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Patent Searching and Data


Matches 501 - 550 out of 18,145

Document Document Title
WO/2004/059836A2
A longitudinal mode resonator that includes a substrate and a bar that is suspended relative to the substrate. The bar is suspended such that it is free to expand and contract longitudinally in response to the application of an electric ...  
WO/2004/059837A1
An electronic component for improving temperature characteristics and electric characteristics, comprising a substrate (1), an interdigital electrode (2) provided on the top surface of the substrate (1), and a protection film (4) coverin...  
WO/2004/055875A1
A film structure of a ferroelectric single crystal which can be beneficially used in the fabrication of high-performance electric or electronic parts or devices is prepared by adhering a ferroelectric single crystal plate to a substrate ...  
WO/2004/053431A3
The transducer (1) comprises an electrically conductive resonator element (20) extending in a longitudinal direction having a length (l). It can be elastically deformed by an electrically conductive actuator (30) such that the elastic de...  
WO/2004/053431A2
The transducer (1) comprises an electrically conductive resonator element (20) extending in a longitudinal direction having a length (l). It can be elastically deformed by an electrically conductive actuator (30) such that the elastic de...  
WO/2004/054089A1
A piezoelectric oscillator capable of being downsized by reducing a plane size. In a laminate lead frame (50) comprising two lead frames (30, 40), a lead (32) for connection with a piezoelectric oscillation element (10) is formed on an u...  
WO2004027796A9
A micro-electro-mechanical system (MEMS) capacitive resonator (200) is disclosed and methods for manufacturing the same. In one embodiment, the MEMS capacitive resonator (200) comprises a semiconductor resonating member (208, 210) and a ...  
WO/2004/050545A1
A micromachine for a high frequency filter having a high Q factor and a frequency band which is high. A micromachine (1) comprising an output electrode (7) disposed on a board(5), an interlayer insulation film (9) covering the board (5) ...  
WO2004021398A3
One embodiment disclosed relates to a method (100) for sealing an active area of a non-silicon-based device on a wafer. The method includes providing (104) a sacrificial material over at least the active area of the non-silicon-based dev...  
WO2003079439A3
The invention relates to a method for connecting a connecting surface of a first silicon wafer [WA1] with a connecting surface of a second silicon wafer [WA2] so as to form an insulated cavity after assembly, at least one of the two sili...  
WO2003084861A3
The electronic device (100) comprises an electrical element (30), for instance a MEMS capacitor or a BAW filterin a cavity (37) that is protected from the environment by a cover (38). The cover (38) is a patterned layer which is mechanic...  
WO/2004/038914A1
A piezoelectric vibrator is characterized by having a multilayer structure wherein both major surfaces of a piezoelectric plate (1) are respectively provided with a silicon oxide film (3) having a generally equal thickness as a dielectri...  
WO/2004/036744A2
A film bulk acoustic resonator filter may be formed with a plurality of interconnected series and shunt film bulk acoustic resonators formed on the same membrane. Each of the film bulk acoustic resonators may be formed from a common lowe...  
WO/2004/032321A1
A surface-mounted SAW device designed to form an airtight space below an IDT electrode on the lower surface of an SAW chip by coating the outer surface of the SAW chip with heated and softened sheet resin and by filling resin into the bo...  
WO/2004/030047A1
A method of producing a lithium tantalate single crystal substrate for a surface acoustic wave device is provided which includes the step of: reducing a polarized lithium tantalate single crystal substrate by heating below a Curie temper...  
WO/2004/030208A2
A film bulk acoustic resonator formed on a substrate (710) includes a layer of piezoelectric material (735) having a first major surface, and a second major surface sandwiched between a first conductive (732) and a second conductive laye...  
WO/2004/030046A1
A method of producing a lithium tantalate single crystal substrate for a surface acoustic wave device is provided which includes the steps of: reducing a lithium tantalate single crystal ingot or substrate by heating above a Curie temper...  
WO/2004/030113A1
The present invention relates to piezoelectric vibrators such as a resonator used as a timing element, discriminator, filter or the like, and fabricating methods thereof. The piezoelectric vibrators of the present invention may be fabric...  
WO/2004/027796A2
A micro-electro-mechanical system (MEMS) capacitive resonator (200) is disclosed and methods for manufacturing the same. In one embodiment, the MEMS capacitive resonator (200) comprises a semiconductor resonating member (208, 210) and a ...  
WO/2004/025832A1
A bulk acoustic wave resonator comprising a substrate (5), a Bragg reflector (4), a top (1) and a bottom (3) electrode and a piezoelectric layer (2) with means for suppression of the pass-band ripples in a bulk acoustic wave filter. The ...  
WO/2004/021398A2
One embodiment disclosed relates to a method (100) for sealing an active area of a non-silicon-based device on a wafer. The method includes providing (104) a sacrificial material over at least the active area of the non-silicon-based dev...  
WO/2004/021568A1
The invention relates to resonator, which operates with acoustic volume waves and which is based on a known layer structure placed over a substrate. According to the invention, the layer structure, together with resonators contained ther...  
WO/2004/019426A1
A piezoelectric layer and an electrode layer are formed on a silicon substrate, and a piezoelectric body and an electrode are patterned by photolithography. The silicon substrate is etched to form a structure. A protective film is formed...  
WO/2004/019490A1
The invention relates to an encapsulated component comprising a carrier substrate and at least one chip that is disposed on the upper side of said carrier substrate and is electrically connected thereto by means of electrically conductiv...  
WO/2004/017517A1
A surface acoustic wave device in which surface acoustic wave resonators are connected in a ladder, and roundabout routing of a short bar is possible even if the degree of freedom of layout is low. The surface acoustic wave device is suc...  
WO/2004/014784A1
A micromachine for use in a high-frequency filter having a high Q value and a higher frequency band. A micromachine (20) characterized by comprising an output electrode (7) provided on a substrate (1), an interlayer insulation film consi...  
WO/2004/015862A2
An acoustic resonator of one inventive aspect includes a substrate, at least one generally crystalline primer layer provided on the substrate either directly or on top of one or more intermediate layers, a generally smooth and generally ...  
WO/2004/013893A2
A piezoelectric resonator (205) is disclosed. In one embodiment the piezo electric resonator includes a semiconductor material (206) an electrode (210) and a piezo electric material (208) disposed between the semiconductor material and t...  
WO/2004/012332A1
A piezoelectric component in which the size can be reduced while suppressing deterioration of characteristics furthermore, and its manufacturing method. The surface acoustic wave device (21) comprises a surface acoustic wave element (16)...  
WO/2004/012331A1
A piezoelectric component, e.g. a surface acoustic wave device or a piezoelectric thin film filter, in which the size can be reduced while suppressing deterioration of characteristics furthermore, and its manufacturing method. In the sur...  
WO/2004/012330A1
A piezoelectric component capable of being downsized and enhanced in degree of freedom in positioning an external terminal, and a production method therefore. A surface acoustic wave device comprises an SAW element (6) having IDTs (2) fo...  
WO/2004/011366A1
A micromachine (20) for a high frequency filter having a high Q value and a high frequency band, comprising an input electrode (7b), an output electrode (7a), and a support electrode (7c) installed on a substrate (4), and a band-shaped v...  
WO/2004/010577A1
When a tuning fork type quartz wafer (1A) having trenches (11c, 12c) in the leg parts (11, 12) is formed by etching a quartz substrate (2), a machining precision of the trenches (11c, 12c) is enhanced in terms of the depth dimension by p...  
WO/2004/006431A1
A SAW filter (10) includes a piezoelectric substrate (16) of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate (16) is bonded to a surrogate substrate...  
WO2003057618A3
The invention relates to a method for producing a protective covering for a component provided on a substrate (102), according to which at least one sacrificial structure is produced on the substrate (102). The sacrificial structure cove...  
WO/2004/001964A1
A thin film piezoelectric device includes a substrate (12) having a via hole (22) and a piezoelectric laminated structure (14) consisting of a lower electrode (15), a piezoelectric film (16), and an upper electrode (17) formed on the sub...  
WO/2004/001849A2
A method for fabricating a quartz nanoresonator which can be integrated on a substrate, along with other electronics is disclosed. In this method a quartz substrate is bonded to a base substrate. The quartz substrate is metallized so tha...  
WO2003036736A3
Mass distribution within programmable surface control devices is controlled by the presence or absence of an electrodeposition of metal and/or metal ions from a solid solution upon application of a suitable electric field. One such progr...  
WO/2003/103143A1
A method for tuning a filter to a desired frequency using successive approximation. Elements of the filter are selected according to a control code used to vary the filter's oscillation frequency. The control code is set to the middle of...  
WO2003043189A3
The invention concerns a method for adjusting the operating gap of two mechanical elements of a substantially planar mechanical structure obtained by micro-etching. The method consists in attributing (A) to one of the elements (E) a fixe...  
WO/2003/100969A1
The invention relates to a method of producing a microsystem structure with lateral gaps and the corresponding microsystem structure. The inventive method consists in: (a) depositing a first sacrificial layer (CS1) on the substrate (S); ...  
WO/2003/100799A1
Hybrid electronic circuit structure comprising a low-temperature cofired ceramic (LTCC) tape and a ferromagnetic device, said device being formed by a ferromagnetic material, wherein said ferromagnetic material comprises a ferromagnetic ...  
WO2003028211A3
A resonator having temperature and electronic compensation. The resonator has several layers on a substrate having opposite thermal coefficients of the sound velocity for temperature compensation. Also, the frequency of the resonator is ...  
WO2003002450A3
A method comprising over an area of a substrate, forming a plurality of three dimensional first structures; following forming the first structures, conformally introducing a sacrificial material over the area of the substrate; introducin...  
WO2003036735A3
Programmable surface control devices whose physical features, such as surface charcteristics and mass distribution, are controlled by the presence or absence of an electrodeposition (40) of metal and/or metal ions from a solid solution u...  
WO/2003/088482A1
The invention relates to acoustic wave interface devices. The subject of the invention is a hybrid module comprising electronic components (F), which are disposed on a base (E), and acoustic wave interface components. Each acoustic wave ...  
WO/2003/088475A1
The invention relates to the production of acoustic wave interface components comprising two substrates separated by an interface area including transduction devices. Said invention concerns an interconnection device located on the later...  
WO/2003/085739A1
A cavity (12) is provided in the first major surface (11a) of a substrate (11) comprising a multilayer ceramic substrate and a resin substrate, and a crystal oscillator (13) is contained in the cavity (12). Surface mounting chip componen...  
WO2003065576A3
The invention provides a method of manufacturing piezoelectric wafers of surface acoustic wave (SAW) identification tags. In one embodiment, the method includes: (1) using a master reticle to form, on each of the piezoelectric wafers, wa...  
WO/2003/084861A2
The electronic device (100) comprises an electrical element (30), for instance a MEMS capacitor or a BAW filterin a cavity (37) that is protected from the environment by a cover (38). The cover (38) is a patterned layer which is mechanic...  

Matches 501 - 550 out of 18,145