| Document |
Document Title |
|
WO/2015/141802A1 |
Provided are: a method that is for producing a mounting structure and that can easily produce a mounting structure in which pins and other electronic components are mounted to the same surface; a mounting jig; a device for producing a mo...
|
|
WO/2015/091884A9 |
The invention relates to a joining device, in particular for producing a heat exchanger (26) comprising at least one cover plate or two cover plates lying opposite one another, by means of coffering and soldering, said device comprising ...
|
|
WO/2015/132086A1 |
The invention relates to a method for manufacturing a heat exchanger, comprising the following steps: a) making available a heat exchanger arrangement (1) with at least two components which are arranged adjacent to one another in an arra...
|
|
WO/2015/131481A1 |
An adjustable welding tooling for a plastic packaging IPM, comprising a substrate (1), wherein a first groove (2) for accommodating a PCB board (4) and a second groove (3) for accommodating a DBC board (5) are arranged on the substrate (...
|
|
WO/2015/132965A1 |
The present invention is a solder supply apparatus, which comprises a solder cup (70) which contains solder, in fluid form, in the interior of the same and a supply nozzle (74) which is fitted within the solder cup, and which moves the s...
|
|
WO/2015/128080A1 |
The invention relates to a soldering tip fastening sleeve (3) comprising: a soldering device fastening section (7) that has an internal dimension (15) and an external dimension; and a soldering tip fastening section (6) that also has an ...
|
|
WO/2015/129840A1 |
Provided is a glass for an automotive vehicle capable of preventing cracking in glass substrate for an automotive vehicle over time when one surface of a metal terminal is soldered to a silver electrode formed on the glass substrate usin...
|
|
WO/2015/128994A1 |
The present invention is a solder supply device (26) provided with a solder cup (70) containing in the interior thereof solder in fluid form, a positive/negative pressure supply device for changing the pressure within the solder cup in c...
|
|
WO/2015/129034A1 |
Solder is accommodated in a flow tank (20). The solder is discharged from a nozzle (22) by a pump provided in the flow tank (20). A jetting motor (26) for driving the pump is provided on the exterior of the flow tank (20). A cooling devi...
|
|
WO/2015/130353A1 |
A wave solder machine (10) includes a pre-heating station (20), a wave soldering station (22), and a conveyor (16) to transport substrates (12) through a tunnel passing through the pre-heating station (20) and the wave soldering station ...
|
|
WO/2015/128967A1 |
With this solder delivery system, when a determination that a solder cup (70) has been placed in a solder delivery apparatus (26), reading of a barcode by a barcode reader (170) is permitted, whereas when a determination that no solder c...
|
|
WO/2015/112243A1 |
A wave solder machine is configured to perform a wave solder operation on an electronic substrate. The wave solder machine includes a fluxing station configured to apply flux onto the electronic substrate, a pre-heating station configure...
|
|
WO/2015/105089A1 |
Provided is a repair method in which a material that is capable of bonding at a relatively low temperature is used as a repair material in a repair section and a repair that exhibits excellent sealing properties and durability even when ...
|
|
WO/2015/090687A1 |
The invention relates to an apparatus (10) for the isolated application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for the solder material deposits to be conveyed individually from a ...
|
|
WO/2015/092877A1 |
A solder supply device (26) for supplying solder inside a solder cup through the tip of a nozzle part by movement of the solder cup, said device being provided with: a solder cup (70) describing a cylindrical shape with an open end, the ...
|
|
WO/2015/090686A1 |
The invention relates to an apparatus (10) for the isolated application of solder material deposits (11), in particular solder balls, comprising a conveying device (19) for the solder material deposits to be conveyed individually from a ...
|
|
WO/2015/086514A1 |
The present invention relates to a method for applying paste on a surface of elevated portions of a component, an apparatus suitable for carrying out the method and a product manufactured by the method, said method for applying paste ont...
|
|
WO/2015/083272A1 |
A solder supply device (26) comprises: a solder cup (70) in the shape of a tube open at one end; a nozzle portion (88) for discharging solder inside the solder cup to the outside; a flange portion (90) which is disposed fixedly on an out...
|
|
WO/2015/083271A1 |
A solder supply device (26) comprises: a solder cup (70) which is formed in the shape of a tube open at one end and inside which fluid solder is accommodated; a nozzle portion (88) which is inserted into the solder cup, for discharging t...
|
|
WO/2015/079582A1 |
Provided is a substrate joining method that includes the following: a step for causing metal layers (12, 22), that are fff ormed on a plurality of substrates (10, 20) respectively, to face each other with a porous body (32) comprising a ...
|
|
WO/2015/068936A1 |
The present invention relates to an induction heating head and, more particularly, to an induction heating head for melting and supplying a metal material. Specifically, the present invention relates to an induction heating head for loca...
|
|
WO/2015/068147A1 |
Dispenser (1) of soldering wire for soldering pens (30) of the type comprising a pen-like body and a soldering electrode, said dispenser comprising a body shaped so as to rest on the pen body (41) of the soldering pen; an inlet for a wir...
|
|
WO/2015/067413A1 |
The invention relates to a method for repairing a circuit board (1) having at least one defective component (2), which is connected mechanically and/or electrically to the circuit board (1) via at least one contact point (3) on the circu...
|
|
WO/2015/064166A1 |
Provided are a soldering device and a decomposition method with which formic acid can be processed safely and quickly, corrosion of a vacuum pump does not occur, and the exhaust speed and the degree of vacuum in the vacuum chamber can be...
|
|
WO/2015/064143A1 |
The present invention makes it possible to separate a gas that does not contain a flux component from a gaseous mixture that contains a flux component and recover the flux component. Water vapor that is generated within a separation unit...
|
|
WO/2015/064142A1 |
The present invention makes it possible to separate a gas that does not contain a flux component from a gaseous mixture that contains a flux component and recover the flux component. This flux recovery device is provided with: a first wa...
|
|
WO/2015/056000A1 |
A fluid applicator (1, 20) applies a fluid, such as flux, to the external surfaces of a pipe (22). The fluid applicator (20) has a fluid reservoir (24) containing the fluid to be applied to a pipe (22), and a fluid carrier (94) to receiv...
|
|
WO/2015/055328A1 |
The invention relates to an apparatus (10) for the individual application of deposits of soldering material, in particular solder balls, comprising a feeding device for the individual feeding of the deposits of soldering material from a ...
|
|
WO/2015/045997A1 |
Provided are a mounting device and a mounting method by which a set temperature profile of a heating means for the purpose of obtaining a desired joining temperature profile during joining can be calculated relatively easily, and which a...
|
|
WO/2015/043780A1 |
The invention relates to an arrangement of at least two solder-wettable separating strips (6, 7) for a soldering nozzle for simultaneously wave soldering rows of solder joints arranged spaced apart. The invention is distinguished by the ...
|
|
WO/2015/044727A2 |
A brazing system has a first gas source, a second gas source, an enclosure, a brazing torch, and a control system configured to control a ratio of the first gas source and the second gas source.
|
|
WO/2015/039783A1 |
An arrangement (10) for the reproducible application of small amounts of liquid onto a target surface, comprising a liquid reservoir (28, 38) with an opening (24) which can be positioned above the target surface, a plunger (52, 60) which...
|
|
WO/2015/029552A1 |
The present invention is a method for brazing an aluminum alloy material without using flux, characterized in having the objective of forming a joint fillet having adequate joint strength, and in being "a method for brazing in which a me...
|
|
WO/2015/025234A1 |
The invention relates to an application nozzle (1) for flux. The nozzle is beneficially used for soldering ribbons to solar cells and can apply a flux agent to an elongated area on the cell in time parallel. The nozzle (1) uses centrifug...
|
|
WO/2015/015837A1 |
A jet orifice (22) projects a liquid that is supplied from a liquid supply device (1). A nozzle main unit (21) has, in the interior thereof, a passageway (4) which guides the liquid to the jet orifice (22). Air inlets (23) which provide ...
|
|
WO/2015/007255A1 |
The invention relates to a conveyor device for printed circuit boards (4). The conveyor device comprises a carrier means (1) that continuously circulates between conveyor wheels and is linearly guided in some sections. On said carrier me...
|
|
WO/2014/207835A1 |
Provided are a solder ball supplying method, solder ball supplying device, and solder bump forming method that are flux-less and capable of being used for a fine pitch electrode. A substrate (70) that has a resist (74) with an opening (7...
|
|
WO/2014/203499A1 |
The purpose of the present invention is to provide a water vapor reflow device and water vapor reflow method that use superheated water vapor and that make practical use possible. A water vapor reflow device (1) provided with a heating f...
|
|
WO/2014/199694A1 |
The top end (36a) of a return tube (36) is joined to the bottom of a partitioning plate (31) to enclose the entire lower portion of a communicating opening (33). Thus, even when a gas is supplied to a solder reservoir (5), the gas does n...
|
|
WO/2014/194470A1 |
A tin wire transmission apparatus comprises a transmission mechanism (10) and at least one pair of rolling wheels (20) driven by the transmission mechanism (10). A rolling surface of at least one rolling wheel (20) is provided with a gro...
|
|
WO/2014/194475A1 |
A solder-piercing feed wheel. The solder- piercing feed wheel comprises a blade (10) and clamping wheels (20) capable of clamping the blade (10). The number of the clamping wheels (20) is two. Sawtooth-shaped cutter points (11) are dispo...
|
|
WO/2014/194472A1 |
A synchronizing gear transmission mechanism for a soldering machine. The transmission mechanism is a set of gears, and comprises a driving gear (11), a driven gear (12), and a pair of synchronizing gears (13, 13a). The two synchronizing ...
|
|
WO/2014/194468A1 |
A shift lever positioning apparatus for an automatic tin feeding machine comprises a tin feeding mechanism (20). The tin feeding mechanism (20) comprises a shift lever (21), and a reset spring (22) capable of resetting the tin feeding me...
|
|
WO/2014/193006A1 |
The soldering apparatus for applying a solder solution to the antenna coil contacts of a combi-type IC card according to the present invention comprises a solder solution application unit for applying the solder solution to the antenna c...
|
|
WO/2014/175491A1 |
Provided is a runner block having a uniform discharge rate of molten lead, the runner block having horizontal inner and outer conduits in the interior thereof for supplying molten lead, supplied by means of a molten lead inflow conduit, ...
|
|
WO/2014/170963A1 |
Provided is a lead-free solder ball that has excellent optical inspection properties and has a solder ball surface in a uniformly matted state without showing any irregularity caused by the growth of dendrites on the solder ball surface....
|
|
WO/2014/156846A1 |
Provided is a brazing apparatus that uniformly raises the temperature of workpieces by means of a simple structure, and is capable of high-speed brazing. This brazing apparatus (SB) circulates hot nitrogen gas by convection flow inside a...
|
|
WO/2014/146900A1 |
The invention relates to a method for producing a component of a vacuum interrupter, such as a cover (14) or a shielding part (20). Said components are produced having a layer (33) of a solder material. According to the invention, the co...
|
|
WO/2014/148634A1 |
Space-saving soldering is performed allowing high-reliability soldering at a low cost and a high yield, using a soldering apparatus (100) having: a first process part (110) for setting a component (10) having an electrode (2); a second p...
|
|
WO/2014/149338A1 |
A multi-chip module (MCM) is described. This MCM includes at least two substrates that are mechanically coupled and aligned by positive and negative features on facing surfaces of the substrates. These positive and negative features may ...
|
