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WO/2023/130082A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2023/130088A1 |
A method for forming an abrasive article via an additive manufacturing technique including forming a layer of powder material comprising a precursor bond material and abrasive particles, compacting at least a portion of the layer to form...
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WO/2023/126761A1 |
A conditioning disk with microfeatures is described. More specifically, a conditioning disk with at least one discrete abrasive element and at least one microfeature. The asymmetry of the at least one microstructure may enable, based on ...
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WO/2023/126271A1 |
The invention relates to a grinding means, in particular a grinding disc, for grinding a workpiece, having an, in particular flexible, support element (13), having a plurality of grinding elements (15) for grinding a workpiece, and havin...
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WO/2023/127601A1 |
The present invention predicts the occurrence of a waviness anomaly. This waviness prediction device comprises: a data input unit for receiving input of waviness data which is obtained by measuring the waviness of a polishing target surf...
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WO/2023/130015A1 |
An abrasive article can include a core and an abrasive component attached to the core. The abrasive component may include a body including a leading end and a trailing end, wherein the leading end has a width greater than a width of the ...
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WO/2023/123603A1 |
Disclosed in the present invention is a wafer post-processing device, comprising a driving mechanism, which vertically clamps a wafer and drives same to rotate; a supply arm, which swings on a side face of the wafer and supplies liquid t...
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WO/2023/123207A1 |
The present invention aims to provide a process method for improving the surface smoothness of a combustion turbine blade profile surface, and is capable of improving the smoothness of a blade profile surface without destroying traces fo...
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WO/2023/127898A1 |
In one embodiment, provided is a polishing liquid composition for a silicon oxide film, the polishing liquid composition being capable of improving the smoothness of a polished substrate surface while maintaining polishing speed. The p...
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WO/2023/130111A1 |
Methods for forming a polycrystalline diamond compact (PDC) drill bit from catalyst-free synthesized polycrystalline diamonds are described. The polycrystalline diamonds are deposited within a mold. In some cases, a matrix body material ...
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WO/2023/127775A1 |
[Problem] To provide a composition which maintains the hydrophilicity and does not lose dispersibility or film properties even in an environment having a thermal history, while being adaptable to the heat generation during polishing. [So...
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WO/2023/119703A1 |
The purpose of the present invention is to provide a method and apparatus for producing a semiconductor crystal wafer, the method and apparatus being capable of easily and reliably producing a semiconductor crystal wafer of high quality....
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WO/2023/117745A1 |
The present invention relates to a method of making a diamond composite wherein a diamond green body is together with an infiltrant is placed onto a graphite crucible and wherein the graphite crucible is placed onto a carbon source such ...
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WO/2023/118477A2 |
The present invention relates to a method of producing gelatine, the method comprising the steps of: providing animal material containing collagen; cutting the animal material with at least one fluid cutting jet to form animal material s...
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WO/2023/121152A1 |
The present invention relates to a polishing device for delayering, the polishing device comprising: a stage which is installed to move along the X-axis and the Y-axis, and is rotatable about its own axis; a holder installed above the st...
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WO/2023/115867A1 |
A protection device for a telescopic cold cutting machine for a coal mine, and a method of use. The protection device comprises a handheld device and a protection support (1), wherein the protection support (1) is internally provided wit...
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WO/2023/120410A1 |
In the present invention, used is a blast medium that contains, as a main component, a first powdery/particulate substance which results from crushing a substance having a hardness equal to or less than the hardness of a member to be res...
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WO/2023/119847A1 |
The present invention relates to a substrate processing method and a substrate processing device for processing a substrate such as a wafer. In this substrate processing method, a substrate (W) having a notch (Nw) is rotated and moved in...
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WO/2023/122121A1 |
A device for providing abrasive to a cutting head in a liquid jet cutting system can include an abrasive inlet configured to receive abrasive from an abrasive source, an abrasive outlet downstream from the abrasive inlet and configured t...
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WO/2023/116255A1 |
A target distance adjustable nozzle and method suitable for abrasive water jet rail polishing, comprising a nozzle body (1), an outer cover (2), a lower baffle (3), a support frame (5), and an upper baffle (6) that are provided on the sa...
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WO/2023/119951A1 |
The present invention provides a double side polishing apparatus which is provided with: upper and lower polishing plates, to each of which a polishing cloth is bonded; a slurry supply mechanism which supplies a slurry to the space betwe...
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WO/2023/117082A1 |
The invention relates to a liquid abrasive cutting system comprising a nozzle arrangement (6) which has at least one liquid nozzle (24) and at least one gas outlet nozzle (34) located to the side of the liquid nozzle (24), the outlet dir...
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WO/2023/119684A1 |
The purpose of the present invention is to provide a method and a device for producing a semiconductor crystal wafer that make it possible to easily and reliably produce a semiconductor crystal wafer of high quality. This method is for...
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WO/2023/118459A1 |
The invention relates to a file (1) for creating a non-planar contour, in particular with transverse curvature, on a workpiece (11), comprising a longitudinal axis (3), at least one file element (5, 6) with an abrasive processing surface...
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WO/2023/116555A1 |
A large-area quartz wafer grinding apparatus and method. The grinding apparatus is provided with a base, supporting arm assemblies, a grinding disc, a rotating seat, a rotating motor, a carrying block and a disc trimming ring; the base i...
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WO/2023/120869A1 |
A retainer ring according to one embodiment comprises: a core part formed in a ring shape and including a metal material; and an injection part formed around the core part through molding so as to surround the core part, wherein the core...
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WO/2023/115946A1 |
A trimming device for production of a building composite wood formwork, comprising a workbench (1), a dust collecting box (3), and a rotating motor (6). The dust collecting box (3) is mounted on one side of the upper end of the workbench...
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WO/2023/115111A1 |
A method of operating an automated machine including operating an oscillating tool over a surface of a workpiece in order to provide a finish to the surface, switching off oscillating motion of a head of the tool, recalibrating dimension...
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WO/2023/119954A1 |
This method for cutting a silicon ingot is characterized in that a silicon ingot is cut by running a fixed-abrasive wire at a speed which has a maximum speed of at least 1,200 m/minute while supplying a coolant thereto which has a water ...
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WO/2023/115886A1 |
Provided are a method and device for processing a special-shaped curved glass contour. The method comprises the following steps: A: obtaining a theoretical track L; B: respectively calculating a transformation matrix Tt m between a tool ...
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WO/2023/112830A1 |
An information processing device (5) comprises: an information acquisition unit (500) that acquires a polishing process condition including top ring state information, polishing table state information, and polishing fluid supply nozzle ...
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WO/2023/112548A1 |
The present invention relates to a method for polishing a substrate by pressing an abrasive tape against a substrate such as a wafer. This method for polishing a substrate: stores in a database (21a) an actual polishing condition for a s...
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WO/2023/113255A1 |
The present invention provides a double-sided adhesive tape for adhering a polishing pad, and a chemical-mechanical polishing apparatus using the adhesive tape, the adhesive tape comprising: an upper release film layer; a first adhesive ...
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WO/2023/110294A1 |
The invention relates to a method for recycling electrode material from used batteries or from discard material from battery production, and specifically for detaching and recovering active electrode material (4) from anodic or cathodic ...
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WO/2023/110939A1 |
The invention relates to a method for producing spectacles lenses (10), in which method, starting with a blank, via a semifinished product, a finished product, which has predetermined surface geometries on a front face (12) and a rear fa...
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WO/2023/114196A1 |
The present invention relates to a method of finalizing a 3D printed dental prosthesis by subjecting the dental prosthesis to a pressurized water stream comprising glass beads. Also disclosed is a 3D printed dental prosthesis or componen...
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WO/2023/112490A1 |
The present invention is a workpiece cutting method using a wire saw, said method including: a step for cutting a first cylindrical workpiece by using a fixed abrasive grain wire; after completion of the step for cutting the first cylind...
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WO/2023/114068A1 |
An optical fiber polisher includes a polishing mechanism, a platen, and a memory for storing operational parameters entered by a user. The optical fiber polisher includes a processor to control a stopping position of the platen at an end...
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WO/2023/109579A1 |
The present invention relates to the field of grinding and polishing, and provides a paint surface reciprocating grinding and polishing abrasive paper system. The paint surface reciprocating grinding and polishing abrasive paper system s...
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WO/2023/112680A1 |
This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the s...
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WO/2023/111831A1 |
Machine (1) for smoothing and/or polishing articles, preferably in slab form, by using predetermined operating conditions, comprising a plurality of spindles (6) mounted on a machining station (4) and having one or more abrasive tools (8...
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WO/2023/110414A1 |
The invention relates to treatment of a thread cutting tap (1) comprising a thread cutting portion (2) including a plurality of cutting lands (3) separated by flutes (4), wherein the thread cutting portion (2) comprises a chamfered secti...
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WO/2023/112464A1 |
This cutting device comprises a table, a cutting mechanism, a holding mechanism, and a water isolation/discharge mechanism. The table or the holding mechanism is connected to a dry vacuum pump through a suction path. The water isolation/...
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WO/2023/111529A1 |
A machine tool (30) for machining two workpieces (48, 50) comprises a machine base (32), a first tool mount (37), first and second workpiece mounts (44, 46) with respective drives (69, 71), and a controller (72) arranged to control the f...
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WO/2023/106358A1 |
The present disclosure relates to chemical-mechanical polishing (CMP) compositions for polishing polycrystalline silicon carbide-containing surfaces. More particularly, the polishing compositions are in the form of a slurry with a pH of ...
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WO/2023/106905A1 |
The present invention relates to machining devices, especially to the devices for grinding, polishing and cleaning tube like members. A machining device (1) comprises a support (2) with a motor; a split support disc (10) fixed to the sup...
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WO/2023/105633A1 |
[Problem] To appropriately perform setting of a dressing timing that has repeatability, effectively using experience and knowledge of a skilled expert regarding dressing timings for grinding wheels. [Solution] The problem is addressed by...
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WO/2023/105355A1 |
A robotic abrading system that includes a robotic tool coupled to a robotic arm. The robotic arm is configured to move the robotic tool into an abrading position with respect to a workpiece. The system also includes a backup pad coupled ...
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WO/2023/106016A1 |
Provided is a wafer manufacturing method for obtaining a wafer from an ingot (2) having a c-axis provided in a state in which a center axis (L) is tilted in an off-angle direction (Dθ) by an off-angle greater than 0 degree, the method c...
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WO/2023/107325A1 |
A carrier assembly for holding a hose that includes a main body having a first portion movingly engaged with a second portion. There is a first guide rail disposed on at least one of the first portion and the second portion. Either the f...
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