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JPH02284814A |
PURPOSE: To efficiently cut a workplate by supplying a workplate piece formed with a longitudinal cutting saw onto the mounting table of a traverse cutting saw below a lifting device, and after traversely cutting it with the traverse cut...
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JPH02274491A |
PURPOSE: To prevent a large amount of dust from being produced by putting a cutting blade on the flat surface of a web and detecting an optimum cutting direction automatically in a cutting condition. CONSTITUTION: A slide 13 is provided ...
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JPH02266520A |
PURPOSE: To monitor the track of a saw blade inside a work piece by using an eddy current sensor provided with a cover composed of a semiconductor material on a surface turned toward the saw blade. CONSTITUTION: When monitoring cutting o...
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JPH02255304A |
PURPOSE: To fix the direction of slicing surface with respect to the face direction of an ingot and contrive to reduce the cost of slicing operation by a method wherein a laser beam source, the position of which can be angularly adjusted...
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JPH0245561B2 |
A portable electric circular saw which operates on a rechargeable battery is disclosed. The circular saw comprises a housing for accommodating a motor driving a circular saw blade operatively connected thereto, the rechargeable battery s...
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JPH02234757A |
PURPOSE: To obtain a cutting guide having a main body to be equipped with and aligned by controlling a cutting guide surface with use of a rear femur condyle-observing guide. CONSTITUTION: A cutting guide 10 is fixed adjustably to a hand...
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JPH0232343Y2 |
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JPH02218512A |
PURPOSE: To enable the presence of a work piece to be positively detected automatically by making the movable vice of a feed vice come close to a stationary vice, and thereby comparing the value of the detected distance from the stationa...
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JPH02214612A |
PURPOSE: To prevent the adhesion of cut chips onto the surface of an object to be cut such as an Si substrate, and to obtain the washing effect of uniform high cleanliness by installing pure-water injection mechanisms on both sides of th...
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JPH02182406A |
PURPOSE: To obtain the appropriate shape of cross sectional edge face by providing the computer analyzing the measured value from measuring part wherein the piezo-electric elements opposite to the cross sectional edge face of ingot-side ...
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JPH02137905A |
PURPOSE: To perform favorable cooling and discharge of chips, by a method wherein a cutting member is mounted on the outer circumference of a rotary board, a spouting port is communicated with a cutting member side by passing through a c...
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JPH02134212A |
PURPOSE: To prevent the displacement of an inner peripheral edge thereby to improve the accuracy in warp, thickness and parallelism of a thin plate by providing one or more displacement sensors in the vicinity where the inner peripheral ...
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JPH0216681B2 |
An exhaust duct is arranged vertically slidably on a vertical board saw so that it always follows the vertical movement of the sawing unit during horizontal cutting. The exhaust duct is formed by a U-shaped profile, in which an endless d...
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JPH0253515A |
PURPOSE: To obtain a large cooling effect with cooling water sufficiently further surely supplied to a blade point by laminating two or more metal plates being spaced and providing a cooling water supply port, communicating with a space ...
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JPH0240916A |
PURPOSE: To contrive the improvement of a working efficiency without stopping a rotating blade at each time of measurement by a method wherein when a cut work of a prescribed Si wafer or the like is obtained by cutting it out from an Si ...
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JPH0239905A |
PURPOSE: To safely perform cutting work while minimizing the scattering of small pieces of asbestos fibers by arranging a rotary saw so as to partially protrude the same from the opening provided in a suction container and reducing the p...
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JPH01321105A |
PURPOSE: To prevent rise of temperature at a cutter edge without soiling working face with cooling liquid, by forming a circulating flow path of liquid which cools a cutter edge made of diamond chips or the like welded to the end of a sh...
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JPH01301054A |
PURPOSE: To immediately correct the curving of an inner peripheral cutting edge blade during cutting work by providing a fluid injection device for injecting a fluid for one face at least of the blade according to the curving of the uppe...
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JPH0156882B2 |
A portable power chain saw with a safety device to protect against kick-back or recoil movements of the saw. The power chain saw has a handle, a finger guard which is arranged between the handle and the saw chain and acts as an inertial ...
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JPH01280507A |
PURPOSE: To improve cutting performance by effecting cooling and dust collecting at a time through an open air circulation method, by a method wherein a suction rotary blade is provided around a rotary driving shaft, an opening part is f...
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JPH0151289B2 |
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JPH0151321B2 |
A portable miter saw for cross-cutting and mitering elongated workpiece has a mechanism interlocked with the turntable for shutting the saw blade clearance gap in the guide fence. The mechanism is provided with a pair of shutter plates s...
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JPH0145978B2 |
A dicing apparatus for cutting a semiconductor wafer into a plurality of a microelectronic circuit dice each having bonding pads which are located adjacent a cutting path on the wafer. The apparatus comprises a diamond dicing blade which...
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JPH01228774A |
PURPOSE: To enable a silicon wafer which is of high precision and has little curvature, to be separated by cutting and at the same time, lengthen the life of a cutting edge, by jetting in pressurization the grinding liquid of alkalinity ...
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JPH01210271A |
PURPOSE: To detect tension of a blade efficiently in short time by arranging an eddy current detector closely to the blade face. CONSTITUTION: An eddy current detector 6 is arranged closely to the blade face 1 in a slicing machine for cu...
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JPH01206006A |
PURPOSE: To contrive to enhance the surface precision of the work surface of a workpiece by a method wherein a calculating means to calculate the displacement in the direction of a rotating shaft under the rotation of a parting tool on t...
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JPH0134767B2 |
This invention relates to a hub for supporting a diamond-edged concrete saw such that the saw can make a cut while lying flush against a planar surface such, for example, as a floor or wall. The hub (10) is characterised by a rearwardly-...
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JPH01153213A |
PURPOSE: To cut and chamfer an edge part of a work piece at a high speed by arranging a pair of circular saw blades so as to pinch a printed circuit board work piece, and forming the saw blades with a teeth part in one side of the saw te...
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JPH01140915A |
PURPOSE:To lengthen the life of a saw blade as well as to enable a cutting method giving a satisfactory cutting surface by cutting the original sheet of a printed wiring by the use of a saw blade while blowing cooling air to sections in ...
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JPH0174020U |
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JPH01121120A |
PURPOSE:To detect a saw-tooth pitch automatically by counting the number of saw teeth passing through just before a detector at unit time with a signal detecting the presence of the saw tooth, and constituting the saw-tooth pitch so as t...
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JPH0160822U |
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JPH0119324B2 |
Crystalline rods or blocks can be sawed into thin wafers by sawing the rod or block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into t...
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JPS6464810A |
PURPOSE: To make it possible to carry out efficiently lubrication and cooling of a blade part and discharge of chips when cutting is carried out, by flowing out a cooling medium from the outer circumferential part of a rotating blade by ...
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JPH0113991B2 |
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JPH0113972B2 |
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JPS6431604A |
PURPOSE: To contrive extension of life of a blade, by a method wherein only pure water is fed to the blade by interrupting feed of carbon dioxide between a first wafer cutting process and second wafer cutting process. CONSTITUTION: A dev...
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JPS6430716A |
PURPOSE: To facititate repeating of the cut edge rotation and the accurate adjustment of the annular saw blade by a method wherein the rotation in the radius direction of the cut edge is measured as an function of the position and the sa...
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JPS6416215U |
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JPS6416611A |
PURPOSE: To prevent the temperature rising of a diamond blade, while the friction heat between the diamond blade and a wafer sheet is easily diffused by providing the mechanism for cooling the semiconductive wafer in a dicing stage. CONS...
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JPS63300889A |
A mechanical hand for processing edges of a curved plate, is attached to the hand supporting member of a robot arm and is moved along the edges of the curved plate, made of glass, ceramics, metal or the like. The mechanical hand has a fi...
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JPS63300818A |
A tool for cutting a workpiece (23) comprising a tool body (10); means on the tool body for securing the workpiece; a saw blade (20) movably supported on the body for cutting the secured workpiece, the saw blade having a plurality of cut...
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JPS6346189Y2 |
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JPS6355407B2 |
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JPS63151219U |
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JPS63199610A |
In a process for manufacturing semiconductor components, in particular for fairly high powers, at least one circular component substrate (2) of fairly small area is cut out of a wafer (1) with a hollow drill (4). According to a preferred...
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JPS63185517A |
An apparatus for handling bar-like workpiece material in a sawing machine, in particular in the form of a miter-box saw, whichhas a clamping carriage that is disposed on the machine frame above the workpiece table and is movable horizont...
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JPS63164436A |
PURPOSE: To determine the feed for cutting a fragmentary material by setting a reference level at the top end of the sensing probe of an apparatus for detecting the displacement amount of the ingot end face, and reading the displacement ...
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JPS63144959A |
A process for the sawing of crystal rods or blocks into thin wafers by internal-hole saws is specified. In this process, the deviation of the saw blade from the intended cutting line, occurring in virtually every sawing operation, is cou...
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JPS6383217U |
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