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WO/2023/141051A1 |
An example probe for a test system includes a conductor to carry direct current (DC) signals between a DC testing resource and a signal trace on the test system, where the signal trace is for carrying the DC signals and alternating curre...
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WO/2023/140648A1 |
A pogo pin according to the present invention is a pogo pin which establishes an electrical connection by means of a first probe and a second probe and is variable in length with compressive elasticity. In the first probe (10), a cylinde...
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WO/2023/139478A1 |
A flexible printed circuit flex-PCB sensor (100, 100') comprising: - a sheet of electronically printable flexible material (102); - a plurality of sensor cells (14, 16,..., 18) printed on said sheet (102) and each comprising at least one...
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WO/2023/135889A1 |
This probe card comprises: a probe guide that holds a probe; and a probe substrate laminated on the probe guide. The probe substrate has a first surface facing a tester head, and a second surface facing the probe guide, and is provided w...
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WO/2023/136439A1 |
The present invention relates to a test pin for inspecting the presence of an electrical defect in a semiconductor and a camera module, the test pin comprising: a top plunger which is in contact with an object to be inspected to transmit...
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WO/2023/137100A1 |
The invention is a test system for testing silicon wafers or packaged devices. The system includes a tester having multiple testing stacks that each hold a vertical stack of test engines, data buffers, pin drivers, and other resources, w...
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WO/2023/131025A1 |
A battery test assembly (10), a battery (20), a charging assembly (60) and an electric device (70). The battery test assembly (10) comprises: a positive electrode probe (11), wherein a first end (11a) of the positive electrode probe (11)...
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WO/2023/128428A1 |
The present invention relates to a test socket used to measure electrical characteristics of an electrical device. The present invention provides a test socket for signal loss protection, wherein the test socket is disposed between facin...
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WO/2023/127394A1 |
This method for producing an electrocast tube includes a core material preparation step (S1), an electroconductive layer formation step (S3), a support layer formation step (S5), a support-layer-equipped core material cutting step (S7), ...
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WO/2023/126239A1 |
It is herein described a contact probe (20) having a first end portion (20A) which ends with a contact tip (21A) configured to abut onto a contact pad (51A) of a device under test (51) and a second end portion (20B) which ends with a con...
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WO/2023/118856A1 |
Apparatus is described including a DC electrical meter (62). The DC electrical meter (62) includes a current sensor (1), or the DC electrical meter (62) is connected to the current sensor (1). The current sensor (1) includes a busbar con...
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WO/2023/117084A1 |
A microwave antenna probe (100) is presented for controlling an antenna patch (142) connected to a microwave transmission line (141) which are attached on a printed circuit board (140). The microwave antenna probe comprises: a metal body...
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WO/2023/117251A1 |
The invention relates to a method for analysing the state of an electrical operating means (2) of a system (1) for supplying energy, wherein the electrical operating means (2) has a housing (3) comprising an insulating liquid (4), and th...
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WO/2023/117188A1 |
An electronics test bench system (100) comprising: a frame (101) and a top plate (102) removably coupled to the frame (101) with a hinged connection (103), the top plate (102) configured to receive a device under test, DUT, thereon and t...
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WO/2023/118894A1 |
The invention provides a signal conditioning stage for a photonic current or voltage transducer (1) which comprises a number of burden resistors and a number of switches in parallel with the burden resistors, the switches operable to sho...
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WO/2023/115379A1 |
An electronic device (100, 800, 1000) and associated methods are disclosed. In one example, the electronic device (100, 800, 1000) includes an interconnect socket (102, 302, 402, 802, 1004, 1320, 1402, 1506) that includes a liquid metal....
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WO/2023/119897A1 |
Provided is a probe head comprising a probe and an insulating support in which a tapered hole for supporting a plurality of portions of the probe is provided.
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WO/2023/116942A1 |
The invention relates to an accelerated electrified aging test apparatus for an electronic device. The accelerated electrified aging test apparatus comprises a box body, a test cabin and a humidification apparatus. Access terminals are a...
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WO/2023/109771A1 |
A probe apparatus, and a superconducting qubit junction resistance measurement method and system. The probe apparatus is used for measuring a superconducting quantum chip (4) and comprises a probe group, a probe control mechanism (2) and...
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WO/2023/113179A1 |
The present invention relates to a contact device and a character measurer comprising same, the contact device having an operation, such as rotation, added thereto so that all surfaces of the contact device of the character measurer, whi...
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WO/2023/110973A1 |
The present invention proposes a voltage converter (1) having a switching arm (2) comprising busbars (6, 7, 8) connecting it to an electrical network and to a rotating electric machine (15). The converter comprises a current-measuring de...
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WO/2023/112315A1 |
There is a need to increase the connection strength of a base body (9) of a connection device (6) for connecting a plurality of plate-like members stacked on one another. A probe card substrate connection base (100) is characterized by...
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WO/2023/113213A1 |
The present invention provides a rubber socket for testing a semiconductor element, and a conductive member for the rubber socket, the rubber socket comprising: a main body formed of an insulation material; and a plurality of electricity...
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WO/2023/110715A2 |
The current sensing system (2) comprises a busbar (9) connected in a current path between a power supply (3) and a load (5). The busbar (9) comprises a temperature dependent resistance with a specific temperature coefficient. An amplifie...
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WO/2023/113214A1 |
The present invention provides a method for manufacturing a conductive member for a rubber socket, comprising the steps of: preparing a first substrate having a first groove; filling the first groove with a ferromagnetic material and a d...
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WO/2023/109772A1 |
Disclosed in the present application are a quantum chip nondestructive testing probe device and a quantum chip nondestructive testing probe station. The probe device comprises a probe and a probe control mechanism, wherein the probe cont...
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WO/2023/112116A1 |
In a cleaning sheet (100) in which a cleaning layer (20) is bound to a surface of a base material sheet (10), there has been a problem that, in temperature conditions at which the cleaning sheet is used, warping occurs due to thermal def...
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WO/2023/106732A1 |
A probe member for inspection according to an embodiment of the present invention comprises a body unit having a pillar shape, and a plurality of contact protrusions provided on the body unit configured as a cross-sectional area of the p...
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WO/2023/103199A1 |
An electrical contact probe apparatus, comprising a fixing plate (4), wherein a plurality of mounting holes (5) are formed in the fixing plate (4); each of probes (1) comprises a needle rod (14), and a protrusion (12) and an axial annula...
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WO/2023/106762A1 |
The present invention provides an electrically conductive contact pin for a Kelvin test and a test device comprising same, which can cope with the narrower pitch between electrodes of a semiconductor device.
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WO/2023/105553A1 |
[Problem] One objective of the present invention is to provide a probe card with which contact failures do not readily occur. Another objective of the present invention is to provide a probe card having good high-frequency characteristic...
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WO/2023/098830A1 |
A line fault detection apparatus, comprising a housing (1000), a fault detection device (2000), a heat dissipation device (3000) and an air flow exhaust device (4000), wherein the housing (1000) has an inner cavity, a support plate (1100...
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WO/2023/101224A1 |
The present invention provides a rubber socket for testing a semiconductor element and a manufacturing method thereof, the rubber socket comprising: a body having a plurality of through-holes formed to extend therethrough in the height d...
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WO/2023/098119A1 |
Aspects of the invention include a wafer test device with a conformal laminate and rigid probes extending from the laminate to form an electrical connection with a microcircuit under test. The wafer test device also includes a spring pla...
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WO/2023/100708A1 |
This probe substrate 17 is used in a probe card 11. The probe card 11 is provided with a main substrate part 12 having a circuit substrate 12a, and a support member 14 connected to the main substrate part 12. The probe substrate 17 compr...
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WO/2023/096237A1 |
A probe card according to various embodiments of the present invention comprises: a probe pin; and a guide part in which the probe pin is disposed. The probe pin may comprise: a body part; a first extension part extending toward one side...
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WO/2023/096242A1 |
A probe card according to various embodiments of the present disclosure may comprise: a probe pin; and a guide part which is disposed at the outer edge of the circumference of the probe pin and comprises a guide opening into which one en...
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WO/2023/092921A1 |
An apparatus and method for measuring the performance of a finished product of an aircraft wiring harness (6) on the basis of de-embedding technology. The measurement apparatus comprises a left fixture (1) and a right fixture (2), wherei...
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WO/2023/094587A1 |
The present invention is related to a remotely-controlled flying device intended to approach and contact a high-voltage overhead power line for operation thereon, said flying device comprising : - a mechanical structure (1) bearing a plu...
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WO/2023/092897A1 |
The present invention relates to a membrane probe card and a probe head thereof. The membrane probe card comprises a membrane probe head (3), the membrane probe head (3) comprising a support body (31), a membrane (32), probes (33), and a...
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WO/2023/092898A1 |
A membrane probe card and a probe head thereof. The membrane probe card comprises a membrane probe head (3), the membrane probe head (3) comprising a support body (31), a membrane (32), a probe (33) and an interconnection wire (34), wher...
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WO/2023/092899A1 |
A membrane probe card and a probe head thereof. The membrane probe card comprises a membrane probe head (3), the membrane probe head (3) comprising a support body (31), a membrane (32), a probe (33) and an interconnection wire (34), wher...
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WO/2023/092674A1 |
A testing device (100), comprising a testing table (10), a testing mechanism (20), a moving mechanism (30), and a limiting member (40). The testing table (10) is used for fixing a circuit board to be tested; the testing mechanism (20) is...
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WO/2023/090062A1 |
This probe storage jig stores a probe that includes an arm portion having a cantilever structure and a supporting portion connected to a fixed end of the arm portion. The probe storage jig has a configuration in which a first guide plate...
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WO/2023/090746A1 |
The present invention provides an electrically conductive contact pin and an inspection device having improved inspection reliability for an inspection object. The electrically conductive contact pin is characterized in that a first conn...
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WO/2023/090517A1 |
Disclosed are a system and a method therefor, the system enabling high-speed measurement of the performance of a plurality of measurement items for verification and post management of equipment under test including an antenna under test....
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WO/2023/089628A1 |
The present invention relates generally to Load Banks for testing generators and electric power sources and more particularly the present invention discloses a load bank system circuit topology and method thereof, to generate large numbe...
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WO/2023/090622A1 |
An electroluminescence inspection apparatus is disclosed. The electroluminescence inspection apparatus may comprise: a first substrate; a plurality of electrode members arranged on a first surface of the first substrate and having elasti...
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WO/2023/085661A1 |
The present invention provides a rubber socket for testing a semiconductor device, the rubber socket comprising: a main body having a plurality of conductive holes penetratively formed in a height direction and formed of an insulating fi...
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WO/2023/085502A1 |
An expansion member for a battery charging/discharging probe is disclosed. The expansion member comprises: a first fluid holding part forming a space in which fluid can be introduced and stored; and a fluid supply tube connected to the f...
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