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WO/2014/024678A1 |
The purpose of the present invention is to provide: an adhesive film for electrical/electronic applications and a coverlay film, each of which enables the achievement of a lower dielectric constant and a lower dielectric loss in the freq...
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WO/2014/024471A1 |
The present invention relates to: an optical member which is obtained by bonding two or more optical bases with use of a cured product of an ultraviolet curable resin composition that is characterized by containing (A) a novolac compound...
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WO/2014/010404A1 |
Provided is a conductive adhesive for a solar cell, which is for connecting a tab wire with an electrode of a solar cell unit and comprises at least a fluorene-type phenoxy resin, a fluorene-type epoxy resin, a curing agent and conductiv...
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WO/2014/006189A1 |
The invention relates to the use of an adhesive composition to provide a bonding in a wet environment. The invention also relates to a method for providing a bonding in a wet environment.
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WO/2013/187580A1 |
The present invention relates to: an adhesive composition for a polarizing plate, comprising (A) a (meth)acrylic radical compound, (B) an epoxy-based cationic compound, (C) a phenoxy resin, and (D) a photoinitiator; a polarizing plate us...
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WO/2013/176990A1 |
Biomimetic adhesive compositions can be used in various aspects of subterranean treatment operations. Methods for treating a subterranean formation can comprise: providing an adhesive composition that comprises a first polymer comprising...
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WO/2013/161864A1 |
A method for producing a composition for film adhesives, said composition having an elastic modulus of 20-3,000 MPa at 200°C after thermal curing and a saturation water absorption of 1.5% by mass or less after thermal curing, and contai...
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WO/2013/157498A1 |
Provided is an adhesive composition comprising: a (meth)acrylic polymer (A); an ionic compound (B1) that comprises a cationic component and an anionic component carrying an organic group having 3 or more carbon atoms; and an ionic compou...
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WO/2013/151027A1 |
An adhesive composition for optical films, which contains (A) a (meth)acrylic polymer that contains, as a monomer unit, a hydroxyl group-containing monomer, (B) a polyether compound that has a repeating structure unit composed of an oxya...
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WO/2013/150769A1 |
An adhesive composition includes: 100 parts by mass of a polymer (A) having a glass transition temperature of less than 0˚C; 0.05-3 parts by mass of a (meth)acrylic polymer (B) which has a weight average molecular weight of 1000 or more...
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WO/2013/140472A1 |
The present invention relates to: an ultraviolet-ray-curable adhesive agent which can be used for adhering an optical base to an optical base having a light-shielding part on the surface thereof to each other, and is characterized by com...
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WO/2013/138414A1 |
Adhesive compositions having a reduced cure time and methods for making and using same are provided. In at least one specific embodiment, the adhesive composition can include a mixture of one or more phenolic-aldehyde resins and one or m...
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WO/2013/137110A1 |
The present invention provides a polyester-based adhesive composition, as well as an adhesive sheet using the same, that can be manufactured even from plant-derived raw materials without the use of expensive silicone-based adhesives and ...
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WO/2013/137109A1 |
Provided are: a polyester-based adhesive composition which can be produced from a raw material derived from plants without using an expensive silicone-based adhesive, etc., and which can be used for the production of an adhesive sheet wh...
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WO/2013/134000A1 |
Adhesive tape for bonding that can be detached without leaving residue and without damaging the surface of a substrate when stretched in a direction of a bond plane. An adhesive tape includes an elastomeric backing having opposing first ...
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WO/2013/133041A1 |
This halogen-free flame-retardant adhesive composition contains (A) solvent-soluble polyamide resin that is solid at 25°C, (B) phenoxy resin, (C) halogen atom-free epoxy resin, and (D) phosphorus-based flame retardant having a structure...
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WO/2013/121701A1 |
The present invention provides a protective film for semiconductor wafers which is provided with a base film and a protective membrane formed on the upper side of the base film, wherein the protective film for a semiconductor wafer is ch...
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WO/2013/122144A1 |
[Problem] The purpose of the present invention is to provide a photocurable sheet-type adhesive composition for optical use, which can be used to adhere together a cover glass and a touch panel or a touch panel and a display module, for ...
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WO/2013/105163A1 |
The present invention pertains to an ultraviolet curable adhesive characterized by: being used to bond an optical substrate and an optical substrate having a light-blocking section to a surface; and containing an organic compound (A) tha...
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WO/2013/105162A1 |
The present invention pertains to: an ultraviolet-curable adhesive that is used for bonding an optical substrate and an optical substrate having a light-blocking section on the surface thereof to one another, and is characterized by cont...
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WO/2013/099172A1 |
[Problem] To provide a cover lay film having excellent adhesion to a base film on a flexible wiring board and having excellent transmission characteristics of electrical signals such as high-frequency waves; and to provide a wiring board...
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WO/2013/058184A1 |
Provided is a water-dispersible acrylic adhesive composition capable of forming an adhesive layer, which, when peeled, can prevent the buildup of electrostatic charge in the object to which the film is adhered (antistatic properties), ha...
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WO/2013/057957A1 |
[Problem] The present invention pertains to an ultraviolet ray cured resin composition characterized by containing a compound (A) having a structure indicated by general formula (1) (in the formula, n is an integer from 0 to 40, m is an ...
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WO/2013/051721A1 |
Provided is a composition that is highly workable, fast-curing, highly thermally conductive, and low-outgassing. A thermally conductive composition containing: (A) an insulating thermally conductive filler; (B) a polyalkylene glycol havi...
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WO/2013/047837A1 |
[Abstract] The present invention provides a curable composition capable of forming a cured article that exhibits excellent adhesion and weather resistance properties. This curable composition is characterized by containing: a polyoxyalky...
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WO/2013/047823A1 |
The present invention provides a curable composition capable of curing in a short time and having excellent adhesion properties. This curable composition is characterized by containing: a polyoxyalkylene polymer (A) containing a trimetho...
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WO/2013/047838A1 |
The present invention provides a floor structure adhesive for adhering and integrating a floor surface material (20) onto a subfloor material (30) laid onto a floor base (1), the floor structure adhesive being characterized by: containin...
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WO/2013/038840A1 |
A film-like anisotropic conductive adhesive, which has connection reliability and repairability, and does not lose adhesive strength even if the heating temperature is reduced during bonding, is provided. Said adhesive contains (A) a phe...
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WO/2013/018707A1 |
The present invention addresses the problem of providing: a composition which is capable of forming a biomass material with low energy consumption by simple processes and simple facilities; a molded body which is obtained from the compos...
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WO/2013/008757A1 |
The invention provides a dicing-tape-integrated adhesive sheet that has excellent handling properties, and can connect terminals of opposing members while simultaneously sealing gaps between members. This dicing-tape-integrated adhesive ...
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WO/2013/005691A1 |
The present invention proposes: a (meth)acrylic resin represented by formula (1); and a resin composition prepared using the (meth)acrylic resin. In the formula, the benzene ring Ar may be present or absent; a bond a represents a single ...
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WO/2013/002004A1 |
Provided is a thermosetting adhesive sheet having a thermosetting adhesive agent layer which, after being cured, can achieve excellent adhesiveness and extremely high heat resistance after exposure to humidity and heat. This thermosettin...
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WO/2012/173054A1 |
[Problem] To provide an active-energy-ray-curable adhesive composition that has low viscosity, excellent curability, and excellent adherability to various plastic films and the like, particularly to hydrophilic plastic films, and that ex...
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WO/2012/144261A1 |
The present invention addresses the problem of providing: a cationic polymerizable adhesive having water resistance and adhesion properties excellent enough that even when the polarizing plate or the like is bent, there is no peeling awa...
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WO/2012/141100A1 |
The present invention provides a pressure-sensitive adhesive sheet that has an acrylic pressure-sensitive adhesive layer formed from a water-dispersed acrylic pressure-sensitive adhesive composition, said composition comprising a specifi...
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WO/2012/141099A1 |
The present invention provides a pressure-sensitive adhesive sheet that has an acrylic pressure-sensitive adhesive layer formed from a water-dispersed acrylic pressure-sensitive adhesive composition, said composition comprising both a po...
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WO/2012/141101A1 |
Provided is a removable pressure-sensitive adhesive sheet that is highly scratch-resistant, is resistant to whitening (moisture-absorption whitening) when stored in humid conditions, and has excellent appearance characteristics and antis...
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WO/2012/133162A1 |
Provided is a polarizing plate configured from a polyvinyl alcohol-based polarizer and a transparent protective film pasted onto the polarizer with an adhesive therebetween, wherein the adhesive contains 100 parts by weight of a photo ca...
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WO/2012/130663A1 |
The invention relates to curable masses having a viscosity of at least 20,000 mPas at 25°C comprising: (A) compounds of the formula A-[-0-C(=0)-NH-(CR1 2)b-SiRa(OR2)3-a]2 (I); and (B) silanes of the formula R3 cSi(OR4)dR5 4-c-d (II), an...
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WO/2012/117902A1 |
The purpose of the present invention is to provide a curable composition with which initial adhesion is realized early, adhesive strength is high, and adhesion is long-lasting, and which is useful as a contact-type of adhesive. The purpo...
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WO/2012/108458A1 |
The present invention addresses the problem of providing a moisture-curable heat conductive composition which has excellent curability and does not have a specific outgas component adhere to a light emitting point of a laser diode. The i...
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WO/2012/104279A1 |
The invention relates to a rubber composite, in particular a tyre, reinforced with a sized textile material, such as a fibre or film, at least part of which is covered with an adhesive layer that can bond directly by means of curing (cro...
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WO/2012/096330A1 |
The present invention provides a resin composition which serves as an adhesive for accurately fixing a component made of a material such as metal or plastic. This resin composition exhibits high initial adhesion to the material. In the d...
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WO/2012/086588A1 |
Provided is an electroconductive adhesive which exhibits excellent electroconductivity and adhesiveness and which can be inhibited from settling or bleeding and exhibits excellent electroconductivity stability. This electroconductive adh...
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WO/2012/085376A1 |
1) A moisture-crosslinkable adhesive composition comprising: - from 25 to 50% of a composition (a) of a crosslinkable epoxy resin and of a polymer comprising a polyoxyalkylene or polyurethane main chain, linked to a hydrolysable alkoxysi...
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WO/2012/077727A1 |
Provided is an adhesive-layer-equipped transparent surface material that can easily be bonded to another surface material (a display panel, etc.) and that, when bonded to another surface material, is less likely to leave voids in the int...
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WO/2012/073702A1 |
Provided are a solar cell module with high connection reliability and a production method for same. A conductive adhesive film (20) with a glass transition temperature of 130°-180°C is pasted onto a bus bar electrode (11) in one solar ...
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WO/2012/072504A1 |
In the case of a curable composition based on at least one silyl-terminated polymer, the aim is to improve the adhesion spectrum in the bonding of plastics, and the rate of development of the adhesion. This is accomplished by provision o...
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WO/2012/065716A1 |
The invention relates to a curable compound, which can be obtained as a mixture of at least two components to be stored separately, of which one component comprises a silane-modified polymer and said component or a second component compr...
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WO/2012/063895A1 |
The present invention relates to a composition for vulcanizing adhesion, characterized by comprising (a) a rubber, (b) at least one compound selected from the group consisting of a 1,8-diazabicyclo(5.4.0)undecene-7 salt, a 1,5-diazabicyc...
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