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WO/2012/036442A2 |
The present invention relates to an adhesive composition comprising tannin, polyethylene glycol, and water, wherein the adhesive composition has little toxicity, can be adhered even without a thermosetting curing agent which is different...
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WO/2012/022494A1 |
The present invention relates to a silane-modified, one-component, water-, solvent- and phthalate-free parquet adhesive and also to its use for the highly dimensionally stable bonding of parquet, wood floor coverings and wood-based mater...
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WO/2012/020655A1 |
[Problem] To provide a highly heat-resistant adhesive composition, which easily dissolves in various organic solvents, has good coating properties, and can form an adhesive layer having a sufficient thickness, wherein the adhesive layer ...
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WO/2012/020560A1 |
Provided is a curable composition that can be used as a sealing material or an adhesive agent, etc., has excellent curing properties, and has excellent tensile properties in the cured product. In order to achieve the above objectives, th...
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WO/2012/020665A1 |
[Problem] To provide a highly thermostable adhesive composition which dissolves easily into various organic solvents and which is capable of forming an adhesive layer with sufficient thickness and excellent coating properties, wherein th...
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WO/2012/002177A1 |
Disclosed is a novel aluminum chelate-based latent curing agent having a core-shell type microcapsule structure, wherein an aluminum chelate-based curing agent and a cationic polymerizable compound are enclosed in capsules formed of an i...
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WO/2011/162256A1 |
A process margin can be improved, and high connection reliability can be achieved. Disclosed is an anisotropic conductive material comprising an adhesive agent composition and electrically conductive particles dispersed in the adhesive a...
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WO/2011/160639A1 |
The invention provides a method for manufacturing a skin-friendly pressure-sensitive adhesive composition, said method comprising the steps of: a. providing a matrix composition comprising a polymeric photoinitiator of the general formul...
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WO/2011/152126A1 |
Provided are: a cationically polymerizable composition which can yield a cured product that is resistant to heat and light and therefore can retain, over a long period, both excellent light transmission in a wide wavelength region and ex...
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WO/2011/152002A1 |
Provided is a curable composition that uses a polymer having reactive silicon groups of low toxicity, wherein the curable composition is useful as a reactive hot melt adhesive having an excellent balance between storage stability at high...
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WO/2011/132566A1 |
Provided is a water-dispersing acrylic adhesive composition that can form a removable adhesive layer that has excellent resistance to an increase in adhesive strength, appearance traits, and low contamination properties with respect to a...
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WO/2011/132565A1 |
Provided is a water-dispersible acrylic adhesive agent composition capable of forming an adhesive agent layer having excellent ability to prevent a rise in adhesive strength, excellent appearance characteristics, and in addition excellen...
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WO/2011/132567A1 |
Provided is a water-dispersing acrylic adhesive composition that can form a removable adhesive layer with excellent resistance to an increase in adhesive strength over time, appearance traits, and low contamination properties with respec...
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WO/2011/126707A2 |
This invention provides an adhesive for roll-shaped paper which has a high initial adhesiveness and causes the paper to peel easily without making the application surface sticky, and a roll-shaped paper on which this adhesive for roll-sh...
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WO/2011/110384A1 |
The present invention relates to curable compositions comprising a) at least one organic polymer selected from polyurethanes, polyesters and polyethers, having at least one end group of the general formula (I) -An-R-SiXYZ (I), in which A...
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WO/2011/093207A1 |
Provided is an anisotropic conductive film comprising at least a conductive layer and an insulating layer, wherein said insulating layer contains a binder, a monofunctional polymerizable monomer and a curing agent, said conductive layer ...
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WO/2011/090046A1 |
Disclosed is a curable resin composition which can be reduced in the burden on the environment, while securing safety and having extremely high curability at low temperatures. Specifically disclosed is a curable resin composition which c...
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WO/2011/079336A1 |
The present invention provides a hemostatic composite sponge comprising a porous matrix of a biomaterial and a material enhancing the adherence of said sponge to the applied tissue stably associated with at least one surface of said spon...
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WO/2011/082327A1 |
An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight p...
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WO/2011/051056A1 |
The invention relates to a one-component, moisture-curable adhesive comprising at least one polyoxyalkylene and/or poly(methyl)acrylate pre-polymer having at least one hydrolyzable silane group, at least one filler material and auxiliary...
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WO/2011/051491A1 |
The invention relates to reactive, urea-bonded alkoxysilanes based on polyether block copolymers that are reacted with diisocyanate, said copolymers being of the structure B-An in which the central block B consists of units of polyoxytet...
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WO/2010/144792A9 |
A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about (15) to about (65) volume percent of a dielectric filler; and about (35) to about (...
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WO/2011/042610A1 |
The invention relates to a bio-adhesive. In accordance with the invention, the bio-adhesive is formed by reaction, selected from the group of esterification, condensation and their combinations, of natural based binder material containin...
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WO/2011/040442A1 |
Disclosed is a conductive connection material which has a laminated structure comprising a resin composition and metal foil selected from solder foil or tin foil. The resin composition of the conductive connection material has a minimum ...
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WO/2011/032653A1 |
The present invention relates to reactive diluents for moisture-curing coating systems containing silane groups. The invention further relates to a method for the production of said diluents, and to the use thereof in coating agents, adh...
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WO/2011/031429A1 |
Curable adhesive compositions, cured adhesive compositions, and articles that include the cured adhesive compositions are described. The curable adhesive composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid mod...
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WO/2011/010044A1 |
The invention relates to an adhesive composition, including: 10 to 95% of a moisture cross-linkable polymer (A), the main chain includes 2 silyl terminal groupings, each of which includes at least one hydrolyzable group bonded to the sil...
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WO/2011/005614A1 |
One-part moisture curable sealant compositions and methods of making the same are provided. The composition includes a silane-terminated polythioether component and a catalyst. The silane-terminated polythioether component and catalyst a...
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WO/2011/000737A1 |
Two-component adhesive or sealing compounds (K), comprising a first component (K1), containing silane-terminated prepolymers (A), which have end groups of the general formula (II) -O-CO-NH-(CH2) y-SiR2 3-x (OR1)x (II), where R1 and R2 in...
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WO/2010/132176A2 |
Non-silicone, urethane-based adhesives are disclosed which are prepared by the polymerization of reactive oligomers with the general formula X-A-B-A-X, where X is an ethylenically unsaturated group B is a unit free of silicone, and A is ...
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WO/2010/131973A1 |
The present invention relates to a heat crucible glue or coating for use in connection with refractory materials and ceramics. The glue or coating comprises 25 to 50 weight % silicon powder, 5 to 20 weight % SiC powder, 20 to 60 weight %...
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WO/2010/128602A1 |
A curable resin composition comprising: a curable resin (A) containing a hydrolysable silyl group represented by formula (1) in the molecule; a curable resin (B) containing a hydrolysable silyl group represented by formula (2) in the mol...
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WO/2010/126054A1 |
Disclosed is an adhesive composition for an optical film, which is characterized by comprising: a (meth)acrylic polymer (A); and a polyether compound (B) having a polyether skeleton and also having a reactive silyl group represented by g...
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WO/2010/125879A1 |
Disclosed is an adhesive resin composition which contains (A) an epoxy resin and/or a phenoxy resin, (B) an epoxy-containing styrene copolymer that contains an epoxy-providing monomer unit and a styrene monomer unit, (C) a thermoplastic ...
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WO/2010/125880A1 |
Disclosed is an adhesive resin composition which contains: an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer which is obtained by copolymerizing an epoxy-providing monomer and an ethylenically unsaturated monomer that ...
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WO/2010/111594A1 |
A tissue adhesives and sealant formed by reacting a polyglycerol aldehyde with a water-dispersible, multi-arm amine is described. The tissue adhesive and sealant may be useful for medical and veterinary applications, including, but not l...
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WO/2010/108716A1 |
The invention relates to a one-component moisture-curing adhesive comprising at least one flowable polyoxyalkylene or polyacrylate prepolymer having at least one hydrolyzable silane group, at least one inert additional agent that is soli...
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WO/2010/101324A1 |
The present invention relates to an adhesive tape for manufacturing electric components. More specifically, the adhesive layer is not adhesive at room temperature, but adhesion is expressed only during a thermal lamination process, thus ...
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WO/2010/098291A1 |
Provided are a surface protective film which imparts excellent antifouling properties to an adherend and has a peeling force which does not vary much depending on the surface conditions of the adherend; and an adhesive composition for us...
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WO/2010/098154A1 |
Provided are adhesive resin compositions that are halogen-free, have excellent adhesiveness, solder heat resistance and flame resistance, and excellent flow characteristics, and laminates and flexible printed wiring boards using the same...
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WO/2010/082488A1 |
A curable composition that has excellent curability without using an organotin-based curing catalyst, the toxicity of which has been pointed out, and that gives a cured object suffering no surface discoloration even through long-term exp...
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WO/2010/073885A1 |
Disclosed is a film adhesive which is easily miscible, highly plastic, and capable of increasing bond strength by having essential ingredients comprising a bisphenol A-type phenoxy resin with a molecular weight of 30,000 or greater, an e...
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WO/2010/073583A1 |
Disclosed is an adhesive film characterized by containing: a thermosetting resin with a weight-average molecular weight of less than 1000; a film-forming resin; an oligomer compound having a weight-average molecular weight smaller than t...
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WO/2010/070894A1 |
Provided is a curable composition which exhibits improved adhesion to a polyethylene resin substrate and an ionomer resin substrate, though publicly known curable compositions which contain a polyoxyalkylene polymer bearing a reactive si...
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WO/2010/058643A1 |
An anisotropic conductive film containing a radically polymerizable substance, a polymerization initiator which generates radicals when heated, a phenoxy resin having a molecular weight of not less than 30,000, and conductive particles. ...
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WO/2010/047200A1 |
Disclosed is a high heat resistant anisotropic electroconductive film that, when electrodes are connected to each other through the anisotropic electroconductive film, can meet a requirement for further fine pitching of electrodes to the...
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WO/2010/047374A1 |
Adhesive film formed from an adhesive which can be obtained by mixing a curable resin composition and two or more types of insulating organic particles differing in mean particle size, wherein the average particle size of the insulating ...
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WO/2010/047386A1 |
Disclosed is an adhesive composition having excellent adhesiveness and durability. This cationic photopolymerizable adhesive composition includes (a) 75-99.8 parts by mass of at least one of the following: an aliphatic epoxy, an alicycli...
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WO/2010/044466A1 |
A transparent adhesive sheet for flat panel displays, which does not foam at a surface that is bonded with a plastic plate, while having excellent level difference-absorbing properties. The transparent adhesive sheet for flat panel displ...
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WO/2010/044467A1 |
Disclosed is a transparent adhesive sheet for a flat panel display for which, even when the display undergoes twisting, bending, or similar stress, peeling does not occur at the face which adheres to the glass plate and bubbles are not g...
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