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WO/2022/255078A1 |
Provided is a resin composition for adhesive films which has a low dielectric loss and nevertheless attains a sufficient adhesion strength and which can give adhesive films inhibited from suffering resin flow. The resin composition compr...
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WO/2022/235712A1 |
A paste composition, method of use, and building product containing such composition. The composition comprises at least one (preferably two) silyl-terminated polymer resin and a plurality of adhesion promoters. In preferred embodiments,...
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WO/2022/217733A1 |
The present invention relates to the field of biomedical materials, and in particular to a medical hydrogel and a preparation method therefor and a use thereof, and a kit for preparing the medical hydrogel. The medical hydrogel of the pr...
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WO/2022/218751A1 |
The present invention concerns a composition for retaining fibres and other particles on a building site to reduce the amount of airborne particles, such as asbestos or mineral wool fibres generated during demolition of a building struct...
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WO/2022/208325A1 |
Provided in the present invention is an adhesive tape, including: a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/°C; and an adhesive layer, including polyether ether ketone having a crystallinity ...
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WO/2022/210671A1 |
The present invention provides a curable adhesive composition which contains (A) a binder resin that has a reactive functional group and (B) a crosslinking agent that is reactive with the component (A), while having a molecular weight of...
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WO/2022/210673A1 |
Provided are: a curable adhesive composition including a first curing system, in which a cross-linking agent reacts with a binder resin having a reactive functional group and the reaction proceeds at a temperature of 120°C or less, and ...
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WO/2022/210672A1 |
Provided is an adhesive sheet including a curable adhesive layer, wherein the curable adhesive layer is one formed from a starting material composition comprising a binder resin (A) having a reactive functional group and a crosslinking a...
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WO/2022/209116A1 |
A thermoplastic resin composition for adhesion use, which is used for adhering two objects of the same type or different types to each other, the resin composition comprising a phenoxy resin and a thermoplastic elastomer and satisfying t...
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WO/2022/202683A1 |
The present disclosure addresses the problem of providing a thermosetting composition with which it is possible to achieve a long pot life, excellent thermosetting properties, and excellent photocuring properties that enables temporary b...
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WO/2022/193662A1 |
Provided in the present invention are a one-component silane-modified polyether sealant, a preparation method therefor and the application thereof. The preparation raw materials for the one-component silane-modified polyether sealant com...
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WO/2022/196586A1 |
[Problem] To provide: an adhesive composition which has excellent heat resistance, excellent adhesive strength, low relative dielectric constant, low dielectric loss tangent and excellent dielectric characteristics; and a bonding sheet, ...
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WO/2022/196355A1 |
The present invention pertains to a curable perfluoropolyether adhesive composition that contains: (A) 100 parts by mass of a straight-chain perfluoropolyether compound that has at least two alkenyl groups in one molecule, and that has, ...
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WO/2022/196585A1 |
[Problem] To provide an adhesive composition with excellent heat resistance and adhesion strength, with low relative permittivity and dielectric loss tangent, and with excellent dielectric properties, and to provide an adhesive sheet, a ...
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WO/2022/191084A1 |
This curable composition includes an oxyalkylene polymer A having a reactive silicon group represented by −SiRa(X)3-a, wherein the oxyalkylene polymer A has at least 6 terminal groups per molecule, and the terminal group includes at le...
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WO/2022/186038A1 |
The resin composition for adhesion includes component (A) and component (B). The resin composition for adhesion has a step for mixing component (a), component (b), component (c), and component (d). Component (A): thermoplastic resin. C...
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WO/2022/186123A1 |
The present invention relates to a curable composition which comprises (A) a polyoxyalkylene-based polymer having a silicon-containing reactive group, (B) a (meth)acrylic-ester-based polymer having a trialkoxysilyl group, and (C) a speci...
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WO/2022/172863A1 |
A welding film comprising a phenoxy resin, wherein the Z‐average molecular weight of the phenoxy resin is 70,000 or more, and the ratio [Mz/Mn] of the Z‐average molecular weight with respect to the number average molecular weight of ...
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WO/2022/173289A1 |
The present invention is in the field of flexible adhesive for gluing, in particular in the construction of trucks, buses, trains and the like, more in particular for adhering a relatively large workpiece. The present invention also rela...
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WO/2022/163523A1 |
A purpose of the present invention is to provide an adhesive composition capable of giving cured objects having excellent mechanical properties. The adhesive composition according to one aspect of the present invention comprises a polyox...
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WO/2022/152653A1 |
Bonding films comprising PEEK-PEoEK copolymers are compatible with polyaryletherketone chemistry thereby providing joined polyaryletherketone polymer parts with high fracture toughness and overall good mechanical properties.
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WO/2022/152942A1 |
The invention relates to epoxy adhesive compositions comprising low glass transition temperature elastomeric core nanoparticles, a process for the preparation thereof, and uses thereof, in particular at a low temperature.
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WO/2022/141817A1 |
The present invention provides a resin composition and an adhesive film and a cover film comprising same. The resin composition comprises the following components in parts by weight: 40-80 parts of a polyamide imide resin, 10-40 parts of...
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WO/2022/138807A1 |
The present invention addresses the problem of providing a curable resin composition that is superior as a two-component or multi-component epoxy resin composition as compared to the prior art. Provided is a curable resin composition inc...
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WO/2022/124307A1 |
The present invention relates to an oxyalkylene polymer which comprises a polyoxyalkylene chain that contains an oxyethylene group, and a reactive silicon group that is bonded to the polyoxyalkylene chain via an organic group that contai...
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WO/2022/122782A1 |
The invention relates to a curable one-component composition comprising (i) humidity-curable prepolymer, preferably silyl-modified prepolymer; (ii) optionally, highly structured carbon black; (iii) optionally, fumed silica; (iv) optional...
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WO/2022/122954A1 |
Adhesives comprising a silyl-terminated polyether and a tackifying resin provide a considerably reduced tack at relatively slight increases in temperature, undergo purely adhesive failure at such increased temperatures, and have reversib...
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WO/2022/098844A1 |
Some embodiments of the present disclosure relate to an adhesive formulation comprising a high viscosity silyl modified polymer. In some embodiments, the adhesive formulation may further comprise additional components, such as but not li...
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WO/2022/090462A1 |
The invention relates to a reactive single-component adhesive composition which is liquid at room temperature and which has 3 wt.% to 90 wt.% of at least one alpha-silane-terminated organic polymer, 0 wt.% to 80 wt.% of at least one sili...
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WO/2022/078900A1 |
A process for the manufacture of a sulfonated polyarylene(ether)sulfone comprising feeding of a solution (S1) comprising a sulfonated polyarylene(ether) sulfone and sulfuric acid into a tooth rim dispersion machine, wherein the solution ...
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WO/2022/075245A1 |
This perfluoropolyether-based adhesive composition contains: (A) a linear perfluoropolyether compound containing two or more alkenyl groups in one molecule and having a number average molecular weight of 2,000 or more and a mass reductio...
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WO/2022/070503A1 |
The present invention pertains to: a transparent adhesive composition which contains an epoxy resin (A), an epoxy resin curing agent (B), and a phenoxy resin (C), and in which the epoxy resin curing agent (B) satisfies (1) and (2); a fil...
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WO/2022/070933A1 |
Provided are a pressure-sensitive adhesive composition having an excellent effect in adhesive-force regulation and a layered film which includes a pressure-sensitive adhesive layer formed from the composition and is suitable for use as a...
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WO/2022/062311A1 |
The present invention relates to an adhesive, a preparation method therefor, and a method for curing a flame retardant fiberglass tape. The preparation method involves proportionally mixing polyether acrylate, an acrylate diluting monome...
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WO/2022/064931A1 |
[Problem] To provide a moisture curable resin composition which does not use an organic tin catalyst, has excellent quick curability and thick film curability due to moisture, and also has excellent adhesive properties to aluminum. [Solu...
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WO/2022/054979A1 |
The present invention relates to a hybrid adhesive composition for blocking electromagnetic waves, the hybrid adhesive composition comprising conductive metal particles, first graphene, adhesive resin, and a curing agent, wherein the fir...
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WO/2022/049931A1 |
The present invention provides an adhesive composition which contains (A) a poly(meth)acrylic polymer having a reactive silyl group, (B) an oxyalkylene polymer having a reactive silyl group at an end, and (C) a silane coupling agent, and...
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WO/2022/024579A1 |
The present invention provides a polarizing film with a pressure-sensitive-adhesive layer, comprising a pressure-sensitive-adhesive layer which is durable in a high-temperature environment and in which reworkability after preheating is m...
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WO/2022/025207A1 |
An adhesive film for circuit connection contains electroconductive particles, and includes, in the film thickness direction, a region A containing a cationically polymerizable compound, a thermal cationic polymerization initiator, and an...
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WO/2022/024510A1 |
The present invention provides: a composition for an adhesive, the composition containing an epoxy resin (A), an epoxy resin curing agent (B), a phenoxy resin (C), and an inorganic filler (D), the phenoxy resin (C) having an elastic modu...
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WO/2022/018375A1 |
The invention relates to an adhesive composition comprising at least one silylated polymer comprising at least one hydrolysable alkoxysilane group, at least one polyvinyl ether compound and at least one crosslinking catalyst, and to the ...
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WO/2022/012996A1 |
The invention relates to a curable composition which comprises at least one curable resin component and at least one curing agent and/or an initiator for polymerizing the curable resin component. The composition additionally comprises at...
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WO/2022/014503A1 |
An adhesive resin composition for bonding two adherends of different materials together, the composition comprising a phenoxy resin and a polyester elastomer at a weight ratio (phenoxy resin : polyester elastomer) ranging from 20:80 to 8...
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WO/2022/006713A1 |
A crosslinkable substance (M1), which contains (A1) 100 parts by weight of a silane-crosslinked polymer of the following formula: (HO)x-Y-[O-CO-NH-(CR1 2)b1-SiRa(OR2)3-a] 2-x (I-1), and (B) 600 or more parts by weight of silane cross-lin...
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WO/2021/232819A1 |
Disclosed are a single-component silane-modified polyether sealant for prefabricated buildings and a preparation method therefor. The sealant comprises the following components in parts by weight: 20-40 parts of a silane-modified polyeth...
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WO/2021/223991A1 |
The present invention relates to a curable adhesive composition based on acetoacetate compound, and to its use in multi-purpose bonding applications. In particular, the present invention relates to a curable adhesive composition based on...
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WO/2021/214290A1 |
The invention relates to reactive hot-melt adhesive compositions containing, based on the total weight of the composition, a) 3 wt.% to 49 wt.% of at least one alpha-silane-terminated organic polymer; b) 1 wt.% to less than 20 wt.%, pref...
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WO/2021/200405A1 |
An adhesive tape having an adhesive layer that contains a phenoxy resin, an acid anhydride, and an epoxy resin.
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WO/2021/200757A1 |
Provided is a sheet adhesive for optical use which contains an (A) component and a (B) component, said sheet adhesive for optical use giving a cured product that exhibits a storage sheer modulus (G'0) of 2×107 Pa or less at 0°C. The sh...
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WO/2021/200758A1 |
Provided is a photocurable sheet adhesive that contains an (A) component, a (B) component, and a (C) component, wherein at least one epoxy resin constituting the (B) component gives a cured product that has a glass transition temperature...
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