| Document |
Document Title |
|
WO/2019/181443A1 |
The present invention is a method for producing a silicon wafer, which comprises a dry etching step between a rough polishing step and a final polishing step, and which is characterized in that a silicon wafer after the rough polishing s...
|
|
WO/2019/177840A1 |
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning d...
|
|
WO/2019/177092A1 |
[Problem] To achieve: a diamond crystal polishing method capable of removing a process-modified section including dislocations from a main surface; and a diamond crystal in which the same process defect section has been removed from a ma...
|
|
WO/2019/177842A1 |
A method of controlling polishing includes polishing a substrate, monitoring the substrate during polishing with an in-situ monitoring system, filtering a signal from the monitoring system to generate a filtered signal, and determining a...
|
|
WO/2019/176558A1 |
A polishing composition for polishing resin, wherein: the polishing composition contains alumina abrasive grains, a dispersant, and water; and the ratio of the primary average particle size of the alumina particles in the alumina abrasiv...
|
|
WO/2019/177841A1 |
A polishing apparatus includes a polishing station to hold a polishing pad, a carrier head to hold a substrate in contact with a polishing pad at the polishing station, a camera positioned to capture an image of a lower surface of a cons...
|
|
WO/2019/178194A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic ...
|
|
WO/2019/167540A1 |
Provided are: a polishing composition that can be suitably used for polishing a polishing-object made of synthetic resin; a method for producing the polishing composition; and a polishing method using the polishing composition. A polishi...
|
|
WO/2019/164722A1 |
A fixed abrasive three-dimensional plate includes micron size diamond beads or a mixture of abrasive particles and metal oxide beads, ranging in size from a few microns to a few tens of microns, incorporated into a matrix of one or more ...
|
|
WO/2019/159603A1 |
The present invention is a double-sided polishing method for a wafer, for holding the wafer in a work piece holding hole formed in a carrier in a double-sided polishing device, sandwiching the wafer between an upper surface plate and a l...
|
|
WO/2019/154630A1 |
An improved treatment tool (100) for reconditioning the top surfaces of a plurality of projections (20) of a substrate support (60) in a lithographic tool. The improved treatment tool includes a reconditioning surface which is rough rela...
|
|
WO/2019/154790A1 |
The invention relates to a method for polishing a semiconductor wafer, which is polished simultaneously on both sides on the front side and on the reverse side between an upper polishing plate (11) and a lower polishing plate (12), which...
|
|
WO/2019/151185A1 |
In the present invention, when a glass blank is being cut out from a glass plate, first laser light is moved relative to the glass plate such that a focal position of the laser light is located in the interior of a plate thickness direct...
|
|
WO/2019/151145A1 |
Provided are: a chemical mechanical polishing composition which can polish a semiconductor substrate (particularly, a ruthenium film-containing substrate) at high speed and reduce polishing scratches on a surface to be polished while sup...
|
|
WO/2019/151144A1 |
Provided are: a chemical mechanical polishing composition which can polish a semiconductor substrate (particularly, a ruthenium film-containing substrate) at high speed and reduce polishing scratches on a surface to be polished while sup...
|
|
WO/2019/151041A1 |
A substrate processing system for processing a substrate, which comprises: a carry in/out unit for carrying a substrate between the system and the outside; a processing unit for processing a surface of the substrate; a cleaning unit whic...
|
|
WO/2019/151584A1 |
The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower par...
|
|
WO/2019/139586A1 |
Disclosed herein are chemical mechanical polishing (CMP) polishing pad and platen structures, and related systems and techniques. For example, in some embodiments, a CMP conditioning system may include a CMP polishing pad structure and a...
|
|
WO/2019/138846A1 |
The present invention provides a polishing composition with which polishing rates can be effectively improved and which is for polishing works to be polished. The polishing composition comprises water, abrasive grains, an oxidant, and a ...
|
|
WO/2019/139117A1 |
This polishing pad is capable of polishing an article to be polished while rotating as a polishing slurry is supplied, wherein: the polishing pad is provided with a polishing layer having a polishing surface that is capable of polishing ...
|
|
WO/2019/131761A1 |
This abrasive composition for abrading a resin and copper or a copper alloy, comprises alumina abrasive grains, glycine, an anionic surfactant, and water.
|
|
WO/2019/130740A1 |
This suction chuck is provided with: a suction chuck stage having a circular suction surface; and a suction pad that is provided on the suction surface. The suction chuck is also provided with, at an outer peripheral portion of the sucti...
|
|
WO/2019/131174A1 |
The present invention relates to a device for partially removing material constituting the surface of a substrate. In one embodiment, the substrate processing device comprises a holding mechanism unit (5) for holding the substrate (W), a...
|
|
WO/2019/131885A1 |
Provided is a slurry for polishing, which is used for polishing of an interlayer insulating film, and which contains silica abrasive grains and organic ammonium cations that have a molecular weight of 155 or less.
|
|
WO/2019/130764A1 |
Provided is a method for two-sided polishing of a wafer that makes it possible to curb variance between batches in GBIR values of polished wafers. This method for two-sided polishing of a wafer is characterized by comprising: a step (S10...
|
|
WO/2019/131887A1 |
The present invention is a polishing pad which comprises a polyurethane resin foam, and which has a polishing surface that is configured of the surface of the polyurethane resin foam. This polishing pad is configured such that the polyur...
|
|
WO/2019/131450A1 |
Provided is a polishing composition capable of reducing device vibrations. This polishing composition comprises colloidal silica, a water-soluble polymer, a basic compound, water, and a vibration suppression agent which is a polymer havi...
|
|
WO/2019/130757A1 |
Provided are a double-side polishing device and a double-side polishing method with which it is possible to end double-side polishing when a workpiece has obtained an intended shape in the middle of double-side polishing. An arithmetic u...
|
|
WO/2019/131762A1 |
This abrasive composition for abrading a resin and copper or a copper alloy, comprises alumina abrasive grains, glycine, hydrogen peroxide water, and water.
|
|
WO/2019/131874A1 |
Provided is a method for producing a chain-like silica particle dispersion. The production method has: a dispersion preparation step for hydrolyzing an alkoxysilane in the presence of ammonia to produce a silica particle dispersion; an a...
|
|
WO/2019/131448A1 |
Provided is a polishing composition which can further reduce minute defects and haze in a polished semiconductor wafer. The polishing composition comprises abrasive grains, a basic compound and a vinyl alcohol-based resin having a 1,2-di...
|
|
WO/2019/131545A1 |
A polishing solution composition for silicon oxide films according to the present invention contains cerium oxide particles, a water-soluble polymeric compound and a water-based medium, wherein the water-soluble polymeric compound is a w...
|
|
WO/2019/131431A1 |
This disk-shaped glass substrate manufacturing method is for manufacturing a disk-shaped glass substrate from which one or more sheet glass substrates are to be cut out. The disk-shaped glass substrate manufacturing method comprises: pre...
|
|
WO/2019/125572A1 |
A lapping tool assembly includes a mount tool and an interposer structure interposed between actuators and the mount tool, where the interposer includes interposer pins reactively coupled with the actuators such that each interposer pin ...
|
|
WO/2019/124442A1 |
[Problem] To provide a composition for polishing that eliminates a protrusion in the periphery of a laser mark in a wafer polishing process, and a polishing method in which the same is used. [Solution] A composition for polishing for eli...
|
|
WO/2019/125571A1 |
A lapping mount tool and a process for lapping a row of head sliders involves affixing the row to a lapping mount tool fixture, actuating each of multiple first actuation pins to set each head slider for lapping to a respective element t...
|
|
WO/2019/116833A1 |
The present invention provides a polishing composition whereby, when a silicon wafer is roughly polished, it becomes possible to prevent the elevation of the periphery of a hard laser mark, it also becomes possible to reduce the surface ...
|
|
WO/2019/111686A1 |
A polishing composition containing a cellulose derivative and water is provided. Prior to being mixed with water, the cellulose derivative has the form of a hydrophobized cellulose derivative having an aldehyde added to the surface of sa...
|
|
WO/2019/110385A1 |
The invention relates to a rotor disk for guiding semiconductor wafers during material-removing machining of the semiconductor wafers on both sides. The rotor disk is coated with a layer of diamond-like carbon. The layer contains hydroge...
|
|
WO/2019/100461A1 |
A multi-chip thickness compensation device for single-sided polishing, a grinding device, and a grinding method. The device comprises a carrier (1). Multiple chip accommodation grooves (7) are formed in the carrier (1). Chip carrying cus...
|
|
WO/2019/099541A1 |
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to hold a conditioning d...
|
|
WO/2019/097945A1 |
The present invention relates to a polishing agent for a synthetic quartz glass substrate, the polishing agent being characterized by comprising wet ceria particles and non-spherical silica particles, wherein the average primary particle...
|
|
WO/2019/094227A1 |
Embodiments of the present disclosure provide for apparatus used to detect clogs in a fluid delivery system during CMP processes and methods of detecting clogs in a fluid delivery system during CMP processes. In particular, embodiments h...
|
|
WO/2019/087818A1 |
Provided is a polishing composition which contains a water-soluble polymer compound and which is suitable for reducing LPD. The polishing composition according to the present invention contains abrasive grains, a water-soluble polymer co...
|
|
WO/2019/088600A1 |
The present invention relates to a polishing apparatus which is disposed below a polishing wheel so as to polish the surface of a workpiece, the polishing apparatus comprising: a frame which has a central shaft disposed collinearly to on...
|
|
WO/2019/089467A1 |
A method and a system for planarizing a membrane is disclosed. In one aspect, the method includes providing a resilient membrane and planarizing the surface of the membrane with a conditioning tool. The planarized membrane may be used in...
|
|
WO/2019/088209A1 |
According to the present invention, in a particle size distribution for a cerium oxide contained in a polishing liquid as obtained by a laser diffraction/scattering method, D5 is 1 μm or less, and the difference between D95 and D5 is 3 ...
|
|
WO/2019/077687A1 |
This silicon wafer polishing method includes a final polishing step comprising a preliminary stage polishing step, and, thereafter, a finishing polishing step. The preliminary stage polishing step comprises first supplying, as the polish...
|
|
WO/2019/078009A1 |
A device (2) for affixing a wafer (W) to a single-side polishing device (1), wherein the device (2) affixes the wafer to the single-side polishing device by means of surface tension of water, is provided with: a temporary cradle (21) whi...
|
|
WO/2019/078202A1 |
This polishing jig for holding and polishing a plate-like body comprises a metal plate including a through-hole for holding the plate-like body, and a gear portion which engages with an outer circumference of the metal plate, wherein the...
|
