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Matches 1 - 50 out of 16,139

Document Document Title
WO/2019/194265A1
This vehicular heat management system comprises: a for-heating refrigerant circulation circuit (5) that causes for-heating refrigerant to absorb the waste heat of onboard devices (50-53), and circulates the refrigerant; a heat pump cycle...  
WO/2019/194089A1
This electronic apparatus 100 comprises a heating element 20, and a case 30. The case 30 has an opening hole 31. In order that a refrigerant COO will be sealed between the case 30 and the heating element 20, the outer periphery part of a...  
WO/2019/181598A1
[Problem] To provide a wick manufacturing method capable of facilitating control of a capillary force of a wick. [Solution] A wick manufacturing method according to the present invention includes: a step for feeding raw material powder c...  
WO/2019/176948A1
This flat heat pipe comprises an elongate container in which a working fluid is encapsulated, and a wick structure disposed within the container. The wick structure is formed from a plurality of copper alloy fibers. If the gap between th...  
WO/2019/172001A1
This refrigeration device is provided with an inner box which surrounds a cooling compartment, a refrigerant liquefying device which is disposed at a higher position than the inner box, and refrigerant piping which is connected to the re...  
WO/2019/168146A1
Provided is a heat sink which is equipped with a heat receiving part thermally connected to a heating element, a plurality of heat pipes each thermally connected to the heat receiving part at a prescribed site thereon, and a heat dissipa...  
WO/2019/168694A1
The description relates to thermal management of devices, such as computing devices. One example can include a vapor chamber that includes an evaporative region and a condensing region that are connected by a neck region that facilitates...  
WO/2019/168145A1
Provided is a heat sink which is equipped with a heat receiving part thermally connected to a heating element, a plurality of heat pipes each thermally connected to the heat receiving part at a prescribed site thereon, and a heat dissipa...  
WO/2019/164750A1
An apparatus and a method are provided for a modular intercooler block that may be fabricated by way of direct metal printing and assembled to form larger intercoolers. The modular intercooler block comprises cooling fins that are spaced...  
WO/2019/158805A1
A speaker apparatus (20) is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity (24). The speaker apparatus includes a speaker (22) and a speaker ca...  
WO/2019/158806A1
A speaker apparatus (20) is provided in order to both receive and dissipate heat and to provide acoustic absorption for sound waves propagating through a speaker cavity. The speaker apparatus includes a speaker (22) and a speaker cavity ...  
WO/2019/160518A2
The present invention relates to a filling system (1) which comprises a chamber (2), at least one heat pipe (3) used for heat transfer and extending along the chamber (2), at least one ammonia tube (4) in which pure ammonia is able to be...  
WO/2019/071329A4
Offshore production systems and methods relating thereto are disclosed. In an embodiment, the offshore production system includes a surface vessel. In addition, the offshore production system includes a closed-loop cooling fluid circulat...  
WO/2019/159879A1
In order to reduce the adverse effect from a thermal medium splashing as a result of a vapor chamber bursting, this protective structure is provided with a perforation member comprising an end section that: comprises an upper surface and...  
WO/2019/151375A1
The purpose of the present invention is to expand a usable temperature range, reduce performance deterioration during sudden damage to a fluid passage, and improve reliability, in a cooling device provided with a self-excited vibration h...  
WO/2019/151291A1
This heat sink is provided with: a heat radiation section provided with a plurality of heat-radiating fin groups having a plurality of heat-radiating fins, the plurality of heat-radiating fin groups forming a layered structure; and a plu...  
WO/2019/150751A1
A temperature regulating device comprises a plurality of heat exchangers (20) disposed side by side in a predetermined arrangement direction, a condenser (30), a gas-phase channel portion (35), and a liquid-phase channel portion (40). Th...  
WO/2019/146262A1
A thermosiphon cooling device for a vehicle, said device comprising: an evaporator (13) having an evaporation unit (131) for absorbing heat from a vehicle-mounted device (11) into a refrigerant and evaporating the refrigerant; a gas pipe...  
WO/2019/142891A1
Provided is a heat transport member 13, comprising: a sealed bag 15; working fluid 19 enclosed in the bag 15; and a contact member 22 having a first contact portion 23 and a second contact portion 24 disposed with an interval therebetwee...  
WO/2019/142310A1
This ebullient cooler (100) comprises: a boiling unit (10); a condenser (20) disposed in a substantially horizontal direction with respect to the boiling unit; and connecting piping (30) connecting the boiling unit and the condenser. The...  
WO/2019/136262A1
A cassette for use in cassette-type heat exchanger has an inlet and an outlet, and include an upper plate and a lower plate. The upper and lower plates are sealed together around an edge area of the cassette, thereby forming a flow path ...  
WO/2019/135536A1
A heat pipe according to an embodiment of the present invention comprises: a plate-shaped body having therein an accommodation space in a vacuum state and having a predetermined thickness; and a working fluid injected into the accommodat...  
WO/2019/128859A1
A heat conducting plate and a heat source box used in the heat conducting plate. A heat conducting plate (100) comprises a core body (2); a plurality of flow channels (26) is provided in the core body (2); the plurality of flow channels ...  
WO/2019/131790A1
The purpose of the present invention is to provide a heat pipe that has a favorable maximum heat transport quantity, allows for suppression of heat resistance, and exhibits excellent heat transport characteristics, even when installed in...  
WO/2019/129431A1
The present invention relates to a heat pipe (1) enabling improving the operational efficiency particularly in hermetic piston compressors, characterized by an evaporator region (2) having at least one inflection (21) enabling increasing...  
WO/2019/131814A1
The objective of the present invention is to provide a heat sink that exhibits excellent cooling performance even when hot spots where a large amount of heat is generated concentrate in portion of a heat-generating body package. This hea...  
WO/2019/129320A1
The present invention relates to a heat exchanger device for the provision of refrigeration in refrigerated vehicles which are operated by liquefied natural gas (LNG) which has to first be regasified. The great temperature difference whi...  
WO/2019/131599A1
This heatsink module is provided with a container and a wick. The wick is in contact with each one of a pair of opposing inner wall surfaces of the container and partitions the inside of the container, thus forming a plurality of vapor f...  
WO/2019/131834A1
Provided is a cooling device capable of improving bonding reliability between a base block and a heat pipe, while reducing environmental load, and capable of achieving both excellent contact heat transfer coefficient and vibration resist...  
WO/2019/131589A1
This heatsink module is provided with: a container having an evaporation part in which a working fluid is sealed inside and the working fluid is evaporated; a condensation part that condenses the evaporated working fluid; and a wick that...  
WO/2019/123881A1
A device temperature adjusting apparatus for adjusting the temperature of a target device (2) through changing the phase of an operating fluid from a liquid phase to a gas phase is provided with: a device temperature adjusting unit (10) ...  
WO/2019/121197A1
The subject matter of the present invention is a device for dissipating heat from a heat source. Said device comprises a heat pipe, a heat inputting element and a heat outputting element, also called a heat sink, wherein the heat sink co...  
WO/2019/117989A1
This document describes techniques for implementing phase-change cooling in a three-dimensional structure. A three-dimensional structure having three-dimensional curvatures is fabricated to include a phase-change chamber with a fluid in ...  
WO/2019/117119A1
This inverter is provided with a frame, a semiconductor power module and a cooling device. The frame is configured by combining a plurality of frame members which include a plurality of rod-shaped frame members. The semiconductor power m...  
WO/2019/114789A1
A data center energy recovery system, comprising: a data center IT device (5), an evaporation end (4), a first transmission pipeline (31), a condensation end (2), a second transmission pipeline (32) and a phase change storage film (1); t...  
WO/2019/114368A1
An energy-saving loop heat pipe apparatus and an application. The loop heat pipe apparatus comprises a capillary pump component and an evaporation unit component. The loop heat pipe apparatus further comprises at least one heat exchanger...  
WO/2019/116260A1
A perfluorinated 1-alkoxypropene represented by general Formula (I), compositions that include such compounds, and methods and systems that include such compositions are provided, wherein Formula (I) is represented by: RfO-CF=CFCF3 where...  
WO/2019/112611A1
Devices and methods of heat transfer are provided. In an example, a thermo-reversible hydrogel is provided in a first portion of a casing of a device. A wicking surface is provided in an inner surface of the casing between the first port...  
WO/2019/071329A3
Offshore production systems and methods relating thereto are disclosed. In an embodiment, the offshore production system includes a surface vessel. In addition, the offshore production system includes a closed-loop cooling fluid circulat...  
WO/2019/107058A1
The purpose of this disclosure is to provide a thermosiphon type heating system that uses a plurality of heat sources, wherein use of one heat source to warm up another heat source is accomplished with a simple configuration. This thermo...  
WO/2019/108590A1
A system and method for cooling electronics with compressed gas cylinders. A small, lightweight, scalable cooling system provides portability and cooling for electronic components in remote areas. In some cases one or more compressed gas...  
WO/2019/107184A1
A heat transport member 10 is provided with: a bag body 18 that is formed by sealing the end edges of a first sheet 20 and a second sheet 21; and a working fluid 17 that is sealed inside the bag body 18 and of which phase changes between...  
WO/2019/106762A1
Provided are a loop heat pipe capable of being activated quickly and an electronic device. A loop heat pipe has: an evaporator (31) that is internally provided with a first inner surface (41a) and a second inner surface (43a) that oppose...  
WO/2019/097913A1
In the present invention a plurality of thermosiphon circuits (11, 12, 52, 59, 60) each have a machine heat exchange unit (30, 34, 54) that exchanges heat between a subject machine and a working fluid, and a linked heat exchange unit (31...  
WO/2019/093230A1
This device-temperature adjusting apparatus for adjusting the temperatures of target devices (12a, 12b) by phase conversion of a working fluid between the liquid phase and the gas phase, is provided with: a plurality of coolers (14) for ...  
WO/2019/093028A1
This copper porous body for vaporization members is used for a vaporization member which vaporizes a liquid phase medium that comes into contact with the vaporization member, and has a skeleton part that has a three-dimensional network s...  
WO/2019/092978A1
A thermo-siphon type temperature adjusting apparatus (1) for adjusting the temperature of a target device (BP), is provided with: a device heat exchanger (20) that evaporates a liquid-phase working fluid by absorbing heat from the target...  
WO/2019/093065A1
Provided is an evaporator applied to a thermosyphon type cooling device. The inside of a flat multi-hole tube (21) forming an evaporation section for evaporating an operating fluid is divided into first to fifth fluid passages (211a-211e...  
WO/2019/087574A1
This thermosiphon-type temperature control device is provided with an evaporator (13) for causing a working fluid to absorb heat from a cooling target (11) and for evaporating the working fluid, and a gas-phase tubing (15) which extends ...  
WO/2019/089126A1
A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative r...  

Matches 1 - 50 out of 16,139