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WO/2020/143260A1 |
A swing arm for polishing slurry delivery and a polishing device, comprising an arm element (1) provided with a polishing slurry delivery pipe (3) for polishing slurry delivery. A slurry landing-location adjustment block (7) is slidingly...
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WO/2020/145121A1 |
The present invention addresses the problem of providing: a method for regenerating a polishing agent, which can be employed for the polishing of a chemically strengthened glass, and whereby it becomes possible to remove a K2O-containing...
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WO/2020/142648A1 |
A method for reconditioning a rollable wheel includes coupling a polymeric wheel to a reconditioning system, the polymeric wheel having an outer surface including an abraded area, the abraded area having a first average surface roughness...
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WO/2020/141017A1 |
The invention relates to a processing segment (41), which is made of a first matrix material (44) and first hard material particles (45), the first hard material particles (45) being arranged in the first matrix material (44) according t...
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WO/2020/098852A3 |
The invention relates to a disk-shaped cutting tool (1), to a radial cutting method for machining axially elongate workpieces, to a cutting device and to a use of a disk-shaped cutting tool. A disk-shaped cutting tool according to the in...
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WO/2020/142277A1 |
The present invention relates generally to coated abrasive articles, such as coated abrasive film belts having improved strength and durability, as well as methods of making and using said coated abrasive articles.
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WO/2020/140488A1 |
An intelligent continuous material feeding system for an ultrahigh pressure pre-mixed abrasive jet. An ultrahigh pressure material mixing tank (11), an ultrahigh pressure material storage tank (17), and a material feeding hopper (18) are...
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WO/2020/142038A1 |
The invention is a surface finishing method for generating homogeneous, residual stresses on the workpiece surface, comprising the steps of applying a carrier and retention polymeric paste tool containing spherical particles to the workp...
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WO/2020/142266A1 |
A method of producing a measuring tape may include providing a cupped blade with substantially uniform cupping over a longitudinal length of the cupped blade, applying a stress relief operation to a selected portion of only a convex side...
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WO/2020/137099A1 |
The information processing device of the present invention is for determining a polishing recipe on the basis of response data for each area acquired by changing pressure for each area of a polishing head, and is provided with: an abnorm...
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WO/2020/136973A1 |
Provided are: a silicon epitaxial wafer production method that can suppress DIC defects; and a silicon epitaxial wafer. Provided is the silicon epitaxial wafer production method in which an epitaxial layer is grown in a vapor phase on th...
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WO/2020/138198A1 |
Provided is a non-woven-fabric polishing pad characterized in having polishing performance that is exceptional in terms of polishing stability and smoothness of a polished object, and moreover characterized in that the change in the poli...
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WO/2020/137278A1 |
Provided is a polishing composition with which micro defects and haze in a polished semiconductor wafer can be further reduced. This polishing composition comprises abrasive grains, a basic compound, a vinyl alcohol-based resin having 1,...
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WO/2020/137186A1 |
This method for manufacturing a wafer having a notch part is provided with: a both side polishing step for polishing both main surfaces of a wafer; a notched mirror surface polishing step for performing mirror polishing on a notch-chamfe...
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WO/2020/137802A1 |
The present invention pertains to a pad temperature adjusting device for adjusting the surface temperature of a polishing pad. The pad temperature adjusting device (5) comprises: a pad contacting member (11); a supplying system (30) that...
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WO/2020/136553A1 |
Object: To provide a grinding wheel and a method of manufacturing a grinding wheel having added value while providing a suppressed manufacturing cost. Solution Means: The grinding wheel is a grinding wheel including an abrasive portion i...
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WO/2020/137187A1 |
This double grinding method comprises: a first grinding step in which grinding is performed until the thickness of a first wafer reaches a prescribed thickness while a grinding fluid is supplied in a prescribed amount to first and second...
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WO/2020/137837A1 |
Provided is a semiconductor wafer evaluation method that includes: acquiring a differentiation interference image at an evaluation position on the outer periphery of a semiconductor wafer to be evaluated by using a reflection-type differ...
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WO/2020/135498A1 |
Provided are a method and apparatus for final polishing of a silicon wafer. The method for final polishing comprises: during final polishing to the remaining predetermined time, using both polishing slurry and an oxidizing solution as a ...
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WO/2020/139663A1 |
A method of generating a matrix to relate a plurality of controllable parameters of a chemical mechanical polishing system to a polishing rate profile includes polishing a test substrate. The test substrate is polished for a first period...
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WO/2020/139605A1 |
A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially ...
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WO/2020/137713A1 |
Provided is a cutting method, for example, which uses a wire tool and with which it is possible to cut a workpiece more efficiently than before without degrading machining quality. This cutting method is a cutting method for cutting a wo...
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WO/2020/136087A1 |
The invention relates to a hand-held power tool, in particular a grinder (10), for simultaneously driving multiple grinding discs (12, 14, 16), in particular tiltable grinding discs (12, 14, 16) which are rotatably and/or oscillatingly d...
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WO/2020/137653A1 |
The present invention relates to a method for cleaning an optical film thickness measurement system that is used for measuring the film thickness of a substrate such as a wafer while the substrate is being polished. This method comprises...
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WO/2020/136972A1 |
Provided are: a silicon epitaxial wafer production method that can suppress DIC defects; and a silicon wafer. Provided is the silicon epitaxial wafer production method in which an epitaxial layer is grown in a vapor phase on the principa...
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WO/2020/136086A1 |
The invention relates to a hand-held power tool, in particular a grinder (10), for simultaneously driving a plurality of, preferably three, grinding plates (12, 14, 16), which in particular can be tilted and/or are driven rotationally an...
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WO/2020/134131A1 |
An automated workpiece grinding and machining method employing offline programming comprises the following steps: S1, generating a reference grinding track in offline programming software according to 3D image data of workpieces to be ma...
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WO/2020/134639A1 |
A fixing device for a polishing apparatus and a polishing system. The fixing device for a polishing apparatus comprises a supporting platform (100) and an operation station (200) detachably and fixedly connected to the supporting platfor...
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WO/2020/136175A1 |
The method includes the steps of: providing spectacles including a template eyeglass having a mounting portion inserted in a groove of an arc and being to be replaced by a prescription eyeglass having a step-back portion with the same co...
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WO/2020/136715A1 |
This guide rail machining apparatus has a machining apparatus body that is moved along a guide rail. The machining apparatus body has a frame and a machining tool. The machining tool is provided to the frame and machines the guide rail. ...
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WO/2020/097633A3 |
A double- stringer rotary brush and brush assembly formed of a pair of brush wire mounting hubs having sets of alternating radially staggered radially innermost and outermost brush wire tuft mounting holes having different hole sizes wit...
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WO/2020/125860A1 |
The invention relates to an apparatus for switching high-pressure suspension, in particular for engaging or disengaging a solid-particle-laden fluid flow which is under high-pressure, said apparatus having a fluid reservoir (1), a high-p...
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WO/2020/127382A1 |
The invention relates to an injection nozzle for injecting fuel into a combustion chamber of an internal combustion engine, comprising a nozzle body (20) having an inner side (30) and an outer side (40) and at least one injection hole (6...
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WO/2020/128950A1 |
The present invention relates to an attachment hub for attachment to a sander, comprising a quick-release attachment assembly configured for releasable and aligned engagement with a counterpart of a backup pad particularly for an abrasiv...
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WO/2020/128781A1 |
The present disclosure provides improved rail grinding tools. Precision-shaped grains (PSGs), such as PSGs manufactured by 3M® company, provide significant performance improvement in resin-bond and vitrified bond grinding wheels. The us...
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WO/2020/128779A2 |
The present disclosure provides systems and methods for making bonded abrasive articles. The bonded abrasive wheel may be formed using a continuous layer approach, such as a spiral building of abrasive articles. The spiraling building of...
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WO/2020/126091A1 |
The invention relates to a machining segment (41), which is composed of a first matrix material (44) and first hard material particles (45), the first hard material particles (45) being arranged in the first matrix material (44) accordin...
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WO/2020/129714A1 |
Provided is a substrate processing apparatus comprising: a rotary table that delivers a plurality of respective substrate chucks, in the following order, to a loading position where a substrate is loaded, a processing position where the ...
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WO/2020/126555A1 |
The invention relates to a shaped ceramic abrasive grain (100-900), in particular based on alpha Al2O3, comprising at least one base surface (102-902) and a jacket surface (104-904), wherein the abrasive grain (100-900) is substantially ...
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WO/2020/125842A1 |
According to the invention, a hardened workpiece surface (10) of a workpiece (1) is firstly machined and then rolled, and the machining process, which comprises the material removal process and the rolling process, takes place in the sam...
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WO/2020/128090A1 |
The invention provides a machining system (201) comprising: a machining apparatus (202), notably an abrasive waterjet cutting system (203), said machining apparatus being adapted for machining a workpiece (204); a monitoring device (228)...
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WO/2020/126421A1 |
The invention relates to a method and a device for the erosive machining of a workpiece (1) or a workpiece surface using a high-pressure fluid jet. In the method, a fluid (2) is subjected to high pressure by means of a fluid pump (3) and...
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WO/2020/128856A1 |
The disclosure relates to, among other things, an abrasive article comprising a plurality of 4D-ceramic structures, wherein the 4D-ceramic structures are made by a method comprising sequentially: at least partially removing a strain from...
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WO/2020/128855A1 |
An endless abrasive belt dispenser (212) is disclosed and has a housing (222), a retaining element (224) and an actuating element (226). The housing (222) is configured to receive a plurality of endless abrasive belts (14) therein with t...
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WO/2020/128854A1 |
Various embodiments disclosed relate to an abrasive article and method of forming abrasive articles using backfill to secure orientation of shaped abrasive particles. An example method includes aligning a plurality of shaped abrasive par...
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WO/2020/128857A1 |
Abrasive articles and associated methods are shown that include abrasive particles arranged in a pattern on at least a portion of a backing substrate of the article. The pattern can include a plurality of longitudinal rows that repeat ac...
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WO/2020/126460A1 |
The present invention relates to a device for supporting workpieces to be lapped (1) adapted to the lapping ring (5) of a lapping machine. The device comprises an outer casing (10), arranged on the lapping ring (5) and comprising at leas...
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WO/2020/126420A1 |
The invention relates to a method and a device for the erosive machining of a workpiece (1) or a workpiece surface using a high-pressure fluid jet. In the method, a fluid (2) is subjected to high pressure by means of a fluid pump (3) and...
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WO/2020/128708A1 |
A coated abrasive article comprises a backing having first and second opposed major surfaces. A make layer is bonded to the first major surface. Agglomerate grinding aid particles are directly bonded to the make layer. At least a portion...
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WO/2020/128783A1 |
An abrasive article comprising a plurality of shaped abrasive particles (20), each shaped abrasive particle comprising a microparticulate layer disposed on at least a portion of the outer surface of the abrasive particles, wherein the mi...
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