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WO/2021/193576A1 |
The object of the present invention is to provide an adhesive composition that has a low toxicity, is curable at a low temperature, and is capable of forming a cured product having high heat resistance. The present invention relates to a...
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WO/2021/181748A1 |
This dicing die attach film, which is obtained by laminating a bonding layer and an adhesive layer, is characterized in that the bonding layer is a layer of a film-like bonding agent that contains an epoxy resin (A), an epoxy resin curin...
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WO/2021/181732A1 |
A curable adhesive sheet for a device, having an adhesive layer containing component (A) and component (B). The curable adhesive sheet for a device has an adhesive sheet provides a cured material having excellent low-dielectric character...
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WO/2021/175122A1 |
Disclosed are a composite polymer, and a preparation method therefor and an application thereof. The composite polymer is a block copolymer of polyfurfuryl alcohol and polyoxyethylene. The composite polymer has excellent bonding performa...
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WO/2021/135376A1 |
A graphene PUR and a preparation method therefor. Component A is a saturated/unsaturated monomer satisfying the structural formula of HO(R)nOH; component B is a saturated/unsaturated monomer satisfying the structural formula of HO(R)nOH;...
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WO/2021/132523A1 |
A moisture-curable adhesive resin composition containing a moisture-curing resin (A) and a modified polyolefin resin (B), the content of the modified polyolefin resin (B) being 2 parts by mass or more with respect to 100 parts by mass of...
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WO/2021/121543A1 |
The invention relates to a method for producing a mixture (M) which contains silane-terminated polymers (SP1) of the general formula (I) Y1-[0-C(=0)-NH-(CR1 2)b-SiRa(OR2)3-a]x (I), optionally silane-terminated polymers (SP2) of the gener...
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WO/2021/117604A1 |
Provided is an adhesive composition capable of limiting reduction in adhesiveness even after preservation in room temperature or refrigeration environment, the adhesive composition providing excellent adhesiveness under the same adhesion...
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WO/2021/117488A1 |
The present invention is a curable perfluoropolyether adhesive composition comprising: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups in one molecule, and having a perfluoropolyether stru...
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WO/2021/110281A1 |
The invention relates to cross-linkable compositions containing (A) 100 parts by weight compounds of formula (I): Y−[(CR1 2)a−Si(OR)3]x, with the stipulation that, in component (A), in 5 to 60% of all units [(CR1 2)a−Si(OR)3] a is ...
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WO/2021/109557A1 |
The present invention relates to the technical field of organic compound synthesis, and disclosed is a synthetic method for a polyether for a low modulus sealant. The synthetic method in the present invention mainly comprises: taking a m...
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WO/2021/106847A1 |
[Problem] To provide an adhesive film that has high adhesiveness with respect to metal substrates and resin substrates such as polyimides, that enables a high solder heat resistance to be achieved, and that provides excellent film handli...
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WO/2021/092879A1 |
Described is a curable composition, and particularly a two-component composition comprising a silane modified polymer; an epoxy resin terminated with epoxy terminal group; wherein the composition further comprises a hardening agent and a...
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WO/2021/085008A1 |
Provided is an adhesive sheet for devices, having a curable adhesive layer comprising component (A) and component (B), and having a component (A) content of at least 3.0 mass% in the curable adhesive layer. The adhesive sheet for devices...
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WO/2021/085009A1 |
An adhesive composition comprising the following (A) and (B) ingredients, and an adhesive sheet comprising an adhesive layer formed from this adhesive composition. This adhesive composition gives cured objects having low-dielectric prope...
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WO/2021/059972A1 |
A multi-component curable composition according to the present invention comprises: a component A containing (A) a polyoxyalkylene polymer having a reactive silicon group, (B) a (meth)acrylate ester polymer having a reactive silicon grou...
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WO/2021/031702A1 |
The present invention relates to the technical field of sealants, in particular, to a silane-terminated polyether sealant, a preparation method therefor and an application thereof. The sealant provided by the present invention comprises ...
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WO/2021/033529A1 |
This curable fluoropolyether adhesive composition contains specific amounts of (A) a straight-chain polyfluoro compound having two or more alkenyl groups per molecule, and having a perfluoropolyether structure in the main chain thereof, ...
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WO/2021/024817A1 |
A multiple package-type curable composition comprises: an agent A that contains a polyoxyalkylene polymer (A) having a reactive silicon group represented by general formula (1), a (meth)acrylic acid ester polymer (B) having a reactive si...
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WO/2021/024364A1 |
Provided is an adhesive composition which is low in permittivity and dielectric dissipation factor and is satisfactory in terms of flex resistance and heat resistance. The adhesive composition comprises, per 100 parts by mass of the wh...
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WO/2021/016514A1 |
A one-part adhesive including a grafted phenoxy resin, a polymaleimide compound, an organic carbonate, and an optional silane adhesion promoter is described. More particularly, the grafted phenoxy resin includes carboxylic acid and acryl...
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WO/2021/012354A1 |
Provided in the present disclosure are a conductive adhesive and a preparation method therefor. The conductive adhesive comprises a photosensitive small molecule monomer, a photocationic polymeric compound, a photoinitiated cationic curi...
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WO/2021/007814A1 |
Provided is an adhesive piece. The adhesive piece comprises the following components in parts by mass: 25-65 parts of a matrix resin, 20-60 parts of a fiber reinforcement, 10-40 parts of a filler, and 0-15 parts of a fire retardant, wher...
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WO/2020/254097A1 |
A method of making a PEEK-PEoEK copolymer having RPEEK andRPEoEK repeat units in a molar ratio RPEEK/RPEoEK ranging from 95/5 to 45/55, the PEEK-PEoEK copolymer obtained from the method and the polymer composition including the PEEK-PEoE...
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WO/2020/246470A1 |
Provided is a water-based temporary fixing adhesive which has excellent temporary fixing performance, coating performance, and adhesion-stain prevention performance, and includes (A) a hydroxyl group-containing thermoplastic resin and (B...
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WO/2020/201983A1 |
The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is i...
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WO/2020/201944A1 |
The present disclosure relates to a process of manufacturing curable precursor of a structural adhesive composition. According to another aspect, the present disclosure is directed to method of bonding two parts.
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WO/2020/196240A1 |
The present invention pertains to: a sheet-like adhesive agent containing components (A), (B), and (C); a sealing sheet that contains said sheet-like adhesive agent; and a sealed body obtained by sealing, using said sealing sheet, an obj...
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WO/2020/196070A1 |
This resin sheet is formed from a resin composition containing a thermosetting component (A), and is characterized in that: the thermosetting component (A) contains a first maleimide resin (A1); the first maleimide resin (A1) has at leas...
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WO/2020/170908A1 |
A multiple package-type curable composition which comprises: an agent A that contains (A) a polyoxyalkylene polymer having a reactive silicon group, (B) a (meth)acrylic acid ester polymer having a reactive silicon group, and (D) an epoxy...
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WO/2020/162434A1 |
The present invention provides a thermosetting adhesive comprising a polyurethane, an isocyanate, an epoxy, and a phenoxy resin, wherein the dynamic viscoelastic spectrum of a cured product has a peak showing the softening temperature in...
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WO/2020/133062A1 |
Disclosed by the present invention is a method for preparing a reactive sealant resin, the method comprising: (1) under the action of an alkali catalyst, polymerizing a hydroxyl-containing initiator with an epoxy compound to obtain a pol...
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WO/2020/124931A1 |
The present invention provides an anisotropic conductive adhesive and a conductive film thereof. The conductive adhesive uses a thermal-cured epoxy resin system as a base, and comprises the following components in percentage by mass: 10-...
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WO/2020/128200A1 |
1) The invention relates to an adhesive composition which is cross-linkable by heating, comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one silsesquioxa...
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WO/2020/120144A1 |
The invention relates to a cationically curable mass having at least one cationically polymerizable component; a first photoinitiator, which releases an acid upon being irradiated by actinic radiation of a first wavelength λ1; and a sec...
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WO/2020/117722A1 |
Provided are adhesives containing a phenoxy resin grafted with methyl methacrylate (MMA) and/or methacrylic acid (MAA), and including a uretdione or a silane. The adhesive compositions are completely or substantially absent free isocyana...
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WO/2020/110785A1 |
Provided is a film-like adhesive agent 1 for a semiconductor, the adhesive agent 1 having a first thermosetting adhesive agent layer 2 and a second thermosetting adhesive agent layer 3 laid on the first thermosetting adhesive agent layer...
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WO/2020/099309A1 |
The invention relates to the use of a curable composition which contains at least one polyether having blocked hydroxyl groups as the plasticizer on at least one alkaline substrate. The curable composition is storage stable, easy to hand...
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WO/2020/087316A1 |
A two-part condensation curable silyl-modified polymer based adhesive composition for use in particular, in the adhesion of a front lens having an anti-haze coating onto a lamp body for lighting applications and to lamps comprising a lam...
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WO/2020/085258A1 |
A purpose of the present invention is to provide a technique within a semiconductor device manufacturing method in which semiconductor elements are layered in a multilayered manner by layering semiconductor wafers with an adhesive layer ...
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WO/2020/070687A1 |
The present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a cationically self-polymerizable monomer; b) a polymerization initiator of the cationically self-polymerizable monomer which is i...
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WO/2020/054495A1 |
The adhesive composition according to the present invention, which is capable of realizing low-temperature quick-curing properties, conductive properties, shelf life properties, and adhesive strength that are practical not only for COG m...
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WO/2020/041921A1 |
Disclosed is a process for preparing a hexamethoxymethyl melamine resin rubber adhesive, comprising S1: feeding methanol into an etherification kettle, and stirring same; and then adding a hexahydroxy resin and continuously stirring same...
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WO/2019/240046A1 |
The objective of the present invention is to provide a two-component urethane-based adhesive composition having excellent initial adhesiveness and long-term adhesiveness. The present invention pertains to a two-component urethane-based a...
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WO/2019/235332A1 |
Provided are an adhesion method and an adhesive agent, which are capable of ensuring transportability in a short period of time and a low elastic modulus immediately after being heat-cured, and which are capable of reducing thermal disto...
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WO/2019/230445A1 |
Provided is an adhesive composition having high adhesion not only to a conventional polyimide or polyester film, but also to a metal substrate, and whereby high solder heat resistance can be obtained, and which also has excellent low-die...
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WO/2019/210006A1 |
The present disclosure relates to monomers, oligomers and polymers useful as additives for adhesive and/or sealant compositions, and particularly to one drop fill ("ODF") sealant compositions for liquid crystal display applications. The ...
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WO/2019/203112A1 |
The purpose of the present invention is to provide a terminal-modified polymer compound and a random copolymer compound which has high heat resistance and adhesion while having excellent film forming ability, and which has a low dielectr...
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WO/2019/189491A1 |
Provided are a reactive silicon group-containing polymer and a curable composition containing said polymer, that: provide a cured product having a low modulus, flexibility, and excellent tensile strength, tensile elongation, and tear str...
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WO/2019/181862A1 |
Provided is a monomer mixture which is rapidly cured even in a high humidity environment, and which is used for the purpose of forming a cured product that exhibits excellent adhesion not only to plastics but also to metals and glass. A ...
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