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WO/2022/179827A1 |
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt.% of a) at least one oxetane compound according to Formula (I) wherein: R1 and R2 ar...
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WO/2022/179826A1 |
The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt.%, of a) at least one oxetane compound according to Formula (I) wherein: R1, R2, R3,...
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WO/2022/182342A1 |
An electrochemical oxygen sensor includes a sensing surface having a working electrode and a reference electrode, a hydrophilic layer formed from an oxygen diffusion-limiting layer emulsion overlaying the working electrode and a hydropho...
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WO/2022/178700A1 |
This invention relates to a photocurable adhesive composition comprising at least one first hydroxyl terminated epoxidized unsaturated polyolefin having an epoxide equivalent weight less than 250 g/eq; at least one second hydroxyl termin...
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WO/2022/177283A1 |
The present invention relates to a coating composition, for a metal, with improved oil resistance and adhesiveness and a preparation method therefor, and a metal article coated with the composition and, more specifically, to a compositio...
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WO/2022/177006A1 |
The present invention provides: a resin composition containing an elastomer, an epoxy compound and a thermal polymerization initiator; a cured material of the resin composition; a laminate comprising a substrate film and a transparent re...
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WO/2022/176324A1 |
Provided are an epoxy resin that can increase durability when used together with a rubber material, and a production method for the epoxy resin. The present invention is characterized in that a diene polymer is grafted to the main chai...
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WO/2022/172933A1 |
[Problem] To provide: a liquid composition which is excellent in terms of dispersion stability and handleability, contains a powder of a tetrafluoroethylene-based polymer, and is preferably a resist composition; a method for producing sa...
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WO/2022/169796A1 |
Waterborne dispersions including crosslinkable multistage polymeric particles useful in coating compositions are provided. The multistage particles have a last-formed layer that includes a diketone functionality that is capable of crossl...
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WO/2022/167411A1 |
The present application is directed to a rubber composition comprising at least one liquid epoxy resin, at least one rubber, at least at least one curing agent for epoxy resins, at least one substituted urea and at least one azo compound...
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WO/2022/168815A1 |
[Problem] To provide: a composition for curable resins for obtaining a cured product that is reduced in the molding shrinkage and linear expansion coefficient, while having high heat resistance, the composition for curable resins having ...
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WO/2022/168620A1 |
Provided is a curable composition that can suppress thermal degradation of a tetraazaporphyrin compound so that a lens having high visibility and excellent anti-glare and contrast enhancement effects can be achieved. The curable compos...
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WO/2022/168866A1 |
The present invention provides a thermoplastic polyester resin composition having distinctive resin viscosity characteristics required for extrusion molding, exceptional extrusion stability and extrusion molding properties, and optimal f...
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WO/2022/168694A1 |
The present invention provides an encapsulating resin composition for use in encapsulating a GaAs chip, wherein the die shear strength measured under condition 1 is more than or equal to 1.5 N/mm2. (Condition 1) The sealing resin composi...
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WO/2022/162805A1 |
The present invention provides: an insulating resin composition which improves the surface tactility of a cured object; a cured product of the composition; a rotary machine coil having favorable surface tactility; and a rotary machine us...
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WO/2022/163738A1 |
The present invention provides: organic hollow particles that enable a low electric permittivity, a low dielectric loss tangent, and a low thermal expansion rate with respect to various electronic materials; and a resin composition inclu...
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WO/2022/163555A1 |
The present invention addresses the problem of providing a production method having higher safety and efficiency in a method for producing a target benzoxazine compound that does not create a sudden temperature rise or smoke when introdu...
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WO/2022/163795A1 |
The present invention provides a curable composition comprising: a vinyl group-bound monoepoxy compound represented by formula (1); and a radical polymerization initiator.
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WO/2022/164480A1 |
A thermosetting resin composition including a thermosetting resin, a core-shell polymer, a low-density filler, and a curing agent is provided. The composition includes from 0.5 to 15 wt.% of the core shell polymer with respect to the wei...
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WO/2022/161837A1 |
The present invention relates to the use of boronic acids to increase the storage stability of epoxy resin compositions and to epoxy resin compositions comprising an epoxy resin, a hardener and a boronic acid.
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WO/2022/163609A1 |
[Problem] The present invention addresses the problem of finding: an electrical insulating layer for a metal base substrate used for electronic devices, in particular on-board electronic devices, the electrical insulating layer having a ...
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WO/2022/158385A1 |
[Problem] To provide a resin composition for electrical/electronic encapsulation which has excellent oil resistance and insulating properties, while retaining the intact flowability. [Solution] A resin composition comprising a polyester ...
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WO/2022/158384A1 |
[Problem] To provide a resin composition for an electrical/electronic encapsulation, the composition having excellent oil resistance and insulation performance without a reduction in fluidity. [Solution] Provided is a resin composition t...
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WO/2022/158755A1 |
The present invention relates to a primer composition for a glass adhesive, comprising: a first silane polymer comprising an epoxy group and an amino group; a second silane polymer comprising a mercapto group; an epoxy resin; an acrylic ...
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WO/2022/152851A1 |
The present invention relates to a composition, preferably for bonding metal sheets, comprising: a. 1 molar part of at least one linear epoxy resin having an average epoxy equivalent weight of 600 to 5000 g/mol and an epoxy functionality...
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WO/2022/151929A1 |
Disclosed in the present invention is a production method for a large-diameter engineering pipeline. The production method comprises the following steps: (1) preparing a large-diameter engineering pipeline prefabricated body; (2) deformi...
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WO/2022/152942A1 |
The invention relates to epoxy adhesive compositions comprising low glass transition temperature elastomeric core nanoparticles, a process for the preparation thereof, and uses thereof, in particular at a low temperature.
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WO/2022/153807A1 |
The present invention addresses the problem of providing: a curable composition from which it is possible to form a thermally conductive material having excellent thermal conductivity; a thermally conductive material; a thermally conduct...
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WO/2022/151517A1 |
Disclosed are a circuit laminate film for wafer-level packaging and sealing, a preparation method therefor, and an application thereof. The laminate film comprises 40-60 parts by mass of a first-type epoxy resin, 15-30 parts by mass of a...
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WO/2022/147941A1 |
A dialkyl phosphinate preparation method, comprising: using dialkyl phosphinate and a halogenated compound as raw materials, and reacting under the action of a catalyst to obtain dialkyl phosphinate, the catalyst being one or more of a p...
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WO/2022/147942A1 |
A dialkyl phosphonate compound containing an active epoxy group, the preparation and application thereof in serving as a flame-retardant agent and preparing a flame retardant material. The structure is as shown in any one of the followin...
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WO/2022/149603A1 |
This method for producing a thermosetting resin composition has: a desolventizing step for obtaining a second mixture from a first mixture which contains a thermosetting resin, a curing agent, and a slurry containing an inorganic filler ...
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WO/2022/149601A1 |
This sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unfired hydrotalcite compound in which the molar ratio (Mg/Al) of Mg ions and Al ions exceeds 3.0.
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WO/2022/149594A1 |
A method for producing a thermosetting resin composition according to the present invention comprises a primary kneading in which a thermosetting resin is kneaded, and a secondary kneading in which, after the primary kneading, a curing a...
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WO/2022/149602A1 |
This thermosetting resin composition contains a thermosetting resin, a curing agent, and an inorganic filler material, wherein: in a particle size distribution on a volume basis as measured by a particle size distribution measurement dev...
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WO/2022/145628A1 |
The present invention relates to a powder coating composition which can achieve a clear structure pattern, and has excellent pin hole prevention properties and thermal resistance.
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WO/2022/142325A1 |
An epoxy resin composition and a transparent composite material comprising same, and a laminated board. The epoxy resin composition comprises an epoxy resin A and an epoxy resin B; the refractive index of the epoxy resin A is 1.54-1.8 an...
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WO/2022/146731A1 |
A thermoset resin composition and composite materials containing reinforcement fibers impregnated with the thermoset resin composition. The thermoset resin composition contains: (a) a combination of multifunctional epoxy resins; (b) 4,4'...
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WO/2022/145447A1 |
[Problem] To provide a chlorinated-polyolefin composition, especially one excellent in terms of durability including acid resistance and heat resistance. [Solution] A chlorinated-polyolefin composition which comprises a chlorinated polyo...
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WO/2022/141817A1 |
The present invention provides a resin composition and an adhesive film and a cover film comprising same. The resin composition comprises the following components in parts by weight: 40-80 parts of a polyamide imide resin, 10-40 parts of...
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WO/2022/145446A1 |
[Problem] The present invention relates to a chlorinated polyolefin composition, and more specifically relates to a chlorinated polyolefin composition having excellent durability properties such as acid resistance, alkali resistance, and...
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WO/2022/141816A1 |
Provided are a resin composition, a resin adhesive film, and an application thereof. The resin composition comprises the following components in parts by weight: 80-120 parts an epoxy resin, 1-20 parts a carbodiimide compound, 30-130 par...
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WO/2022/139697A1 |
The invention relates to a resin production method comprising providing a hardener and a reactive thinner in a container (10, 20); adding a defoamer (30) to the provided hardener and reactive thinner and conducting a first mixing process...
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WO/2022/138807A1 |
The present invention addresses the problem of providing a curable resin composition that is superior as a two-component or multi-component epoxy resin composition as compared to the prior art. Provided is a curable resin composition inc...
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WO/2022/134214A1 |
A continuous electrophoretic deposition modified carbon fiber reinforced multi-matrix composite material, composed of 30-55% by volume fraction of carbon fiber, 3-25% by volume fraction of inorganic powder, and 20-67% by volume fraction ...
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WO/2022/133880A1 |
The present invention relates to a one-component thermosetting epoxy resin adhesive, comprising a) at least one epoxy resin A of the formula (II) wherein the substituents R' and R" independently of one another are either H or CH 3 and th...
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WO/2022/138432A1 |
A purpose of the present invention is to provide a thermosetting epoxy resin composition that manifests latency at a temperature at which the thermosetting resin cures and has an excellent curing rate, and molded articles obtained by the...
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WO/2022/138120A1 |
Provided is a curing agent which comprises a curing catalyst and an alicyclic polyolefin resin disposed on a surface of the curing catalyst, wherein the curing catalyst is either porous polyurea particles having an aluminum chelate compo...
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WO/2022/138808A1 |
The present invention addresses the problem of providing a resin composition having excellent handleability. A resin composition according to one aspect of the present invention comprises polymer particles (A) and a matrix resin (B), whe...
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WO/2022/136789A1 |
The invention relates to the use of a powder comprising at least one polyamide and at least one epoxy resin for producing an electrically insulating coating on a surface. The invention also relates to an electricity transmitting componen...
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