| Document |
Document Title |
|
WO/2020/064635A1 |
In a method for smoothing a surface region (1) of a plastic component, in particular an additively manufactured plastic component, the surface region (1) to be smoothed is remelted in an edge layer with energetic radiation. During proces...
|
|
WO/2020/066151A1 |
A saw wire 2 has a wavy form. The form has a shape composed of a first wave component 4, a second wave component 6, and a third wave component 8. The wavelength WL1 of the first wave component 4 is different from the wavelength WL2 of th...
|
|
WO/2020/065687A1 |
A multi-spindle operating head comprises a central structure (10) rotating orthogonally to a work plane and supporting a plurality of electro spindles distributed on a circumference with the same angular distance, the rotation axis of ea...
|
|
WO/2020/065689A1 |
An operating head with electro spindles comprises a central structure (10) rotating orthogonally to a work plane, able to support a plurality of electro spindles distributed on a circumference with the same angular distance, the axis of ...
|
|
WO/2020/065049A1 |
The invention concerns a semi-finished lens (10) comprising a first optical surface (12) comprising a surface design associated with a first reference system and a second optical surface (14) to be manufactured, the first and second opti...
|
|
WO/2020/068271A1 |
A method and apparatus for a separable assembly in a platen assembly is provided. The two components of the separable assembly couple together through the first coupling member and the second coupling member, and the coupling is magnetic...
|
|
WO/2020/068629A1 |
A method of forming a carrier wafer includes the steps of: lapping a first surface and a second surface of the carrier wafer such that the carrier wafer is substantially flat, the carrier wafer comprising a glass, glass-ceramic or cerami...
|
|
WO/2020/067401A1 |
The purpose of the present invention is to provide: a polishing pad which is capable of reducing the occurrence of scratches; and a method for producing a polished article. A polishing pad which is provided with a polyurethane sheet as a...
|
|
WO/2020/066671A1 |
Provided are: a polishing pad useful for removing undulations in a curved resin-coated surface at a high polishing rate; and a polishing method using the polishing pad. A polishing pad (10) according to an aspect of the present invention...
|
|
WO/2020/062701A1 |
A float polishing device and method for a small-size complex surface part. A rotating shaft (1) in the float polishing device is connected to a motor by means of a disc-type elastic spring coupling (6), and a floating device (4) and a pa...
|
|
WO/2020/067536A1 |
This blast machining device comprises: a nozzle for jetting an abrasive material together with compressed air; a retention part that retains the abrasive material in the interior thereof; a roller that is cylindrical in shape, has a groo...
|
|
WO/2020/066873A1 |
Provided is a method that is for polishing a silicon wafer by a polishing device using a carrier holding the silicon wafer, and that can reduce wear on the carrier. In this polishing method, a polishing liquid used in the polishing devic...
|
|
WO/2020/065723A1 |
A slurry for polishing a carbon-containing silicon oxide, the slurry containing abrasive grains and a liquid medium, wherein the abrasive grains contain a first particle and a second particle in contact with the first particle, the secon...
|
|
WO/2020/062581A1 |
A high-pressure gas-liquid grinding device comprises a horizontal working table (1), a first motor (2) vertically fixed below the horizontal working table (1), a high-pressure sealed chamber (3) provided on an upper portion of the horizo...
|
|
WO/2020/064282A1 |
The invention relates to a method for polishing a semiconductor wafer in that at least one side of the semiconductor wafer is pressed against a polishing pad secured to a rotating polishing disc in the presence of a polishing agent. The ...
|
|
WO/2020/065688A1 |
A grinding unit (100) comprises a rotating head (10) provided with abrasive oscillating blocks (B) mounted on tool supports (11) connected to a rotating casing (12), for working on flat surfaces, rotating cam means (131), (132), (133), c...
|
|
WO/2020/068345A1 |
During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least...
|
|
WO/2020/067914A1 |
A method of compensating for a contribution of conductivity of the semiconductor wafer to a measured trace by an in-situ electromagnetic induction monitoring system includes storing or generating a modified reference trace. The modifi...
|
|
WO/2020/066998A1 |
This polishing liquid is used for polishing of a siliceous substrate that has a surface roughness Ra of from 0.01 μm to 0.2 μm (inclusive). This polishing liquid contains ceria abrasive grains, silica abrasive grains and water. The ave...
|
|
WO/2020/067057A1 |
The present invention provides: a polishing composition which enables the achievement of high polishing rate and high surface quality with respect to polishing of a gallium oxide substrate; and a polishing method and a production method ...
|
|
WO/2020/058922A1 |
The tool (1, 2) for the processing of ceramic articles comprises: a cutting disk (3) movable in rotation around an axis of rotation (A) for the cut of at least one ceramic article (4); and at least one abrasive body (5) locked together i...
|
|
WO/2020/057330A1 |
A polishing and loading/unloading component module, comprising a loading/unloading module and two polishing modules; the loading/unloading module is at the middle, and the two polishing modules are located at two sides thereof, the loadi...
|
|
WO/2020/058876A1 |
A system for grit blasting an annular junction portion (2) of a pipeline (3) extending along a longitudinal axis (A) on board a laying vessel, comprises: at least one carriage (10a; 10b; 110a; 210a) configured to advance along an annular...
|
|
WO/2020/060550A1 |
A method of cleaning a component includes providing the component following the operation of the component in a high temperature environment, the component including a thermal barrier coating (TBC), cleaning the TBC of the component usin...
|
|
WO/2020/056818A1 |
Disclosed is a polishing loading and unloading component module containing a movable loading and unloading module. The polishing loading and unloading component module comprises one loading and unloading module and two polishing modules,...
|
|
WO/2020/056538A1 |
Disclosed is an automatic grinder, comprising a grinder body (1) and a sample pressing device (2) arranged on the grinder body (1), a grinding disc (3) and a water spraying device (4), wherein when the grinding disc (3) rotates, a sample...
|
|
WO/2020/060962A1 |
A translatable, ultra-high pressure liquid jet system (100) includes a translatable frame (200) configured to maintain mechanical contact with a rail (124). The liquid jet system includes a liquid jet processing head (408) affixed to the...
|
|
WO/2020/058216A1 |
The invention relates to a method for dressing a honing tool (9) comprising honing strips (1), wherein at least one honing strip (1) is dressed by means of an electroerosive method. The invention further relates to a machining unit, in p...
|
|
WO/2020/056891A1 |
Disclosed is a curved glass convex surface polishing machine, comprising a polishing device and a driving device. The driving device comprises a driving mechanism and an attachment platform (113) provided on the driving mechanism. The dr...
|
|
WO/2020/056817A1 |
A flexible module for polishing, loading and unloading a component, comprising a loading and unloading module and two polishing modules. The loading and unloading module is in the middle, and the two polishing modules are located on two ...
|
|
WO/2020/055594A1 |
Embodiments of the present disclosure generally provide methods, polishing systems with computer readable medium having the methods stored thereon, to facilitate consistent tensioning of a polishing article disposed on a web-based polish...
|
|
WO/2020/052974A1 |
The invention relates to a hand-held cutting grinder, comprising a cutting disk (11), a motor housing including a drive unit, and an arm (16) having a support arm (17) and an arm cover (18). A stop element (41) is provided for the spindl...
|
|
WO/2020/054631A1 |
The present description discloses a tool. The tool may be provided with: a motor; a power transmission mechanism connected to the motor; a housing which houses the motor and the power transmission mechanism; a tip tool holding part which...
|
|
WO/2020/055901A1 |
A smart coolant pump for a robotic or computer-controlled machine. The smart pump uses a servo motor rather than a conventional industrial motor such as an induction motor. The smart pump has inherent torque and speed sensing, and a cont...
|
|
WO/2020/054823A1 |
A polishing pad is provided that can polish a curved surface to be polished on an object to be polished and remove waviness on the curved surface to be polished by way of a polishing surface following curved surfaces having various degre...
|
|
WO/2020/054616A1 |
Provided is an electric work machine in which it is possible to limit the risk of contact between a control unit and wiring provided inside a motor housing. In the electric work machine (1A), a motor (6) and a control unit (13) are house...
|
|
WO/2020/052819A1 |
The invention relates to a cutting device having a housing (28). In this case, a driven disc-shaped cutting tool (10), mounted in the housing (28), for cutting a workpiece (12) is provided. Arranged on a circumferential side of the cutti...
|
|
WO/2020/051943A1 |
A grinding system for eliminating crack sources of an inner tapered bore of a motor rotating shaft and a grinding method therefor; the grinding system comprises a movable device (1), a pneumatic gun (2), and a clamping device; the movabl...
|
|
WO/2020/052497A1 |
Disclosed is a rechargeable angle grinder, comprising a housing (1), wherein the housing (1) has a driving shaft (6) provided therein for transferring power; a locking button (7) is movably embedded in the housing (1); the housing (1) ha...
|
|
WO/2020/055849A1 |
A wet abrasive blasting system includes a vessel having multiple outlets for dispensing slurry. A first sprayer of the system is operatively associated with a first blast control switch, and a second sprayer is operatively associated wit...
|
|
WO/2020/055571A1 |
Methods for polishing semiconductor substrates that involve adjusting the finish polishing sequence based on the pad-to-pad variance of the polishing pad are disclosed.
|
|
WO/2020/054811A1 |
Provided is a wafer mirror surface chamfering method by which corner burrs at the boundaries between main surfaces and chamfered surfaces of the wafer can be reduced. The present invention is a wafer mirror surface chamfering method by w...
|
|
WO/2020/051729A1 |
A ceramic sphere abrasive, a preparation method therefor, and use thereof. The ceramic sphere abrasive comprises the following components in mass percentages: 6-30% of grinding agent; 0.5-5% of dispersant; 15-40% of suspending agent; 10-...
|
|
WO/2020/052797A1 |
The invention relates to a slide-grinding body having two sections that come to a point and emanate from a base cross-section, wherein the geometry of the base cross-section (4) has curved flanks, the base cross-section is the largest at...
|
|
WO/2020/055538A1 |
Embodiments described herein relate to rotary unions for use in wafer cleaning processes. The rotary union includes a process media and a supporting media that interact in a gap between a nozzle and rotary element. By regulating the supp...
|
|
WO/2020/048731A1 |
The invention relates to an edge-removing tool for sheet metal, comprising a head with a rotating cutting tool, wherein the head has at least one guide for an edge. The head preferably comprises a sleeve comprising the guide, and the too...
|
|
WO/2020/048311A1 |
A chemical-mechanical planarization device, comprising a polishing module, a cleaning module and a wafer transfer module, wherein the polishing module comprises two rows of polishing unit arrays (100), each row of polishing unit arrays c...
|
|
WO/2020/048874A1 |
A polishing device held on a robot arm (1), having a support plate (9), a polishing disc (10) held thereon, a drive moving the support plate (9) in a plane, and a metering device (8) for feeding a polishing agent to the working side of t...
|
|
WO/2020/051485A1 |
Apparatus, assemblies, and/or systems related to material removal are disclosed, such as saws, grinders, polishers, and/or more general material preparation and/or testing machines, for example. A material removal system may include a ma...
|
|
WO/2020/027754A3 |
The invention particularly relates to the discrete channel grooving system (10), which reduces costs by using fewer discs and allows channel engraving at the desired length and depth in the desired area of the glass. The discrete groovin...
|
