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Patent Searching and Data


Matches 501 - 550 out of 18,642

Document Document Title
WO/2005/031861A1
A structure and method of making a capped chip is provided. A capped chip includes a chip having a front surface, and a plurality of bond pads exposed at the front surface. A cap member has a top surface, a bottom surface opposite the to...  
WO/2005/031863A1
Capped chips and methods of forming a capped chip are provided in which electrical interconnects are made by conductive elements which extend from bond pads of a chip at least partially through a plurality of through holes of a cap. The ...  
WO/2005/031862A1
A method of making one or more sealed assemblies is provided which includes assembling a first element to a second element so that a bottom surface of the first element faces downwardly toward a front surface of the second element and a ...  
WO/2005/029700A1
By differentiating the output phase by 180 degrees, it is possible to output an unbalanced input as a balanced output. A micro electric machine system resonator (MEMS resonator (101)) includes: an input electrode (111) for inputting a si...  
WO2004025832A8
A bulk acoustic wave resonator comprising a substrate (5), a Bragg reflector (4), a top (1) and a bottom (3) electrode and a piezoelectric layer (2) with means for suppression of the pass-band ripples in a bulk acoustic wave filter. The ...  
WO/2005/020435A1
A piezoelectric resonant component utilizing a basic wave and having good characteristics in which a spurious resonance due to a high order mode is suppressed. The piezoelectric resonant component (1) comprises a plurality of resonance e...  
WO/2005/020482A2
A source signal is converted into a time-variant temperature field with transduction into mechanical motion. In one embodiment, the conversion of a source signal into the time-variant temperature field is provided by utilizing a micro-fa...  
WO/2005/020434A2
A micromechanical resonator (400, 1125) is formed on a substrate (120). The resonator has a partial spherical shell (110) clamped on an outside portion of the shell to the substrate. In other embodiments, a flat disc or other shape may b...  
WO/2005/018090A1
The invention relates to a microsystem incorporating at least one resonant structure, produced in a silicon base that is fixed to a silicon substrate (20) with which it forms a cavity, said silicon base also being fixed to a cover (60) b...  
WO/2005/015735A2
A micromechanical resonator device and a method of making the micromechanical resonator device, as well as other extensional mode devices are provided wherein anchor losses are minimized by anchoring at one or more side nodal points of t...  
WO/2005/015736A1
An electromechanical filter capable of being miniaturized by employing a micro-oscillator of a carbon nanotube, or the like, excellent in electric conductivity and capable of selecting a signal of a desired frequency. The electromechanic...  
WO/2005/013353A2
The invention relates to a method for producing reduced-thickness electronic components. The inventive method consists in placing at least one electronic component (1) by the active face thereof provided with electric contacts (10, 11) o...  
WO/2005/011115A1
In the step of the occurrence of a single cancer cell at the early stage in, for example, the liver of the human body, a protein characteristic to liver cancer is discharged from the caner cell occurring in the liver and dissolved in the...  
WO/2005/011116A1
An MEMS type resonator in which suction of a beam to a substrate due to a wet process is suppressed during an MEMS fabrication process and unnecessary oscillation modes other than a required oscillation mode during operation do not exist...  
WO2004079904A3
A monolithic electronic device includes a substrate, a semi-insulating, piezoelectric Group III-nitride epitaxial layer formed on the substrate, a pair of input and output interdigital transducers forming a surface acoustic wave device o...  
WO/2005/008888A1
A tuning fork type vibrator comprises a basal part and leg parts extending therefrom. A groove is formed in a main surface of each leg part. An in-groove electrode is formed in the groove, while a side surface electrode is formed in a si...  
WO/2005/008889A1
The present invention relates to a film bulk acoustic wave device and a method of manufacturing the same, wherein comprising an acoustic reflective layer which is formed on a substrate by removing a sacrificial layer on the substrate and...  
WO/2005/006548A1
A piezoelectric element plate is rectangular as seen from above. Its upper surface is formed to be flat, while its lower surface has a beveling arc applied thereto. The piezoelectric element plate is mounted on a package by adsorbing one...  
WO/2005/006432A2
The invention relates to the formation of vertical electrical through contacts in a support substrate, on the surface of which component structures are fixed, whereby the component structures are associated with contact surfaces, arrange...  
WO/2005/004326A1
An MEMS type oscillator capable of using a primary oscillation mode while enhancing the S/N ratio of an output signal, its fabricating process, a filter, and a highly reliable communication unit employing that filter. The MEMS type oscil...  
WO/2005/001948A1
A MEMS resonator includes an annular resonator body defined by an inner radius and an outer radius, a first electrode positioned within the inner radius and spaced from the resonator body, and a second electrode positioned around the ann...  
WO2004013893B1
A piezoelectric resonator (205) is disclosed. In one embodiment the piezo electric resonator includes a semiconductor material (206) an electrode (210) and a piezo electric material (208) disposed between the semiconductor material and t...  
WO/2004/109912A1
An SAW device has a hermetically sealed space defined under an IDT by covering the outer surface of an SAW chip mounted on a mounting board with a resin sheet softened by heating and by filling the SAW chip with resin. The SAW device has...  
WO/2004/103932A1
A mask (14) having a predetermined film thickness distribution is arranged on a piezoelectric material substrate (11), which is subjected to dry etching by using a working speed difference between the piezoelectric material substrate (11...  
WO/2004/105237A1
A piezoelectric electronic component suitably used in a portable phone or the like, and able to be downsized and made low in profile. A piezoelectric element (3) vibrated by an applied input signal, for outputting an output signal by the...  
WO2004059836A3
A longitudinal mode resonator that includes a substrate and a bar that is suspended relative to the substrate. The bar is suspended such that it is free to expand and contract longitudinally in response to the application of an electric ...  
WO/2004/102796A1
The invention relates to a resonator unit, integrated in a monocrystalline silicon substrate (1), for the production of a temperature-stable time base, comprising at least one first (2) and one second (3) resonator, for oscillation accor...  
WO/2004/100364A1
A method of manufacturing tuning-fork piezoelectric device (10), comprising a step of mounting a tuning-fork piezoelectric vibratory piece (16) on a package base (12) having a sealing hole (20) with a conductive adhesive (14) having a Yo...  
WO/2004/100367A1
An insulating substrate (1) comprises a first insulating substrate (1a) and a second insulating substrate (1b) stacked on the first insulating substrate (1a). On both substrates (1a, 1b) formed are wiring patterns and electrodes. A reces...  
WO/2004/100365A1
The piezoelectric vibration piece of a tuning fork type vibrator is provided with a base and a plurality of legs. Each leg is formed with excitation electrodes having poles different according to front-rear surfaces and opposite-side sur...  
WO/2004/094302A1
Briefly, a reduced substrate Micro-Electro-Mechanical Systems (MEMS) device, for example, a low-loss Film Bulk Acoustic Resonators (FBAR) filter or a low-loss FBAR Radio. Frequency filter, and a process and a system to produce the same. ...  
WO/2004/089812A1
A process for fabricating a micromachine in which removal of a sacrifice layer and sealing can be carried out without requiring any special packaging technology. The process for fabricating a micromachine (1) equipped with an oscillator ...  
WO/2004/088840A1
A piezoelectric thin film device (10) comprising a substrate (12) having a vibration space (20), and a piezoelectric lamination structure (14) formed on the upper surface of the substrate, the piezoelectric lamination structure comprisin...  
WO2004015862A3
An acoustic resonator of one inventive aspect includes a substrate, at least one generally crystalline primer layer provided on the substrate either directly or on top of one or more intermediate layers, a generally smooth and generally ...  
WO/2004/088839A1
A method for manufacturing a thin-film piezoelectric resonator (1), wherein a piezoelectric film (4) covering a lower electrode (3) on a base (2) is formed over the base (2), an electrode material layer (6b) for forming an upper electrod...  
WO/2004/086027A2
A sensor and methods for making and using the same in which a mechanical resonator is employed, comprising a resonator portion for resonating in a fluid without the substantial generation of acoustic waves; and an electrical connection b...  
WO2004001849A3
A method for fabricating a quartz nanoresonator which can be integrated on a substrate, along with other electronics is disclosed. In this method a quartz substrate is bonded to a base substrate. The quartz substrate is metallized so tha...  
WO/2004/079904A2
A monolithic electronic device includes a substrate, a semi-insulating, piezoelectric Group III-nitride epitaxial layer formed on the substrate, a pair of input and output interdigital transducers forming a surface acoustic wave device o...  
WO/2004/075402A1
A duplexer including an FBAR band pass filter that can be easily embodied in single chip, and a method for manufacturing the same are disclosed. The duplexer of a mobile communication device includes a transmitting band pass filter, form...  
WO2004027796A3
A micro-electro-mechanical system (MEMS) capacitive resonator (200) is disclosed and methods for manufacturing the same. In one embodiment, the MEMS capacitive resonator (200) comprises a semiconductor resonating member (208, 210) and a ...  
WO/2004/066493A1
The invention relates to a SAW component that is constituted by a piezoelectric substrate (S). In order to reduce losses, mass loading is increased by way of the metallization layer (M) until the propagation velocity of the surface acous...  
WO2004030208A3
A film bulk acoustic resonator formed on a substrate (710) includes a layer of piezoelectric material (735) having a first major surface, and a second major surface sandwiched between a first conductive (732) and a second conductive laye...  
WO2004036744A3
A film bulk acoustic resonator filter may be formed with a plurality of interconnected series and shunt film bulk acoustic resonators formed on the same membrane. Each of the film bulk acoustic resonators may be formed from a common lowe...  
WO2004013893A3
A piezoelectric resonator (205) is disclosed. In one embodiment the piezo electric resonator includes a semiconductor material (206) an electrode (210) and a piezo electric material (208) disposed between the semiconductor material and t...  
WO/2004/059837A1
An electronic component for improving temperature characteristics and electric characteristics, comprising a substrate (1), an interdigital electrode (2) provided on the top surface of the substrate (1), and a protection film (4) coverin...  
WO/2004/059836A2
A longitudinal mode resonator that includes a substrate and a bar that is suspended relative to the substrate. The bar is suspended such that it is free to expand and contract longitudinally in response to the application of an electric ...  
WO/2004/055875A1
A film structure of a ferroelectric single crystal which can be beneficially used in the fabrication of high-performance electric or electronic parts or devices is prepared by adhering a ferroelectric single crystal plate to a substrate ...  
WO/2004/054089A1
A piezoelectric oscillator capable of being downsized by reducing a plane size. In a laminate lead frame (50) comprising two lead frames (30, 40), a lead (32) for connection with a piezoelectric oscillation element (10) is formed on an u...  
WO/2004/053431A2
The transducer (1) comprises an electrically conductive resonator element (20) extending in a longitudinal direction having a length (l). It can be elastically deformed by an electrically conductive actuator (30) such that the elastic de...  
WO/2004/053431A3
The transducer (1) comprises an electrically conductive resonator element (20) extending in a longitudinal direction having a length (l). It can be elastically deformed by an electrically conductive actuator (30) such that the elastic de...  

Matches 501 - 550 out of 18,642