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Patent Searching and Data


Matches 301 - 350 out of 27,081

Document Document Title
WO/2017/200146A1
The present invention relates to a case for semiconductor probe pins and to a case which can accommodate and maintain probe pins having been subjected to ultraprecision micromachining so as to be mounted to a probe used for semiconductor...  
WO/2017/196092A1
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...  
WO/2017/196830A1
Space transformers, planarization layers for space transformers, methods of fabricating space transformers, and methods of planarizing space transformers are disclosed herein. In one embodiment, the space transformers include a space tra...  
WO/2017/197269A1
Various examples are provided for contactless wideband current sensing. A combination of magnetoresistive (MR) sensor and Rogowski coil outputs can be combined to provide current sensing from DC to 10 MHZ or more. In one example, a syste...  
WO/2017/196093A1
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...  
WO/2017/196094A1
The present invention relates to a testing socket, more specifically to a testing socket which is placed between a device to be tested and a testing apparatus to electrically connect a terminal of the former and a pad of the latter. The ...  
WO/2017/197077A1
The disclosure generally relates to polyimide compositions and in particular, compositions having a filler. The polyimide compositions may be made of polyimide resins having titanium dioxide particle fillers. The use of titanium dioxide-...  
WO/2017/191726A1
This invention is provided with: an insulating plate 41 comprising a plurality of insulating synthetic resin layers; wiring circuits 44a, 44b, 44c provided to the insulating plate 41; a thin-film resistor 46 formed so as to be embedded i...  
WO/2017/192256A1
A busbar current sensor assembly (10) includes a busbar member (12) that includes a first cavity (60) and a second cavity (68). The second cavity is disposed opposite the first cavity. The busbar current sensor assembly also includes a f...  
WO/2017/187271A1
Disclosed is a socket apparatus (100) for gripping the balls of a ball grid array (BGA) (170), including a base member (130) of electrically insulative material, an array of pairs of electrical contacts (160) disposed in the base member ...  
WO/2017/188595A1
The present invention provides a bipartite probing device comprising: a barrel formed in a hollow cylindrical shape opened at both ends thereof so as to have a first opening and a second opening; an intermediate member disposed such that...  
WO/2017/186410A1
The invention relates to a method for determining a load current, which is based on the passage of a calibration current in a specific manner and on specific calculation methods.  
WO/2017/189660A1
A cable for communicating digital or analog signals between connectors at its opposite ends has means for indicating to an installer who has access to one end of the cable which connector is connected at the opposite end of the same cabl...  
WO/2017/183757A1
The present invention relates to a contact pin for testing an electrical terminal mounted on a printed circuit board, etc. The present invention provides a contact pin comprising: a substrate, which is made of a single material, and whic...  
WO/2017/183788A1
An embodiment of the present invention provides a test socket for a semiconductor device, comprising: a base layer having a first surface and a second surface opposite to the first surface, and having, on the second surface, an external ...  
WO/2017/179836A1
The present invention relates to a CIS probe card which prevents light projected for CIS inspection from being interfered with by lead-in wires and to a method for producing the CIS probe card. The CIS probe card comprises: a plurality o...  
WO/2017/179390A1
Provided is an electrical characteristic inspection method whereby electrical characteristics of a semiconductor device can be inspected even in the cases where an electrode of the semiconductor device is not protruding. An electrical ch...  
WO/2017/179869A2
The present invention relates to an apparatus and a method for protecting a MOSFET relay by using a voltage detector and a signal fuse, wherein a voltage value is calculated by detecting, through a voltage detector, the value of a curren...  
WO/2017/179320A1
A probe pin (10) is provided with: a coil spring (11) which extends and contracts along a centerline; a first contact (25) which has a rectangular cross section and is disposed at one end on the centerline; and a second contact (34) whic...  
WO/2017/178105A1
A contact pin (100; 100 12, 100 32) for electrically connecting a first electrical contact area (13), which is arranged on a measurement object (300) to be measured, and a second electrical contact area (17), which is arranged in a test ...  
WO/2017/179869A3
The present invention relates to an apparatus and a method for protecting a MOSFET relay by using a voltage detector and a signal fuse, wherein a voltage value is calculated by detecting, through a voltage detector, the value of a curren...  
WO/2017/178327A1
The invention relates to a cable (20) which is used to test a transformer (2) and connects the transformer (2) to a testing device (10). The cable (2) has at least two twin cables (23-25). Through a first conductor of every twin cable (2...  
WO/2017/175573A1
Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring subst...  
WO/2017/175984A1
An embodiment provides an anisotropic conductive sheet for electrically connecting a terminal of a device to be tested and a pad of a testing device, the sheet comprising a plurality of conductive portions which are formed in a thickness...  
WO/2017/176731A1
A resistor assembly can include a resistor having a first end and a second end, and a conductive member, where the conductive member is coupled to the first end of the resistor. The resistor assembly can also include a shield cup and a h...  
WO/2017/176508A1
Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-sup...  
WO/2017/167732A1
At least two redundant analog input units (1, 2) for a measurement current (I) have analog inputs (3, 4) which are connected in parallel and on which voltage measuring devices (8, 19) directly lie in order to convert the respective appli...  
WO/2017/172917A1
Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges are disclosed herein. The methods are configured to test a plurality of devices under test (DUTs) present on a substrate. The probe system...  
WO/2017/173279A1
The present disclosure relates to nucleic acid probes and kits for determining the length of a region of tandem repeats in a subject's genome and methods of using the DNA probes for determining the length of a region of tandem repeats in...  
WO/2017/169760A1
The purpose of the invention is to reduce, in an electronic device having an electrode formed on a principal surface, the misplacement of a probe pin or the breakage of the electrode. This electronic device 1a is an electronic device to ...  
WO/2017/171339A1
Disclosed is a test socket unit for electrically connecting a test object and a test circuit device. The test socket unit includes: a plurality of support locking pins configured to be stationarily installed on the surface of the test su...  
WO/2017/169761A1
The purpose of the invention is to improve measurement accuracy at the time of nondestructively measuring, in a wiring board having an electrode made of a plurality of plating layers, the thickness of each plating layer of the electrode ...  
WO/2017/172115A3
A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a...  
WO/2017/172115A2
A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a...  
WO/2017/162382A1
The invention relates to a cover (4) for a housing (7), comprising a number of press-fit pins (3, 5) which have at least two different press-fit zones (3a, 3b). The invention also relates to a battery sensor having a cover of this type, ...  
WO/2017/164631A1
Disclosed is a test socket assembly for electrically connecting a contact point to be tested in a test object and a contact point for testing in a testing circuit. The test socket assembly includes: a plurality of signal probes; a socket...  
WO/2017/156780A1
A radio-frequency detection apparatus, comprising a PCB circuit board (10), a probe carrier board (20) and a test board (30). The PCB circuit board (10) is provided on the probe carrier board (20). The test board (30) is located under th...  
WO/2017/160254A1
This invention refers to electric meter and/ or electrical energy measuring tool (A), without connector block that is used for input and output connection of current and /or energy transmitted cables (14), in place of this current and /o...  
WO/2017/160090A3
The present invention relates to a device and a method for manufacturing a probe pin and, more particularly, to a device and a method for manufacturing a probe pin by polishing a pointed end of a metal wire. The present invention provide...  
WO/2017/160090A2
The present invention relates to a device and a method for manufacturing a probe pin and, more particularly, to a device and a method for manufacturing a probe pin by polishing a pointed end of a metal wire. The present invention provide...  
WO/2017/156779A1
A test probe (20) of a detection apparatus. The test probe comprises a probe sheath (10) and the probe (20). The probe sheath (10) comprises a first connecting end (11), a second connecting end (12) and a connecting lead (13). The connec...  
WO/2017/155707A1
A temperature-controlled fluid forcing system includes a temperature control system generating a stream of flowing temperature-controlled fluid. A heat exchanger includes a thermally conductive housing within which a plurality of walls d...  
WO/2017/153997A1
The present invention provides a method for determining consumption of appliances within a surveyed household in which there are no sensors for measuring consumption of specific appliances. The method comprises - pre-processing historica...  
WO/2017/155134A1
The present invention relates to a probe member for inspection and, more particularly, to a probe member for inspection in which at least a part thereof is inserted into a cylindrical body and an upper end thereof is in contact with a te...  
WO/2017/155155A1
A bidirectional conductive module for testing a semiconductor device, according to one embodiment of the present invention, comprises: a substrate part having a structure bent such that one surface thereof faces the semiconductor device ...  
WO/2017/152326A1
An Internet of Things-based novel oscilloscope comprising a housing (1), a handle (2) provided on the housing (1), a fixing apparatus (10) provided under the housing (1), a display interface (3) provided on the housing (1), a storage int...  
WO/2017/156245A1
Systems, devices, and methods for characterizing semiconductor devices and thin film materials. The device consists of multiple probe tips that are integrated on a single substrate. The layout of the probe tips could be designed to match...  
WO/2017/152567A1
An oscilloscope probe, method, apparatus and system for testing a ripple. The oscilloscope probe comprises a first connector (22) connected to an oscilloscope, and a signal probe (24) and a ground probe (26), wherein the signal probe (24...  
WO/2017/151231A9
An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to th...  
WO/2017/151231A1
An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to th...  

Matches 301 - 350 out of 27,081