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WO/2019/181394A1 |
A method of producing a vehicle glass assembly, includes (A) providing a connector made of metal plate and comprising a first flat portion, a second flat portion and a bridge portion connecting between the first and the second flat porti...
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WO/2019/171710A1 |
Provided are: a solder alloy which has a low melting point and therefore does not undergo the occurrence of unfusion, has excellent mechanical properties and impact resistance, and also has excellent heat cycle resistance; a solder paste...
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WO/2019/172410A1 |
Provided are: a flux which contains no reducing agent or no activator and does not remain on a solder joint; and a solder paste prepared using the flux. The flux according to the present invention contains: a first solvent of which the t...
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WO/2019/171978A1 |
Provided is a solder alloy that has a low melting point to prevent non-fusion, has improved ductility and adhesion strength, and has excellent heat cycle resistance. This solder alloy has an alloy composition composed of, on a percent by...
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WO/2019/167705A1 |
Provided are a lead-free solder alloy, an electronic circuit mounting board, and an electronic control device. The lead-free alloy serves as a means for allowing the heating conditions during soldering to be the same as or less than that...
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WO/2019/167329A1 |
The objective of the present invention is to provide a flux and a solder paste with which, in addition to fluidity and shape retention being appropriately balanced, there is no deposition of agglomerates and flux components are uniformly...
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WO/2019/163807A1 |
This thermoelectric conversion material is characterized by being composed of a sintered body of a compound that contains a dopant, and is also characterized in that the standard deviation of the dopant concentration as calculated by mea...
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WO/2019/146587A1 |
Provided is a joining layer (13) that is included in a semiconductor module (10), that is interposed between an electronic component (14) and a substrate (15), and that comprises a CuSn intermetallic compound. This joining layer (13) is ...
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WO/2019/142826A1 |
Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a sol...
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WO/2019/142772A1 |
Provided is flux that can achieve a low residue so as to make it possible to ensure wetness of solder, ensure holding properties of a solder ball, and suppress the amount of residue after soldering and enable application for use without ...
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WO/2019/142795A1 |
Provided are a soldering resin composition in which wet-spreading properties are improved and which also has exceptional reliability and processability, a resin flux cored solder in which the soldering resin composition is used, a flux c...
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WO/2019/142802A1 |
Provided are flux that includes a heat-resistant activator having low reactivity with thermosetting resins, and a solder paste in which the flux is used. This flux includes 30-70 wt% of a thermosetting resin, 3-15 wt% of an amine, and 5-...
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WO/2019/137782A1 |
An electrical contact pin (6) is described which is intended for pressing into a hole (2) which is provided in a circuit carrier board (1) and has a circumferential wall with a metallized surface, wherein the contact pin (6) consists mai...
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WO/2019/131718A1 |
Provided is a solder alloy having superior continuous casting performance. The solder alloy of the present invention has an alloy composition, by mass%, of Cu: 0.8 to 10%, the remainder being Sn, and includes an intermetallic compound. I...
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WO/2019/132015A1 |
Provided are a resin composition and a soldering flux that are configured so as to make it possible to suppress cracking of a residue. In the resin composition, a ratio of 0.15-1.00 is achieved, with reference to a rosin, as the ratio of...
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WO/2019/132003A1 |
Provided is flux in which solder wettability can be maintained and with which it is possible to suppress the amount of residue after soldering and realize low residue. This flux includes 65-99 wt% of a solvent, and also includes 1-13 wt%...
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WO/2019/124513A1 |
Provided are solder particles capable of effectively increasing the coalescence of solder when forming electroconductive connections. The solder particles according to the present invention comprise a solder particle body and an oxide fi...
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WO/2019/117041A1 |
This solder paste contains: a mixed filler comprising first metal particles and second metal particles; and a flux, wherein the first metal particles are composed of an alloy including 50-80 mass% of Cu, 5-15 mass% of Ag, 2-10 mass% of B...
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WO/2019/116910A1 |
A semiconductor device according to the present invention is provided with: an insulating substrate (1) which is obtained by integrating a ceramic base material (1b) and a fin (1a) for cooling with each other; a plate-like wiring member ...
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WO/2019/111898A1 |
Provided are a Cu ball having high sphericity, low hardness and suppressed discoloration, an OSP-treated Cu ball, a Cu core ball, a solder joint, a solder paste, and a foam solder. An electronic component 60 is configured by bonding the ...
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WO/2019/102671A1 |
The present invention addresses the problem of providing a flux from which no crystal is precipitated and which enables the improvement of the wettability of a solder. A flux characterized by containing 0.4 to 10.0% by mass of ditolylgua...
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WO/2019/103090A1 |
Provided are: a flux which imparts thixotropy, and which exhibits excellent printing properties, printing sagging-inhibiting ability, and heating sagging-inhibiting ability; and a solder paste which uses said flux. This flux includes a t...
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WO/2019/103025A1 |
The purpose of the present invention is to provide a solder material which shows little discoloration, has excellent wetting properties, is highly reliable in terms of cycling properties, etc., and, when made into a solder paste, has a s...
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WO/2019/094243A1 |
A lead-free solder alloy is based on tin and comprises silver, copper, bismuth, cobalt and titanium. The alloy may further comprise antimony, nickel, or both. Silver is present in an amount from 3.1% to 3.8% by weight of the solder. Copp...
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WO/2019/092947A1 |
[Problem] To provide a car window glass equipped with a lead-free solder joined portion, which passes the VDA test. [Solution] This car window glass comprises: a glass plate having an electrically conductive body layer; a connection term...
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WO/2019/094241A2 |
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be p...
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WO/2019/094242A1 |
A lead-free, tin based solder alloy comprises silver, copper, cobalt and optionally bismuth and antimony. The alloy may further comprise nickel. Silver is present in an amount from 2.0% to 2.8% by weight of the solder. Copper is present ...
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WO/2019/088222A1 |
Provided is a joint body (10) obtained by joining a ceramic member (11) made of a Si-based ceramic and a copper member (12) made of copper or a copper alloy, wherein, in a joint layer (30) formed between the ceramic member (11) and the c...
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WO/2019/088068A1 |
Provided are: a soldered joint which suppresses detachment between a back metal and a solder alloy during formation of the soldered joint, and which offers higher reliability by suppressing non-wetting of the solder alloy, splashing of m...
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WO/2019/074006A1 |
Provided are a flux which has improved wet-spreadability and is capable of preventing the occurrence of dewetting and a solder paste with the use of the flux. The flux comprises one member selected from among a dimer acid that is a produ...
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WO/2019/069788A1 |
This solder alloy is used in soldering and has a chemical composition that includes, in percent by mass, 2.0-4.0% of Ag, 0.6-1.2% of Cu, 2.0-5.0% of Sb, 1.1-3.5% of In, 0-0.20% of Ni, 0-0.2% of Co, and 0-0.05% of Ge, the balance being Sn...
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WO/2019/058650A1 |
Provided is a solder alloy that makes it possible to ensure long-term bonding reliability in metal piping by minimizing the growth of an intermetallic compound layer at the bonding interface when performing low-temperature bonding of met...
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WO/2019/053866A1 |
The purpose of the present invention is to provide: a lead-free solder alloy with which progression of cracking in solder joints can be suppressed even in a rugged environment with severe differences between hot and cold and with a vibra...
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WO/2019/049917A1 |
Provided is a flux which enables improvement of solderability, while maintaining activeness by suppressing the formation of an ester by a reaction between an organic acid and a hydroxy group of an alcohol that is contained in a solvent. ...
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WO/2019/039320A1 |
Provided is a thermoelectric material 1 having: a parent phase 10 containing a MgSiSn alloy as a main component; vacancies 12 formed in the parent phase 10; and a silicon layer which is formed on at least the wall surfaces of the vacanci...
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WO/2019/035197A1 |
Provided are a solder alloy for preventing Fe erosion, a flux cored solder, a wire solder, a flux cored wire solder, a flux-coated solder and a solder joint which, in order to prolong the life of a soldering iron tip, suppress erosion of...
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WO/2019/027261A1 |
Disclosed is a lead-free alloy composition comprising: a solder comprising at least one alloy selected from a Sn-Ag-Cu alloy, a Sn-Cu alloy, and a Sn-Ag alloy; and an additive added to the solder, the additive comprising a tungsten metal...
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WO/2019/022193A1 |
This solder paste flux comprises a thickening agent, a solvent, and a thixotropic agent, and that has an acid value of at most 100 mgKOH/g, exhibits a mass reduction rate of at least 80 mass% at 300°C by thermogravimetric measurement, a...
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WO/2019/017182A1 |
[Problem] To provide a sliding member and a sliding bearing which are capable of improving fatigue resistance. [Solution] Provided is a sliding member in which a coating layer is laminated on a base layer, wherein the coating layer compr...
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WO/2019/017349A1 |
Provided is a negative electrode active material having a greater capacity retention rate and capacity per volume. The negative electrode active material according to this embodiment of the present invention contains alloy particles. The...
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WO/2019/012947A1 |
A metal porous body according to an embodiment of the present invention has a flat shape and continuous pores. The metal porous body skeleton has an alloy layer containing nickel and chromium, and a silver layer is formed on the surface ...
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WO/2019/013158A1 |
The present invention addresses the problem that: if a flux contains an amount of thixotropic agent necessary for obtaining the effect of suppressing a flow due to heating, the amount of flux residue increases, and, if applied for uses t...
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WO/2019/009191A1 |
A flux according to the present invention contains a phosphine oxide. Accordingly, it is possible to provide a flux capable of enhancing the solder wettability, a resin-flux cored solder containing said flux, and a solder paste containin...
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WO/2019/009427A1 |
Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least tw...
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WO/2018/225288A1 |
The purpose of the present invention is to provide: a resin flux cored solder or a flux coated solder, which is suppressed in scattering of flux and solder when the solder is in use; and a flux which is contained in the resin flux cored ...
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WO/2018/198515A1 |
The present invention provides: a Nb3Sn superconducting wire rod that is produced by the internal tin process and that has a number of useful functions in such aspects as promotion of Nb3Sn layer generation, mechanical strength (and incr...
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WO/2018/193760A1 |
A semiconductor device comprising an assembly structure in which a semiconductor element (1) is mounted on a laminated substrate. The semiconductor element (1) and an electrode pattern (3) on the laminated substrate are bonded by means o...
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WO/2018/193960A1 |
The purpose of the present invention is to provide: a flux composition which does not undergo the scattering of a flux; and a solder paste composition. A flux composition containing an anti-scattering agent represented by formula (1). (I...
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WO/2018/189154A1 |
Disclosed is a pyrometallurgical process for producing a crude solder from a feedstock selected in terms of its levels of Sn, Cu, Sb, Bi, Zn, As, Ni and Pb, the process comprising at least the steps of obtaining in a furnace a liquid bat...
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WO/2018/186218A1 |
Provided is a solder material including 2.5-3.3 wt% Ag, 0.3-0.5 wt% Cu, 5.5-6.4 wt% In, and 0.5-1.4 wt% Sb, the remainder being unavoidable impurities and Sn. Specifically, the solder material is a Pb-free solder not including Pb.
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