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WO/2016/208816A1 |
The present invention relates to a polymer resin comprising: (1) a polycyclic aromatic hydrocarbon-containing group; and (2) C6-30 aromatic or cycloaliphatic -containing group, to a method for preparing the same, to an adhesive film comp...
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WO/2016/202359A1 |
The present invention relates to the field of adhesives and especially to the field of moisture curing, or hardening, adhesives. The present adhesives provide high strength, i.e. at least more than 4 N/mm2, adhesion of materials such as ...
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WO/2016/196082A1 |
A one part moisture curable adhesive composition having improved heat stability is comprised of a silyl terminated polymer, a catalyst and a particular phosphite compound. The phosphite compound has three groups wherein at least two of t...
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WO/2016/182215A1 |
The present invention relates to a polyarylene sulfide resin composition with a low out-gas content, comprising: a polyarylene sulfide; and a phenoxy resin. The polyarylene sulfide resin composition of the present invention exhibits a lo...
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WO/2016/182212A1 |
The present invention relates to a polyarylene sulfide resin composition which contains polyarylene sulfide and a polyvinyl butyral resin and has a low outgas content. The polyarylene sulfide resin composition of the present invention ex...
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WO/2016/171269A1 |
Provided is a method for producing a pressure-sensitive adhesive, in which a cured product of a curable composition that contains an organic polymer having a crosslinkable silicon group and an adhesion-imparting resin is provided as a pr...
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WO/2016/167303A1 |
Although cationic photocurable compositions of the prior art had photocuring properties, the curing process was extremely slow, ultimately making it difficult to obtain cured products that had cured adequately. This photocurable composit...
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WO/2016/164535A1 |
The present invention provides a sheet having an elastomer layer having a Shore A hardness of less than 40, wherein the elastomer layer has an adhesion force to stainless steel of not more than 11 oz/in at 90 degree peel strength.
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WO/2016/140204A1 |
[Problem] Conventional conductive adhesives had difficulty with balancing storage stability and low-temperature curability, and with manifesting adhesive strength and conductivity when used on poorly-adhesive metal adherends such as gold...
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WO/2016/125537A1 |
Provided are: a film-shaped adhesive suitable as an NCF and being void-free, having excellent electrical connection properties and reliability thereof, having excellent surface flatness, and not being prone to cracking; and a semiconduct...
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WO/2016/097040A1 |
The present invention primarily relates to a multi-component adhesive for producing an adhesive hydrogel, comprising the following defined compound of formula (I) and one, two, three, four or more further components. The invention also r...
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WO/2016/093114A1 |
The purpose of the present invention is to provide an adhesive composition in which recognition of an alignment mark is possible, solder wettability of a joining section is adequately ensured, and suppression of void occurrence is excell...
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WO/2016/047519A1 |
The purpose of the present invention is to provide a curable composition which enables strong adhesion, without carrying out a primer treatment, to a metal, glass or coated surface, and especially to a porous base material such as mortar...
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WO/2016/024492A1 |
Provided are an ultraviolet-ray-curable resin composition having superior transparency, and a laminate using the same. The ultraviolet-ray-curable resin composition contains: (A) at least one polymer selected from the group consisting of...
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WO/2016/019248A1 |
There is provided cured coating compositions derived from a one-part, moisture curable composition comprising (a) a polyoxyalkylene polymer having at least one end group derived from an alkoxy silane, and (b) a plasticizer selected from ...
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WO/2015/198063A1 |
A component comprising a first part and a second part, wherein a third part is positioned between the first and second parts, wherein: (i) said first part comprises a polymeric material (A) which comprises a repeat unit of formula (XI) w...
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WO/2015/178313A1 |
A printed wiring board provided with: a first insulating substrate (11) produced from a liquid crystal polymer; a first signal line (131) formed on one principal surface (11a) of the first insulating substrate (11); a second insulating s...
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WO/2015/170374A1 |
Provided is a polycarbonate/(polyoxy ethylene) block copolymer for aqueous compositions, which contains a polycarbonate structure represented by general formula (1) and a polyoxy ethylene structure represented by general formula (2), whe...
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WO/2015/167132A1 |
The present invention relates to an antistatic adhesive composition and a polarizing plate manufactured using the same and, more specifically, to: an antistatic adhesive composition which can show excellent antistatic performance, and ex...
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WO/2015/163643A1 |
The present invention relates to an antistatic adhesive composition and a polarizing plate manufactured by using same and, more specifically, to an antistatic adhesive composition and a polarizing plate manufactured by using same, the an...
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WO/2015/155355A1 |
The invention relates to the use of an adhesive, which comprises at least one silane-functional polymer P; at least one catalyst for crosslinking silane-functional polymers, said catalyst being selected from the group consisting of organ...
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WO/2015/156517A1 |
The present invention relates to an antistatic adhesive composition and a polarizing plate manufactured using the same and, more specifically, to an antistatic adhesive composition and a polarizing plate manufactured using the same, wher...
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WO/2015/152134A1 |
To provide a resin composition having excellent thermal conductivity, adhesion, and film molding properties, and particularly a resin composition having excellent thermal conductivity after curing. A resin composition characterized by in...
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WO/2015/152201A1 |
An adhesive agent composition for optical films, which comprises: a (meth)acrylic polymer (A) that contains, as monomer units, 70% by weight or more of an alkyl (meth)acrylate (a1), 3 to 25% by weight of an aromatic-ring-containing (meth...
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WO/2015/133564A1 |
Provided is a curable composition that includes an organic polymer having a reactive silicon group that can be used as a sealing material or an adhesive having excellent tensile properties, curing delay after being stored, and depth of c...
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WO/2015/125354A1 |
[Problem] The purpose of the present invention is to provide an anaerobically curable adhesive agent which can be cured into a cured product with generating an out gas in a reduced volume and has excellent adhesivity to metals. [Solution...
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WO/2015/088021A1 |
Provided is a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equal to ...
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WO/2015/079903A1 |
Provided is a surface-protecting adhesive sheet which can be easily bonded to the surface of an electronic device with little need for external force, and which can be easily re-bonded. This surface-protecting adhesive sheet is provided ...
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WO/2015/079902A1 |
Provided are: a double-sided adhesive sheet which can exhibit good peeling properties under a constant load even when an adhesive layer therein has relatively high coagulation power; and a double-sided adhesive sheet production method wh...
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WO/2015/079905A1 |
Provided are: a pressure-sensitive adhesive composition which exhibits excellent constant-load-bearing properties and so on even in a case where the amount of a curing catalyst blended is small or even in a case where no curing catalyst ...
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WO/2015/080428A1 |
Provided is a composition for forming an adhesive film, comprising: a phenoxy-based thermosetting resin; a cyclic epoxy-based photo-curable compound; an isocyanate-based heat hardening agent; and a cationic photoinitiator.
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WO/2015/074031A1 |
An adhered roofing system comprising a roof substrate, a polymeric membrane; and an adhesive disposed between the roof substrate and the polymeric membrane, where the adhesive is the cured product of an adhesive composition comprising (a...
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WO/2015/068811A1 |
Provided are an adhesive composition and a film roll whereby blocking can be prevented and good temporary pressure bonding properties can be obtained. The adhesive composition of the present invention contains an epoxy resin, a latent cu...
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WO/2015/024773A1 |
The invention relates to cross-linkable masses (M), containing (A) 100 parts by weight of silane-cross-linking polymers of the formula (HO)x-Y- [O-CO-NH- (CR1 2)b-SiRa(OR2)3-a]2-x (I), with the stipulation that component (A) has less tha...
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WO/2014/200100A1 |
The present invention provides an adhesive composition having excellent adhesive strength. This adhesive composition is characterized by containing 100 parts by weight of polyalkylene oxide having a hydrolyzable silyl group, 1-20 parts b...
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WO/2014/178239A1 |
The present invention addresses the problem of providing an adhesive composition which has excellent curability and adhesiveness. The present invention provides: an adhesive composition which contains (A) a cationically polymerizable com...
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WO/2014/157408A1 |
This electrically peelable adhesive composition, which contains an acrylic polymer (A), a (poly)alkylene polyol (B) having a number average molecular weight of no greater than 2,000, and an ammonium salt (C) has a high adhesiveness befor...
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WO/2014/157406A1 |
This electrically peelable adhesive composition comprises: an emulsion-type acrylic adhesive (A) containing an acrylic polymer (A1) obtained by means of emulsion polymerization using a monomer mixture containing a (meth)acrylic alkyl est...
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WO/2014/158288A1 |
The invention provides compositions that use phenylic derivatives to provide adhesive properties. Selection of phenylic derivatives with linkers or linking groups, and the linkages between the linkers or linking groups with polyalkylene ...
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WO/2014/157306A1 |
A temporary adhesive for producing a semiconductor device is provided with which it is possible to diminish even at high temperatures the problem wherein, when a member to be treated (e.g., a semiconductor wafer) is mechanically or chemi...
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WO/2014/148155A1 |
Provided are: a resin composition that can be thermally cured at 180°C or lower, the resin composition having excellent adhesive strength to substrate materials, electrical properties in the high-frequency region of a frequency of 1 GHz...
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WO/2014/129261A1 |
The present invention addresses the problem of providing a cation-polymerizable adhesive that exhibits superior curability and adhesiveness not only when used with a variety of protective films, but even when used with a protective film ...
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WO/2014/128272A1 |
The invention relates primarily to a multi-component adhesive for producing an adhesive hydrogel, comprising the compound of formula (I) defined below and one, two, three, four, or more additional constituents. The invention further rela...
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WO/2014/097719A1 |
This adhesive composition for an optical film contains (A) 65-85 mass% of a (meth) acrylic resin having a weight average molecular weight of 100,000-600,000, (B) 10-30 mass% of a polyoxyalkylene polyol having a number average molecular w...
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WO/2014/069353A1 |
Provided is a highly reliable semiconductor device which exhibits excellent heat dissipation performance of a heat-generating element and solves the problem of decrease in the bonding strength between the heat-generating element and a su...
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WO/2014/064986A1 |
The coverlay film of the present invention comprises (A) a specific vinyl compound, (B) a polystyrene-poly(ethylene/butylene) block copolymer, (C) a polystyrene-poly(ethylene-ethylene/propylene) block copolymer, (D) an epoxy resin, and (...
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WO/2014/046124A1 |
[Problem] To provide a method for adhering hydrogels to one another by interposing polyalkylene glycol between the hydrogel gel surfaces to be adhered to one another. [Solution] A method for adhering hydrogels of identical types or diffe...
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WO/2014/038656A1 |
Provided is a curable composition which is usable as a rapid -curable adhesive or the like and which exhibits excellent curability and excellent initial adhesiveness. The curable composition comprises a polyoxyalkylene-based polymer (a1)...
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WO/2014/029837A1 |
Moisture-hardening 1-component or 2-component composition that contains at least one prepolymer with at least one hydrolysable silane group, chosen from silane-modified polyoxyalkenes, polyolefins, poly(meth)acrylates, polyurethanes, pol...
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WO/2014/024963A1 |
The purpose of the present invention is to provide a curable composition which has low viscosity and still enables a cured product thereof to have low modulus and excellent weather resistance after curing, while having excellent fast cur...
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