable of ignoring the affect of the mass load. There is provided a structure in which the affect of the mass load is not reflected in the cha...  
WO/2006/006343A1
A piezoelectric device which has reduced sizes and improved moisture resistance and does not require sealing after being mounted on a circuit board, and a method for manufacturing such device are provided. The piezoelectric device (10) i...  
WO/2006/003933A1
An electronic part includes: a substrate; a comb-shaped electrode having a plurality of electrode fingers arranged parallel to one another on the upper surface of the substrate; and a protection film formed on the substrate so as to cove...  

Matches 501 - 550 out of 19,707