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Patent Searching and Data


Matches 501 - 550 out of 17,892

Document Document Title
WO2003043189A3
The invention concerns a method for adjusting the operating gap of two mechanical elements of a substantially planar mechanical structure obtained by micro-etching. The method consists in attributing (A) to one of the elements (E) a fixe...  
WO/2003/100969A1
The invention relates to a method of producing a microsystem structure with lateral gaps and the corresponding microsystem structure. The inventive method consists in: (a) depositing a first sacrificial layer (CS1) on the substrate (S); ...  
WO/2003/100799A1
Hybrid electronic circuit structure comprising a low-temperature cofired ceramic (LTCC) tape and a ferromagnetic device, said device being formed by a ferromagnetic material, wherein said ferromagnetic material comprises a ferromagnetic ...  
WO2003028211A3
A resonator having temperature and electronic compensation. The resonator has several layers on a substrate having opposite thermal coefficients of the sound velocity for temperature compensation. Also, the frequency of the resonator is ...  
WO2003002450A3
A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducin...  
WO2003036735A3
Programmable surface control devices whose physical features, such as surface charcteristics and mass distribution, are controlled by the presence or absence of an electrodeposition (40) of metal and/or metal ions from a solid solution u...  
WO/2003/088482A1
The invention relates to acoustic wave interface devices. The subject of the invention is a hybrid module comprising electronic components (F), which are disposed on a base (E), and acoustic wave interface components. Each acoustic wave ...  
WO/2003/088475A1
The invention relates to the production of acoustic wave interface components comprising two substrates separated by an interface area including transduction devices. Said invention concerns an interconnection device located on the later...  
WO/2003/085739A1
A cavity (12) is provided in the first major surface (11a) of a substrate (11) comprising a multilayer ceramic substrate and a resin substrate, and a crystal oscillator (13) is contained in the cavity (12). Surface mounting chip componen...  
WO2003065576A3
The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wa...  
WO/2003/084861A2
The electronic device (100) comprises an electrical element (30), for instance a MEMS capacitor or a BAW filterin a cavity (37) that is protected from the environment by a cover (38). The cover (38) is a patterned layer which is mechanic...  
WO/2003/084061A1
A surface acoustic wave device which can be made thin (low profile) and in which a surface acoustic wave element can be protected against thermal breakdown by shortening the heating process. The surface acoustic wave device comprises a s...  
WO/2003/079439A2
The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two sili...  
WO/2003/073610A1
An elastic surface wave apparatus includes a substrate (10), a pair of reflection electrodes (14, 18) formed on the substrate, and a plurality of drive electrodes (12) formed so as to be sandwiched by the pair of reflection electrodes. C...  
WO/2003/073611A1
A duplexer (1) includes a chip (10) having a transmission filter (97) for passing a transmission signal and cutting off a reception signal and a reception filter (98) for passing a reception signal and cutting off a transmission signal. ...  
WO/2003/069775A1
The invention relates to a component that operates by means of acoustic waves. According to the invention, the electrode structure (ES) is positioned above a mechanically stable adaptation layer (AS), which reduces electromechanical stre...  
WO/2003/069720A1
A small-sized and high-performance mechanical vibration filter adapted to a high-frequency band. A mechanical adapter is made up of a microcylindrical beam (5) to increase the mechanical resonance frequency, and the microcylindrical beam...  
WO/2003/067757A1
A blank mounting apparatus for fabrication of a quartz oscillator includes a robot body transferred above a blank pallet and a base pallet, an absorption pin mounted to the robot body to be movable vertically for absorbing a blank on the...  
WO/2003/067758A1
An apparatus for automatic insertion of a base in fabrication of a quartz oscillator, which is used for inserting bases having blanks arranged on a pallet into a plurality of seat grooves formed along a circumference of a circular turret...  
WO/2003/065577A1
A surface acoustic wave device includes a transducer electrode formed on a substrate. In one aspect, the electrode has a plurality of layers. At least one of the layers is metal and another of the layers is a material for providing a har...  
WO/2003/065576A2
The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wa...  
WO/2003/061119A1
A template (3) manufactured to have high−accuracy protrusions and recesses in advance by a lithography technology employing an electron beam is pressed against a resist film (2) applied onto a substrate (1) thus transferring a resist p...  
WO/2003/057618A2
The invention relates to a method for producing a protective covering for a component provided on a substrate (102), according to which at least one sacrificial structure is produced on the substrate (102). The sacrificial structure cove...  
WO/2003/058811A1
The invention relates to a method for producing an electrode (106) for a thin film resonator. Said electrode (106) is embedded in an insulating layer (126) of the resonator in such a manner that a surface (110) of the electrode is expose...  
WO/2003/058810A1
The aim of the invention is to encapsulate components in a simple and reliable manner. To this end, the connection between a chip and a carrier substrate is made by means of bump contacts which are sunk in recesses on the carrier substra...  
WO/2003/052839A1
The invention relates to a method for producing a component (100) with a predefined physical parameter, according to which the component (100), which comprises a supplementary layer (118) that is used to set the parameter, is first provi...  
WO/2003/052929A1
A film bulk acoustic resonator is formed on a substrate. The film bulk acoustic resonator includes a layer of piezoelectric material having a first surface proximate the substrate, and a second surface distal from the substrate. The firs...  
WO/2003/052927A1
A film bulk acoustic resonator is formed on a substrate having a major surface. The film bulk acoustic resonator includes an elongated stack. The elongated stack includes a layer of piezoelectric material positioned between a first condu...  
WO/2003/052928A1
The invention relates to a method for production of a piezoelectrical oscillator circuit with thin film technology, whereby the oscillator circuit has a fixed resonant frequency and a number of layers (112a, 112b, 114, 116a, 116b). First...  
WO2002061833A3
The aim of the invention is to use a slow dissolving ceramic substrate for components mounted according to the Flip-Clip method, particularly surface wave components, whereby multi-layered metallisations are optionally produced thereon b...  
WO/2003/044857A1
A piezoelectric vibrating device, comprising a ceramic package (1) having an upwardly opening recessed part, a crystal vibrating plate (3) stored in the recessed part of the ceramic package (1), and a metal cover (2) connected to the ope...  
WO/2003/043189A2
The invention concerns a method for adjusting the operating gap of two mechanical elements of a substantially planar mechanical structure obtained by micro-etching. The method consists in attributing (A) to one of the elements (E) a fixe...  
WO/2003/043188A1
The invention relates to a BAW resonator comprising a substrate (102), a first electrode (108) which is arranged on a surface (106) of the substrate (102), a piezoelectric layer (112) which is at least partially arranged on the first ele...  
WO2003028212A3
A micro-electromechanical (MEM) resonator is described that includes a substrate, a microbridge beam structure coupled to the substrate and at least one electrode disposed adjacent to the microbridge beam structure to induce vibration of...  
WO/2003/041273A1
The present invention provides a filter device comprising: a substrate having a top surface and a bottom surface; at least one acoustic wave situated on the top surface of the substrate, wherein the bottom surface of the substrate is rou...  
WO/2003/036736A2
Mass distribution within programmable surface control devices is controlled by the presence or absence of an electrodeposition of metal and/or metal ions from a solid solution upon application of a suitable electric field. One such progr...  
WO/2003/036735A2
Programmable surface control devices whose physical features, such as surface charcteristics and mass distribution, are controlled by the presence or absence of an electrodeposition (40) of metal and/or metal ions from a solid solution u...  
WO/2003/032484A1
An encapsulating method for sensitive components is disclosed, in which a film, in particular a plastic film is laminated over the whole surface of an arrangement with a flip-chip style component mounted on a support. A plastic mass is t...  
WO2002093738A3
A nanomechanical actuator/oscillator system (10) comprises a substrate (12) having a first electrode (14) and a second electrode (16) and a nanobimorph (18) which includes first and second self-assembled nanotubes (20, 22). System (10) i...  
WO/2003/032485A1
A surface acoustic wave device in which the interval between electrodes is enlarged by partially cutting the common part and the strip part of the electrode of a reflector. Since the effect of the quantity of electrostatic charges genera...  
WO/2003/030358A1
The invention relates to a method for the production of a piezo-electrical component, comprising at least two stacked crystal filters. A piezo-electric component comprising two stacked crystal filters, directly connected to each other by...  
WO/2003/028211A2
A resonator having temperature and electronic compensation. The resonator has several layers on a substrate having opposite thermal coefficients of the sound velocity for temperature compensation. Also, the frequency of the resonator is ...  
WO/2003/028212A2
A micro-electromechanical (MEM) resonator is described that includes a substrate, a microbridge beam structure coupled to the substrate and at least one electrode disposed adjacent to the microbridge beam structure to induce vibration of...  
WO/2003/023957A1
A resonator (10(2)) includes a member (14(1)) with an embedded charge (15), at least one input electrode (16(2)), at least one output electrode (20(2)), and at least one common electrode (16(1), 20(1)). The input and output electrodes (1...  
WO2002007234A9
A lens-line type piezoelectric device thinner than the manufacture limit thickness, which is conventionally difficult to manufacture, and a method for manufacturing the same. The piezoelectric device has a vibrating part of at least two ...  
WO/2003/017364A1
A method of producing an electronic device which includes an enclosure consisting of an insulation ceramic substrate and a lid member covering the surface of the ceramic substrate, and at least one electronic element mounted inside the e...  
WO/2003/015266A1
A tunable impedance matching circuit is provided for tuning an active device, such as, e.g., a field effect transistor, in a RF power amplifier circuit. The matching circuit includes an adjustable length transmission line for electricall...  
WO/2003/005576A1
The invention relates to a frequency-tunable resonator comprising a base body with at least one piezoelectric layer (2) and at least one semiconducting layer (1,3). The electrodes (E1, E2) that are configured on opposing principal surfac...  
WO/2003/005577A1
A method for manufacturing a surface acoustic wave device comprising a first conductive pattern and a second conductive pattern having different thicknesses on the same piezoelectric substrate. The surface acoustic wave device having a p...  
WO/2003/002450A2
A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducin...  

Matches 501 - 550 out of 17,892