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Patent Searching and Data


Matches 501 - 550 out of 19,576

Document Document Title
WO/2006/057128A1
A piezoelectric vibrator (10) has a first piezoelectric body substrate (1a) and a second piezoelectric body substrate (1c). The first piezoelectric body substrate (1a) has a first main surface (41) and a second main surface (42) that are...  
WO/2006/051610A1
Disclosed is a method for producing a lithium tantalate crystal having improved conductivity which is characterized in that a lithium tantalate crystal to be processed is arranged close to but not in contact with a material which has bee...  
WO/2006/043343A1
A utilization ratio of a target material, a tact time, maintenance easiness and film forming accuracy are improved by a thin film forming apparatus. The thin film forming apparatus is provided with a vacuum chamber, a sputter cathode for...  
WO/2006/043713A1
A piezoelectric device wherein planar sizes can be easily reduced and TAB tape resonance designing is easily performed. Further, a sealing hole can be surely sealed in the piezoelectric device. The piezoelectric device (10) has an IC chi...  
WO/2006/035762A1
A method for fabricating a resonance vibration device in which a structure consisting of a support, a vibratory beam extending from the support, and a vibration element supported by the beam to perform resonance vibration as the beam vib...  
WO/2006/034299A3
A resonator system (10) wherein a plurality of resonators (16, 18) each including piezoelectric material, are suspended relative to a substrate (12). An edge of each resonator (16, 18) is mechanically coupled to an edge of another resona...  
WO/2006/032335A1
The invention relates to a component which functions with the aid of acoustic waves, and which combines various measures in order to lower the temperature path, in particular the resonance frequency. Said component comprises a piezoelect...  
WO/2006/032363A1
The invention relates to a device and a method for influencing vibration of a planar element (1), comprising two opposing surfaces (15, 15') and a neutral fibre plane (2) running between both surfaces, comprising at least one actuator (9...  
WO/2006/034299A2
A resonator system (10) wherein a plurality of resonators (16, 18) each including piezoelectric material, are suspended relative to a substrate (12). An edge of each resonator (16, 18) is mechanically coupled to an edge of another resona...  
WO/2006/030900A1
As a corrosion resistant metal film to crystal etching, a Cr film is used as a base layer and an Au film is used as a surface layer. After outer shape patterning is performed to a photoresist layer, the Au film is etched, a groove part p...  
WO2005015735A3
A micromechanical resonator device and a method of making the micromechanical resonator device, as well as other extensional mode devices are provided wherein anchor losses are minimized by anchoring at one or more side nodal points of t...  
WO/2006/022072A1
A manufacturing method of an electronic component having an electronic component element bonded and secured onto a substrate using conductive adhesive, which provides an electronic component exhibiting excellent reliability in electrical...  
WO2005109639A3
There are many inventions described and illustrated herein. These inventions are directed to a method of fabricating a microelectromechanical resonator having an output frequency that may be adjusted, tuned, set, defined and/or selected ...  
WO/2006/018788A1
Thin-film bulk acoustic wave filters based on piezoelectric resonators operating in the thickness extensionally mode achieve relative band-widths in the order of to 4 % at a center frequency of 2 GHz. According to an exemplary embodiment...  
WO/2006/013301A1
The invention concerns an electromechanical resonator comprising a vibrating body (4), at least one excitation electrode (14, 16) and at least one detection electrode (10, 12), characterized in that the vibrating body comprises a first p...  
WO2004059837B1
An electronic component for improving temperature characteristics and electric characteristics, comprising a substrate (1), an interdigital electrode (2) provided on the top surface of the substrate (1), and a protection film (4) coverin...  
WO/2006/011417A1
Disclosed is a surface acoustic wave device wherein an insulator layer is so formed as to cover an IDT electrode and the surface of the insulator layer is planarized. In such a surface acoustic wave device, the electrode can have a suffi...  
WO/2006/011449A1
It is possible to provide a concatenated body of MEMS filters having a design flexibility and capable of ignoring the affect of the mass load. There is provided a structure in which the affect of the mass load is not reflected in the cha...  
WO/2006/006343A1
A piezoelectric device which has reduced sizes and improved moisture resistance and does not require sealing after being mounted on a circuit board, and a method for manufacturing such device are provided. The piezoelectric device (10) i...  
WO/2006/003933A1
An electronic part includes: a substrate; a comb-shaped electrode having a plurality of electrode fingers arranged parallel to one another on the upper surface of the substrate; and a protection film formed on the substrate so as to cove...  
WO/2006/004470A1
The invention discloses a tuneable resonator (100, 200, 300, 500, 600, 700, 900) with a substrate layer (140, 260, 360, 560, 660, 960), which substrate layer supports a structure with a first electrode (130, 240, 350, 550, 650). In conne...  
WO/2005/125006A1
It is possible to provide a quartz device having a stable oscillation characteristic and a high reliability. The quartz device includes a first main surface having a part of a basic part and a part of an oscillation leg within a single p...  
WO/2005/125005A1
A SAW device removing the defects of prior art that a filter satisfying the standards required for the RF SAW filter of a GPS receiver could not be realized and that the performance of a circuit or an apparatus degrades when a SAW filter...  
WO/2005/125007A1
There is provided a high-frequency element capable of stabilizing DC bias voltage applied to an electrostatic drive type vibrator and a power supply element capable of supplying a stable DC bias voltage. There is also provided a communic...  
WO/2005/122395A1
A small-sized highly integrated electric machine signal selecting element, which can select and output only a signal of a prescribed frequency without providing a high sensitive oscillation detecting function, and an electric device usin...  
WO/2005/114836A1
Plural band film bulk acoustic resonators may be formed on the same integrated circuit using lithographic techniques. As a result, high volume production of reproducible components can be achieved, wherein the resonators, as manufactured...  
WO/2005/112259A1
Disclosed herein is a method of manufacturing a lithium tantalate substrate for surface acoustic wave elements, which includes heating a lithium tantalate material to a temperature of not less than the Curie temperature of lithium tantal...  
WO/2005/109636A1
The electronic device comprises a network of at least one thin-film capacitor and at least one inductor on a first side of a substrate of a semiconductor material. The substrate has a resistivity sufficiently high to limit electrical los...  
WO/2005/109639A2
There are many inventions described and illustrated herein. These inventions are directed to a method of fabricating a microelectromechanical resonator having an output frequency that may be adjusted, tuned, set, defined and/or selected ...  
WO2005035436A3
A method of increasing a quality factor for a micromechanical resonator uses a laser beam to anneal the micromechanical resonator. In one embodiment, the micromechanical oscillator is formed by fabricating a mushroom shaped silicon oscil...  
WO/2005/104361A1
The present invention provides an electro-mechanical device , for example , a Micro-Electro-Mechanical Systems (MEMS) device, for example a low-loss Film Bulk Acoustic Resonators (FBAR) filter, and a process to produce the same. In order...  
WO/2005/102910A1
Disclosed is an MEMS component that is disposed on a panel as a chip component. Each assembly point for a chip is tightly encircled by a frame structure that sits on the panel. The joint between the frame structure and the chip is sealed...  
WO/2005/104639A1
When inner electrodes (22-24) are formed of a conductive paste for a multilayer ceramic board, which can be sintered at a low temperature and contraction of which at the time of baking is suppressed, the inner electrodes (22-24) contract...  
WO/2005/104257A1
An electromechanical device (201) includes a support structure (210) formed by attaching inner surfaces of second and third substrates (220a-b) to a first substrate (230). The support structure (210) includes at least one cavity (250) be...  
WO/2005/099090A1
A surface acoustic wave filter for preventing a large void from being generated at the time of pressing a resin sheet covering an element chip while heating the resin sheet, and a method for manufacturing the surface acoustic wave filter...  
WO/2005/099087A1
A μ-flap type nano/micro mechanical device with a lower electrode 1, 1a, 1b, an upper electrode layer 2, an dielectric layer 3 arranged between the lower electrode 1, 1a, 1b and the upper layer 2, such that the dielectric layer 3 and sa...  
WO/2005/099088A1
An integrated circuit is provided which includes one or more device elements (24) formed above a base substrate (22), a structure (43) forming a sealed cavity (46) above at least a portion of the one or more device elements (24), and one...  
WO/2005/099089A1
A SAW device employing a quartz substrate having device size smaller than that of conventional structure and exhibiting a high Q and excellent frequency-temperature characteristics. An IDT (2) consisting of a plurality of interdigital el...  
WO2005078752A8
A piezoelectric thin-film electromechanical microsystem (MEMS) device (18) comprising an RF-MEMS switch (14) and a bulk acoustic wave piezoelectric thin-film RF resonator (10) mounted on a substrate (12) provided with an acoustic mirror ...  
WO/2005/096373A1
After forming an unwelded part in a primary welding process step (S203) composed of a first beam irradiation process step (S203a) and a second beam irradiation process step (S203b), a prescribed part on an electronic beam trajectory form...  
WO/2005/096493A1
A method for manufacturing a quartz oscillator having a stable temperature drift characteristic attributed to the quartz oscillating piece and a quartz oscillator are disclosed. The method comprises a quartz crystal etching step (S1) of ...  
WO/2005/093949A1
A method of manufacturing a boundary acoustic wave device with less frequency variation. First to third media (1 to 3) are formed sequentially in this order. An electrode (5) is disposed at the boundary between the first and second media...  
WO/2005/091500A1
A surface acoustic wave device arranged such that pyroelectricity of a piezoelectric substrate is not revived, and a process for fabricating that device. The piezoelectric substrate (12) of a surface acoustic wave element (10) being cont...  
WO/2005/083881A1
A surface acoustic wave device such that the resonance frequency and the center frequency can be easily adjusted, the frequency temperature characteristic is favorable, the specific bandwidth is wide, and the antiresonance resistance is ...  
WO/2005/081272A1
The LC composite component of the present invention comprises a base, a first to third terminals provided on the base, a helical conductor provided on the base, and an internal layer conductor inside the base, the internal layer conducto...  
WO/2005/078752A1
A piezoelectric thin-film electromechanical microsystem (MEMS) device (18) comprising an RF-MEMS switch (14) and a bulk acoustic wave piezoelectric thin-film RF resonator (10) mounted on a substrate (12) provided with an acoustic mirror ...  
WO/2005/074502A2
High-Q micromechanical resonator devices and filters utilizing same are provided. The devices and filters include a vibrating polysilicon micromechanical 'hollow-disk' ring resonators obtained by removing quadrants of material from solid...  
WO/2005/076470A1
The invention relates to a modularly constructed electrical component having a module substrate preferably made of Si and having one or more preferably unhoused chips, which are placed on this module substrate while being electrically co...  
WO/2005/076473A1
A plurality of surface acoustic wave resonators (15-20), each consisting of an interdigital electrode and a grating reflector, are connected on a piezoelectric substrate (12). A dielectric film (14) is formed on the surface of at least o...  
WO/2005/074052A1
A mask material (12) applied to the surface to be processed of a piezoelectric material (11) is brought into contact with solvent vapor (V) and reflowed, and then shaped into a bump mask (14) where the central part is raised by the surfa...  

Matches 501 - 550 out of 19,576