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Patent Searching and Data


Matches 501 - 550 out of 18,517

Document Document Title
WO/2004/102796A1
The invention relates to a resonator unit, integrated in a monocrystalline silicon substrate (1), for the production of a temperature-stable time base, comprising at least one first (2) and one second (3) resonator, for oscillation accor...  
WO/2004/100364A1
A method of manufacturing tuning-fork piezoelectric device (10), comprising a step of mounting a tuning-fork piezoelectric vibratory piece (16) on a package base (12) having a sealing hole (20) with a conductive adhesive (14) having a Yo...  
WO/2004/100367A1
An insulating substrate (1) comprises a first insulating substrate (1a) and a second insulating substrate (1b) stacked on the first insulating substrate (1a). On both substrates (1a, 1b) formed are wiring patterns and electrodes. A reces...  
WO/2004/100365A1
The piezoelectric vibration piece of a tuning fork type vibrator is provided with a base and a plurality of legs. Each leg is formed with excitation electrodes having poles different according to front-rear surfaces and opposite-side sur...  
WO/2004/094302A1
Briefly, a reduced substrate Micro-Electro-Mechanical Systems (MEMS) device, for example, a low-loss Film Bulk Acoustic Resonators (FBAR) filter or a low-loss FBAR Radio. Frequency filter, and a process and a system to produce the same. ...  
WO/2004/089812A1
A process for fabricating a micromachine in which removal of a sacrifice layer and sealing can be carried out without requiring any special packaging technology. The process for fabricating a micromachine (1) equipped with an oscillator ...  
WO/2004/088840A1
A piezoelectric thin film device (10) comprising a substrate (12) having a vibration space (20), and a piezoelectric lamination structure (14) formed on the upper surface of the substrate, the piezoelectric lamination structure comprisin...  
WO2004015862A3
An acoustic resonator of one inventive aspect includes a substrate, at least one generally crystalline primer layer provided on the substrate either directly or on top of one or more intermediate layers, a generally smooth and generally ...  
WO/2004/088839A1
A method for manufacturing a thin-film piezoelectric resonator (1), wherein a piezoelectric film (4) covering a lower electrode (3) on a base (2) is formed over the base (2), an electrode material layer (6b) for forming an upper electrod...  
WO/2004/086027A2
A sensor and methods for making and using the same in which a mechanical resonator is employed, comprising a resonator portion for resonating in a fluid without the substantial generation of acoustic waves; and an electrical connection b...  
WO2004001849A3
A method for fabricating a quartz nanoresonator which can be integrated on a substrate, along with other electronics is disclosed. In this method a quartz substrate is bonded to a base substrate. The quartz substrate is metallized so tha...  
WO/2004/079904A2
A monolithic electronic device includes a substrate, a semi-insulating, piezoelectric Group III-nitride epitaxial layer formed on the substrate, a pair of input and output interdigital transducers forming a surface acoustic wave device o...  
WO/2004/075402A1
A duplexer including an FBAR band pass filter that can be easily embodied in single chip, and a method for manufacturing the same are disclosed. The duplexer of a mobile communication device includes a transmitting band pass filter, form...  
WO2004027796A3
A micro-electro-mechanical system (MEMS) capacitive resonator (200) is disclosed and methods for manufacturing the same. In one embodiment, the MEMS capacitive resonator (200) comprises a semiconductor resonating member (208, 210) and a ...  
WO/2004/066493A1
The invention relates to a SAW component that is constituted by a piezoelectric substrate (S). In order to reduce losses, mass loading is increased by way of the metallization layer (M) until the propagation velocity of the surface acous...  
WO2004030208A3
A film bulk acoustic resonator formed on a substrate (710) includes a layer of piezoelectric material (735) having a first major surface, and a second major surface sandwiched between a first conductive (732) and a second conductive laye...  
WO2004036744A3
A film bulk acoustic resonator filter may be formed with a plurality of interconnected series and shunt film bulk acoustic resonators formed on the same membrane. Each of the film bulk acoustic resonators may be formed from a common lowe...  
WO2004013893A3
A piezoelectric resonator (205) is disclosed. In one embodiment the piezo electric resonator includes a semiconductor material (206) an electrode (210) and a piezo electric material (208) disposed between the semiconductor material and t...  
WO/2004/059837A1
An electronic component for improving temperature characteristics and electric characteristics, comprising a substrate (1), an interdigital electrode (2) provided on the top surface of the substrate (1), and a protection film (4) coverin...  
WO/2004/059836A2
A longitudinal mode resonator that includes a substrate and a bar that is suspended relative to the substrate. The bar is suspended such that it is free to expand and contract longitudinally in response to the application of an electric ...  
WO/2004/055875A1
A film structure of a ferroelectric single crystal which can be beneficially used in the fabrication of high-performance electric or electronic parts or devices is prepared by adhering a ferroelectric single crystal plate to a substrate ...  
WO/2004/054089A1
A piezoelectric oscillator capable of being downsized by reducing a plane size. In a laminate lead frame (50) comprising two lead frames (30, 40), a lead (32) for connection with a piezoelectric oscillation element (10) is formed on an u...  
WO/2004/053431A2
The transducer (1) comprises an electrically conductive resonator element (20) extending in a longitudinal direction having a length (l). It can be elastically deformed by an electrically conductive actuator (30) such that the elastic de...  
WO/2004/053431A3
The transducer (1) comprises an electrically conductive resonator element (20) extending in a longitudinal direction having a length (l). It can be elastically deformed by an electrically conductive actuator (30) such that the elastic de...  
WO2004027796A9
A micro-electro-mechanical system (MEMS) capacitive resonator (200) is disclosed and methods for manufacturing the same. In one embodiment, the MEMS capacitive resonator (200) comprises a semiconductor resonating member (208, 210) and a ...  
WO/2004/050545A1
A micromachine for a high frequency filter having a high Q factor and a frequency band which is high. A micromachine (1) comprising an output electrode (7) disposed on a board(5), an interlayer insulation film (9) covering the board (5) ...  
WO2004021398A3
One embodiment disclosed relates to a method (100) for sealing an active area of a non-silicon-based device on a wafer. The method includes providing (104) a sacrificial material over at least the active area of the non-silicon-based dev...  
WO2003079439A3
The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two sili...  
WO2003084861A3
The electronic device (100) comprises an electrical element (30), for instance a MEMS capacitor or a BAW filterin a cavity (37) that is protected from the environment by a cover (38). The cover (38) is a patterned layer which is mechanic...  
WO/2004/038914A1
A piezoelectric vibrator is characterized by having a multilayer structure wherein both major surfaces of a piezoelectric plate (1) are respectively provided with a silicon oxide film (3) having a generally equal thickness as a dielectri...  
WO/2004/036744A2
A film bulk acoustic resonator filter may be formed with a plurality of interconnected series and shunt film bulk acoustic resonators formed on the same membrane. Each of the film bulk acoustic resonators may be formed from a common lowe...  
WO/2004/032321A1
A surface-mounted SAW device designed to form an airtight space below an IDT electrode on the lower surface of an SAW chip by coating the outer surface of the SAW chip with heated and softened sheet resin and by filling resin into the bo...  
WO/2004/030047A1
A method of producing a lithium tantalate single crystal substrate for a surface acoustic wave device is provided which includes the step of: reducing a polarized lithium tantalate single crystal substrate by heating below a Curie temper...  
WO/2004/030208A2
A film bulk acoustic resonator formed on a substrate (710) includes a layer of piezoelectric material (735) having a first major surface, and a second major surface sandwiched between a first conductive (732) and a second conductive laye...  
WO/2004/030046A1
A method of producing a lithium tantalate single crystal substrate for a surface acoustic wave device is provided which includes the steps of: reducing a lithium tantalate single crystal ingot or substrate by heating above a Curie temper...  
WO/2004/030113A1
The present invention relates to piezoelectric vibrators such as a resonator used as a timing element, discriminator, filter or the like, and fabricating methods thereof. The piezoelectric vibrators of the present invention may be fabric...  
WO/2004/027796A2
A micro-electro-mechanical system (MEMS) capacitive resonator (200) is disclosed and methods for manufacturing the same. In one embodiment, the MEMS capacitive resonator (200) comprises a semiconductor resonating member (208, 210) and a ...  
WO/2004/025832A1
A bulk acoustic wave resonator comprising a substrate (5), a Bragg reflector (4), a top (1) and a bottom (3) electrode and a piezoelectric layer (2) with means for suppression of the pass-band ripples in a bulk acoustic wave filter. The ...  
WO/2004/021398A2
One embodiment disclosed relates to a method (100) for sealing an active area of a non-silicon-based device on a wafer. The method includes providing (104) a sacrificial material over at least the active area of the non-silicon-based dev...  
WO/2004/021568A1
The invention relates to resonator, which operates with acoustic volume waves and which is based on a known layer structure placed over a substrate. According to the invention, the layer structure, together with resonators contained ther...  
WO/2004/019490A1
The invention relates to an encapsulated component comprising a carrier substrate and at least one chip that is disposed on the upper side of said carrier substrate and is electrically connected thereto by means of electrically conductiv...  
WO/2004/019426A1
A piezoelectric layer and an electrode layer are formed on a silicon substrate, and a piezoelectric body and an electrode are patterned by photolithography. The silicon substrate is etched to form a structure. A protective film is formed...  
WO/2004/017517A1
A surface acoustic wave device in which surface acoustic wave resonators are connected in a ladder, and roundabout routing of a short bar is possible even if the degree of freedom of layout is low. The surface acoustic wave device is suc...  
WO/2004/015862A2
An acoustic resonator of one inventive aspect includes a substrate, at least one generally crystalline primer layer provided on the substrate either directly or on top of one or more intermediate layers, a generally smooth and generally ...  
WO/2004/014784A1
A micromachine for use in a high-frequency filter having a high Q value and a higher frequency band. A micromachine (20) characterized by comprising an output electrode (7) provided on a substrate (1), an interlayer insulation film consi...  
WO/2004/013893A2
A piezoelectric resonator (205) is disclosed. In one embodiment the piezo electric resonator includes a semiconductor material (206) an electrode (210) and a piezo electric material (208) disposed between the semiconductor material and t...  
WO/2004/012332A1
A piezoelectric component in which the size can be reduced while suppressing deterioration of characteristics furthermore, and its manufacturing method. The surface acoustic wave device (21) comprises a surface acoustic wave element (16)...  
WO/2004/012330A1
A piezoelectric component capable of being downsized and enhanced in degree of freedom in positioning an external terminal, and a production method therefore. A surface acoustic wave device comprises an SAW element (6) having IDTs (2) fo...  
WO/2004/011366A1
A micromachine (20) for a high frequency filter having a high Q value and a high frequency band, comprising an input electrode (7b), an output electrode (7a), and a support electrode (7c) installed on a substrate (4), and a band-shaped v...  
WO/2004/012331A1
A piezoelectric component, e.g. a surface acoustic wave device or a piezoelectric thin film filter, in which the size can be reduced while suppressing deterioration of characteristics furthermore, and its manufacturing method. In the sur...  

Matches 501 - 550 out of 18,517