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WO/2014/139099A1 |
This disclosure relates to a soldering system containing a soldering apparatus and a heating apparatus. The soldering apparatus includes a heating plate having a body defining a plurality of first air exits, each first air exit extending...
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WO/2014/139569A1 |
In a method for jetting droplets of viscous medium on a workpiece, a jetting machine iteratively jets the droplets of viscous medium from a jetting nozzle onto a first surface of the workpiece to form a single continuous mass of material...
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WO/2014/138890A1 |
A pick-and-place machine and method includes use of a passive component feeder cartridge including a feeder gear. Rotation of the feeder gear causes a component-bearing tape to be fed through the feeder cartridge. A pickup head includes ...
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WO/2014/139568A1 |
An ejector (1) for jetting droplets (22) of viscous media onto a substrate (23) is disclosed. The ejector comprises a jetting nozzle (2) having a nozzle space (3) and a nozzle outlet (4), and an impacting device (6) for impacting a volum...
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WO/2014/128827A1 |
In order to further simplify the structure of a solder replenishing device, this viscous fluid supplier (50) is configured to discharge and cut the viscous fluid by the deformation of an opening/closing member (52) as a result of changes...
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WO/2014/122100A1 |
The invention provides an apparatus and a method for recovering good solder for re-use from dross. Dross is introduced into a chamber (108) which is heated, whilst agitation is provided by means e.g. of an impeller (116). Recovered solde...
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WO/2014/122824A1 |
[Problem] The present invention provides a welding apparatus capable of switching welding wires without adversely affecting operation. [Solution] In switching an in-use MIG welding wire (22) to a brazing welding wire (20), the MIG weldin...
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WO/2014/115584A1 |
Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when cooling a workpiece after performing heat-bonding in a vacuum, target objects that were heat-bonded can be cooled in less time than with...
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WO/2014/115583A1 |
Provided are a superb heat-bonding device and heat-bonded-article manufacturing method wherein, when performing a heat-bonding process in a vacuum, e.g. soldering, the temperatures of target objects being heat-bonded can be brought to a ...
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WO/2014/113130A1 |
Apparatus and methods for heating of one or more substrates (14) with a plurality of independently controllable heating zones (38). Pressurized air (74) is provided to each of a plurality of independently controlled heater blocks (202) e...
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WO/2014/112425A1 |
Provided are: a flux transfer sheet for attaching a flux to a metal, especially to aluminum; a flux attaching method; and a brazing method. A flux transfer sheet (1) is provided with: a sheet-like base film layer (4); and a flux layer (2...
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WO/2014/103946A1 |
In this gas-blowing-hole array structure, which makes it possible to blow a gas at the entire surface of an object being conveyed, such as a printed circuit board or a semiconductor wafer, in concentric shapes that are substantially circ...
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WO/2014/103945A1 |
In this gas-intake-hole array structure, which makes it possible to reduce temperature fluctuations that occur while a printed circuit board, semiconductor wafer, or the like is being conveyed and also makes it possible to heat and cool ...
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WO/2014/101707A1 |
Provided are a recording apparatus for a reflow soldering machine and the reflow soldering machine. The recording apparatus for the reflow soldering machine comprises a camera (1) arranged above an observation window of the reflow solder...
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WO/2014/103262A1 |
When measuring the film thickness of a coating film (25a) which is made of a flux (25) serving as a bonding paste and is formed on a transfer stage (24) of a paste transfer unit (7), the film thickness of the coating film (25a) in a tran...
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WO/2014/087896A1 |
The present invention provides a Au-Sn-Bi alloy thin film which is uniform and thin while maintaining good bonding performance as a bonding layer using an Au-Sn-Bi alloy on a metalized layer on a substrate or an LED element. In the prese...
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WO/2014/086954A1 |
The invention concerns a soldering device for selective soldering, comprising: a solder bath (32) for charging with molten solder; at least one solder nozzle (9); a solder pump for conveying solder from the solder bath through the solder...
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WO/2014/081792A1 |
The invention relates to a selective soldering plant for the soldering of electronic circuit boards, at least one container for liquid solder, a soldering arrangement with at least one soldering nozzle and at least one pump for conveying...
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WO/2014/079113A1 |
An electric soldering iron with a protective jacket, comprising an electric soldering iron body (1) and an electric soldering iron wire (3); the electric soldering iron wire (3) is wound on the electric soldering iron body (1); and a pro...
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WO/2014/073963A1 |
A method is provided for assembly of a micro-electronic component comprising the steps of: providing a conductive die bonding material comprising of a conductive thermosettable resin material or flux based solder and a dynamic release la...
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WO/2014/069132A1 |
The purpose of the present invention is to provide a solder ball that makes it possible to limit agglomeration without the use of a dispersant, and to provide an agglomeration limiting device and agglomeration limiting method that can li...
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WO/2014/065357A1 |
An aluminum alloy brazing method in which brazing is carried out by performing a fluxing process that applies a flux component to the surface of an aluminum alloy member, and then performing a brazing and heating step in which the alumin...
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WO/2014/065356A1 |
A flux composition characterized by including (A) fluoro zinc aluminate alkali metal salt powder represented by general formula (1), MwZnxAlyFz (in the formula, M is K or Cs, and w, x, y and z are positive integers, with the greatest com...
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WO/2014/051919A2 |
A method is provided for joining a filler material to a substrate material. The method includes melting the filler material within a melting chamber of a crucible such that the filler material is molten, holding the filler material withi...
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WO/2014/046387A1 |
The present invention relates to a solder paste supply device, comprising: a first chamber; a second chamber; a bottle-neck connection part; a first press part; a second press part; and a nozzle part. The first chamber receives solder pa...
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WO/2014/046922A1 |
A soldering machine (100) includes a frame (110) and a fixture (106) held by the frame that supports a substrate (104) and a cable. A guidance system (160) is supported by the frame with a camera (102) viewing the fixture that is movable...
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WO/2014/034323A1 |
This electrical circuit device is provided with: a power module (300) having a DC positive electrode branch terminal (315D) and a DC negative electrode branch terminal (319D); and a power board (700) that transmits DC current and has a p...
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WO/2014/033612A1 |
System (2) for automatically applying a coating element (4) to a support surface, comprising a heating device (1) for applying the coating element (4) along an application path of the support surface, by means of administration of heat o...
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WO/2014/029475A1 |
The invention relates to a hand tool (1), in particular a soldering gun (2), having at least one handle (3) and a tool element (4) protruding therefrom with an actuating end section (6) on the free end (5). The hand tool (1) also has mor...
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WO/2014/030416A1 |
The purpose of the present invention is to form a sound fillet on the periphery of surfaces to be brazed, when two aluminum alloy members are brazed to each other by plane brazing using a single-layer brazing sheet. When aluminum alloy m...
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WO/2014/020286A1 |
The invention concerns a method for manufacturing a metal part, comprising the following steps intended to: manufacture a tool assembly comprising: - a counter-form (321a, 321b), - a core (327) comprising: ■ an inner skin (31 5a, 31 5b...
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WO/2013/172158A1 |
The method for manufacturing fluid power transmissions sequentially performs: a first process of assembling a provisional blade-core assembly (38) obtained from connecting multiple blades (2b) to a core (2c) so as to move freely by linin...
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WO/2013/166706A1 |
Device for cleaning components of a wave soldering apparatus exposed to solder and/or flux during wave soldering, comprising a treatment chamber (102), a holding means (106) for holding at least one component to be cleaned in the treatme...
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WO/2013/166968A1 |
A jig for positioning flat cables for welding (1), comprising a handle (101), a connecting piece (102), limiting posts (103) and positioning pins (104); the connecting piece (102) is fixedly connected to the handle (101); the limiting po...
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WO/2013/168198A1 |
To clean a spray nozzle as an action in a series of soldering processes, this spray nozzle cleaning feature comprises a plate-shaped member (11) that can be conveyed over a conveying path (7), a brush (16) rotatably provided to the plate...
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WO/2013/161875A1 |
Provided are an excellent soldering apparatus, which is capable of efficiently soldering a workpiece in a short cycle time, and a method for manufacturing a soldered product. This soldering apparatus is provided with: a thermal radiation...
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WO/2013/161453A1 |
The present invention comprises: a drift plate on which the structure of a drift member is devised to change the direction of the flow of molten solder; a semi-cylindrical plate (11) that has a predetermined inner shape and a predetermin...
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WO/2013/157226A1 |
Provided is a solder supply device that supplies molten solder all at once to a plurality of points on a target that is mounted on a stage. The solder supply device comprises a solder pot, a shutter unit, a first actuator, a second actua...
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WO/2013/153616A1 |
Provided is a substrate-working machine, comprising a work device that selectively executes the work of mounting a conductive ball onto a circuit substrate using a ball holder (82) and the work of transferring an viscous fluid onto the c...
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WO/2013/144725A2 |
A method of making a soldering tip involves heating a soldering tip cap which contains a heat-conducting material. The heating is performed with magnetic induction applied to the soldering tip cap. Inner spaces of the soldering tip cap b...
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WO/2013/129192A1 |
By this brazing method, one base material having a non-plated surface, a metal layer for functioning as a diffusion barrier layer, a foil brazing material, and another base material having a surface are arranged with the one base materia...
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WO/2013/111651A1 |
This jet soldering height checking jig is provided with, as shown in FIG. 1: a conductive gauge member (10) that carries out at least either setting or measuring the height of a jet wave of molten solder; an insulating sliding holding me...
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WO/2013/108465A1 |
A method for flux-free surface brazing between an aluminum alloy member and a copper alloy member using a single-layer brazing sheet, wherein: in a state in which a single-layer brazing sheet comprising a brazing material having a compon...
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WO/2013/106284A2 |
Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contact...
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WO/2013/094249A1 |
Provided is a method of joining a large diameter water pipe to a small diameter refrigerant pipe to manufacture a heat exchanger, such that dropping of molten solder is advantageously prevented and effective joining of the water pipe to ...
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WO/2013/077111A1 |
Provided are an apparatus and a method for wiring a solar cell, whereby an unnecessary portion of a wiring material piece having first regions and second regions alternately provided is automatically cut, said first regions and second re...
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WO/2013/067771A1 |
Disclosed is a multifunctional plastic repair machine, including a power source module, and an operation handle used for executing a working procedure operation. The operation handle employs a wire to connect to the power source module. ...
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WO/2013/068700A1 |
The invention relates to a setup for assembling, by brazing, a composite panel (100) comprising at least two parts separated by a filler material and intended to be joined together by brazing involving: a furnace that allows a brazing te...
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WO/2013/065333A1 |
In the control device (100) for this furnace, a control unit (101) operates a supply unit in accordance with a first condition and a second condition. The first condition is a condition for maintaining the interior of the furnace in a fi...
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WO/2013/063843A1 |
A device for cleaning a soldering iron tip comprising a base (1), a cleaning unit (2) installed on the base (1) for brushing and cleaning the soldering iron tip, and a driving mechanism for driving the cleaning unit (2) laterally back an...
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