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JP2006150549A |
To provide a surface polishing machine capable of easily responding to the enlargement of a glass plate, polishing with high accuracy, and shortening a tact time without taking time and effort for mounting the plane material.A polishing ...
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JP2006142437A |
To provide a nozzle cleaning device capable of uniformly polishing (cleaning) the nozzle in a short period time.The nozzle cleaning device cleaning the nozzle E is equipped with a disc-shape brush unit U having a brush (b) implanted on t...
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JP3784233B2 |
To provide a disk cleaner capable of inhibiting a generation of a peeling off and a crack of adhesive surface even in the case where a disk to be polished is a DVD, etc., having a multi-layer structure. Polishing tools 5A, 5B comprising ...
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JP2006127622A |
To provide a disk polishing apparatus capable of simultaneously polishing a plurality of disks, having superior work efficiency, and capable of reducing the work of an operator.The apparatus is provided with a rotary part having a plural...
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JP2006095678A |
To provide a polishing method for a glass substrate for an information recording medium, polishing both an outer peripheral chamfer surface and an inner peripheral chamfer surface to the mirror-finished state.This polishing method for a ...
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JP2006088321A |
To provide a polishing method for inner peripheral end faces of substrates for a plurality of disk-type recording mediums with sufficient accuracy.The brush polishing method is used for polishing the inner peripheral end faces of the sub...
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JP2006510499A |
The present invention discloses a disposable meltblown scrubbing product for use in household cleaning or personal care applications and an abrasive aggregate fiber which may be utilized in the scrubbing product. The meltblown web is for...
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JP2006082219A |
To provide a silicon substrate for a magnetic recording medium and its manufacturing method capable of improving dimensional accuracy of a circular hole at the center of a substrate and preventing occurrence of flaw due to friction with ...
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JP2006062033A |
To provide a polishing process for shortening polishing time for a member having a plurality of three-dimensional free curved surfaces by combining electrolytic abrasive grain polishing and other polishing methods.In this polishing proce...
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JP2006055921A |
To provide a polishing tool for constantly and stably maintaining polishing pressure and improving accuracy of polishing.This tool is provided with a first shaft 1 having a mounting shaft part 13 mounted at a distal end part of an output...
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JP2006055994A |
To provide a method of increasing gloss of a coated surface, a method of removing feathers on a surface of timber, and a polishing product including polishing fibers related to a method of polishing metallic surface.A bulky roll of non-w...
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JP2006043842A |
To provide a method for manufacturing a glass substrate for a magnetic disk, which method can manufacture the glass substrate for the magnetic disk having a stable quality, at a low cost in large quantities, by simply and excellently pol...
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JP2006035338A |
To provide a rotary wire brush device capable of recovering the wear of bristle ends while rotating a wire brush by electrodepositing a composition member of a metal electrode of an electric discharge machining means to each bristle end ...
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JP2006035373A |
To reduce the damage of a polished workpiece when it is taken out.A piezoelectric plate 208 is manufactured by sandwiching a plate shape piezoelectric element between an upper polishing surface plate 402 and a lower polishing surface pla...
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JP2006504541A |
A device for machining a strip-shaped or plate-shaped metal workpiece, especially for removing the oxide layer of the cut surfaces and/or edges of the workpiece, comprising at least one rotating conveyor device provided with at least one...
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JP2006504260A |
The invention is directed to a chemical-mechanical polishing pad substrate comprising a porous material having an average pore size of about 0.01 microns to about 1 micron. The polishing pad substrate has a light transmittance of about 1...
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JP2006503714A |
An abrading composition and a process for abrading factory pre-finished surface coverings, wherein the abrading composition comprises an effective amount of wear-resistant particles, a rheology modifier, and a solvent. This invention fur...
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JP2006022185A |
To provide a double sided adhesive tape which is used for fixing a polishing cloth 13 for polishing the edge of a silicon wafer 15 to a MC nylon block 12 and can prevent that the double sided adhesive tape 14 for fixing the polishing clo...
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JP2006015450A |
To provide a magnetic disk substrate which has a circular hole formed at the center thereof, the circular hole allowing its inner peripheral end face to be excellently polished like a mirror surface even if the circular hole is narrowed ...
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JP2006007350A |
To perform inner peripheral surface working for a glass disk with very high accuracy.This glass disk inner peripheral polishing device 1 for polishing the inner peripheral surface 9a of the glass disk 9 includes: a work setting part 2; a...
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JP2006007373A |
To machine a grinding surface to be a joint surface of metal plating block material composing a T-die used for resin film extrusion molding into a surface having excellent specular gloss with no stripe traces of a grinding wheel.A pitch ...
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JP2006000950A |
To provide a method of fixing together an inner core pipe and an outer pipe of a rotary polishing roll which is formed of the inner core pipe, the outer pipe, and brushes or buffs mounted on the outer pipe, wherein the polishing roll cop...
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JP2005342837A |
To provide a simple grinding device and a grinding method capable of grinding a surface of a grounded element with waviness along the waviness without computer controlling.The grinding device includes (1) a rotating spindle, (2) a disc h...
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JP2005342866A |
To provide a polishing device capable of uniformly and efficiently polishing a substrate of a semiconductor wafer and a printed board, etc.In this polishing device for a substrate 30, the surface of the substrate 30 is polished by polish...
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JP3726405B2 |
To provide a glass substrate smoothing device capable of flattening a substrate efficiently by uniformly grinding the entire surfaces of a glass substrate having coat film such as color filter substrate and locally raising the grinding l...
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JP2005340732A |
To prevent the environments of the processes for laminating the respective layers constituting a wafer from being contaminated, by cleaning the outer peripheral portion of the wafer without reducing the productivity of the wafer.A wafer ...
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JP2005322663A |
To solve the problem, wherein the polishing operation of a semiconductor substrate, the semiconductor substrate made thin and reduced in strength by polishing is damaged by polishing quartz and suffers from peripheral damages and generat...
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JP3716129B2 |
To exchange a ring brush by a new ring brush by removing the ring brush from a rotating cylinder by removing a tightening fixing member from the rotating cylinder in the case where a brush portion of the ring brush is worn. The rotary br...
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JP2005297181A |
To provide a device for machining an end face of a workpiece capable of continuously machining smooth chamfered shapes with high efficiency on an end face of a roller, enhancing deflection accuracy of the end face of the roller by securi...
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JP2005297173A |
To provide a machining method for a contact face of an O-ring seal for sealing an aluminum alloy vacuum vessel at a low cost and high sealing ability.The contact face 2a of the O-ring seal is swept over with a nonwoven fabric cleaner wit...
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JP2005288565A |
To provide a brush for deburring capable of removing left burrs in a hollow hole when deburring in a workpiece having the hollow hole.This brush 1 has a bar-shaped handle part 2 and a brush part 3 provided at one end part of the handle p...
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JP2005530626A |
A bowling ball resurfacing apparatus comprises a housing, first and second vertical support rollers mounted to the housing for rotation about parallel vertical axes, each of the vertical support rollers adapted to make contact with the s...
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JP3705738B2 |
To provide a pachinko ball pumping up/polishing device which can simultaneously solve opposite demands which are the smooth acceptance of pachinko balls by a spiral groove, and the prevention of the generation of jamming in the spiral gr...
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JP3697963B2 |
To provide a polishing cloth and a surface polishing work method so improved that a characteristic thereof can be effectively displayed by attaining improvement of polishing work performance and polishing accuracy relating to a workpiece...
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JP2005246525A |
To provide a reference plate for an exposure carrier mechanism provided with a guide surface satisfying smooth sliding of a photosensitive material and a low reflection factor to light beams in a visible light region, and to provide its ...
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JP3695063B2 |
To reduce a production cost and to obtain a clad material excellent in joining strength by grinding a steel strip surface with a brush roll after a stainless steel strip after cold rolling is annealed and a oxidized scale is removed and ...
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JP3693236B2 |
To constitute the polishing panel of a pumping up/polishing device of a single material, and reduce the cost. A continuous material comprising a non-woven fabric is pressed or rolled, and a folding line 4 is provided on both sides of a p...
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JP3685414B2 |
To provide a bolt polishing device excellent in workability without needing troublesome mounting work. A pair of cylindrical stationary brushes 3a, 4a are journalled onto a base 1 so as to be parallel to each other, a bolt B is axially p...
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JP2005212026A |
To provide a method and an apparatus for removing burrs generated in a cutting process when electrode foil for an aluminum electrolytic capacitor is slit so as to have a required width.The aluminum foil 1 slit so as to have the required ...
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JP3675355B2 |
To provide cloth for polishing a magnetic disc allowing texture machining (polishing) for presenting uniform and fine surface roughness (Ra) by securing sufficient cutting amount (SR), regardless of the grain size of abrasive grain. At l...
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JP2005181767A |
To provide a polyimide endless belt for an electrophotographic apparatus suitable for intermediate transfer and/or fixation in the electrophotographic apparatus and excellent in toner cleaning performance and glossiness.In a method for m...
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JP3666333B2 |
To obtain a uniform amount of polishing even if the collective thickness of a plurality of works is different each other when applying polishing to the plurality of works such as dielectric elements serving as the stators of a variable c...
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JP2005161512A |
To solve a problem that a printed board material is not regulated in a flat state as it is carried by a roller, its head end part and a rear end part are peeled and bent in the middle of carriage or curved and accordingly production of a...
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JP2005167200A |
To provide a laminated layer type polishing pad for chemical-mechanical polishing which is hard to break away, is low in cost, can be manufactured, and has a window for detecting an end.The resilient laminated-layer-type polishing pad fo...
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JP2005155755A |
To dispense with a barrel polishing process and form a uniform nitrided film when manufacturing an endless metallic ring used in a continuously variable transmission.A polishing device is composed of an end face polishing device and an i...
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JP2005144599A |
To provide a device capable of properly removing a place polluted by a toxic substance such as dioxins, without generating a large quantity of grinding/polishing/cleaning materials and separation materials polluted by the toxic substance...
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JP2005131746A |
To provide a polishing device of a long pipe inside surface, capable of preventing generation of an unpolished part in a step part of the long pipe inside surface.This polishing device of the long pipe inside surface can freely insert at...
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JP3651626B2 |
To provide extremely excellent surface roughness without damaging a surface of a rolling element by providing the abrasive grain of low hardness, and improve the working efficiency, and to reduce the required working time by generating t...
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JP3649550B2 |
To allow to carry out a good polishing process generating little dam age to a semiconductor wafer, as well as to allow to install a polishing cloth to a polishing drum easily and securely. In this chamfering surface polishing device of a...
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JP2005118909A |
To provide a deburring device capable of highly accurately removing a burr generated in a disk-like work having a kerf on an outer peripheral surface and an end surface.This deburring method removes the burr generated in the kerf of a ge...
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