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Patent Searching and Data


Matches 301 - 350 out of 27,016

Document Document Title
WO/2017/172115A2
A prober head to interface an E-testing apparatus to a device under test, which may be an unpackaged die, for example. In some embodiments, the prober head includes an array of conductive pins, each of the pins extending outwardly from a...  
WO/2017/162382A1
The invention relates to a cover (4) for a housing (7), comprising a number of press-fit pins (3, 5) which have at least two different press-fit zones (3a, 3b). The invention also relates to a battery sensor having a cover of this type, ...  
WO/2017/164631A1
Disclosed is a test socket assembly for electrically connecting a contact point to be tested in a test object and a contact point for testing in a testing circuit. The test socket assembly includes: a plurality of signal probes; a socket...  
WO/2017/156780A1
A radio-frequency detection apparatus, comprising a PCB circuit board (10), a probe carrier board (20) and a test board (30). The PCB circuit board (10) is provided on the probe carrier board (20). The test board (30) is located under th...  
WO/2017/160254A1
This invention refers to electric meter and/ or electrical energy measuring tool (A), without connector block that is used for input and output connection of current and /or energy transmitted cables (14), in place of this current and /o...  
WO/2017/160090A3
The present invention relates to a device and a method for manufacturing a probe pin and, more particularly, to a device and a method for manufacturing a probe pin by polishing a pointed end of a metal wire. The present invention provide...  
WO/2017/160090A2
The present invention relates to a device and a method for manufacturing a probe pin and, more particularly, to a device and a method for manufacturing a probe pin by polishing a pointed end of a metal wire. The present invention provide...  
WO/2017/156779A1
A test probe (20) of a detection apparatus. The test probe comprises a probe sheath (10) and the probe (20). The probe sheath (10) comprises a first connecting end (11), a second connecting end (12) and a connecting lead (13). The connec...  
WO/2017/155707A1
A temperature-controlled fluid forcing system includes a temperature control system generating a stream of flowing temperature-controlled fluid. A heat exchanger includes a thermally conductive housing within which a plurality of walls d...  
WO/2017/153997A1
The present invention provides a method for determining consumption of appliances within a surveyed household in which there are no sensors for measuring consumption of specific appliances. The method comprises - pre-processing historica...  
WO/2017/155134A1
The present invention relates to a probe member for inspection and, more particularly, to a probe member for inspection in which at least a part thereof is inserted into a cylindrical body and an upper end thereof is in contact with a te...  
WO/2017/155155A1
A bidirectional conductive module for testing a semiconductor device, according to one embodiment of the present invention, comprises: a substrate part having a structure bent such that one surface thereof faces the semiconductor device ...  
WO/2017/152326A1
An Internet of Things-based novel oscilloscope comprising a housing (1), a handle (2) provided on the housing (1), a fixing apparatus (10) provided under the housing (1), a display interface (3) provided on the housing (1), a storage int...  
WO/2017/156245A1
Systems, devices, and methods for characterizing semiconductor devices and thin film materials. The device consists of multiple probe tips that are integrated on a single substrate. The layout of the probe tips could be designed to match...  
WO/2017/152567A1
An oscilloscope probe, method, apparatus and system for testing a ripple. The oscilloscope probe comprises a first connector (22) connected to an oscilloscope, and a signal probe (24) and a ground probe (26), wherein the signal probe (24...  
WO/2017/151231A9
An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to th...  
WO/2017/151231A1
An example test system includes a test head and a probe card assembly connected to the test head. The probe card assembly includes: a probe card having electrical contacts, a stiffener connected to the probe card to impart rigidity to th...  
WO/2017/150232A1
A multilayer wiring substrate for probe cards, which has a laminate of resin layers, and which is suppressed in the production cost by reducing the occurrence of defects such as chipping by covering a ceramic substrate with a resin. A mu...  
WO/2017/145706A1
The present invention addresses the problem of achieving a method such as isotropic etching for bending a thin film member in which the etching stop position differs from the position at which bending from IIB processing begins. Provided...  
WO/2017/146256A1
Provided is a current transformer in which an integrated connecting mechanism capable of opening/closing a core and waterproof performance are achieved through a simple structure, which can be given a reduced size and weight overall, and...  
WO/2017/147005A1
A transfer system includes a first mechanical element including a portion of a one of a support platform and a transfer device; a second mechanical element including a portion of a one of the support platform and the transfer device; and...  
WO/2017/140496A1
The invention relates to a measuring resistor calibration device (10), comprising a measurement terminal (24), a reference resistor (30), a reference connection (52) and an analog-to-digital converter (60), wherein the measuring resistor...  
WO/2017/141706A1
Provided is a conductive contact having a first end and a second end that is opposed to the first end. The first end has first to fourth linear ridges and first to fifth tips. The first to fourth ridges are arranged so as to be separated...  
WO/2017/140874A1
The invention relates to a battery sensor in which a voltage is measured via a shunt resistor with alternating parallel connection of a reference resistor. Furthermore, the invention relates to a corresponding method and to a correspondi...  
WO/2017/141327A1
Provided is a ground fault point locating system for locating a ground fault point in a distribution system, said system being characterized by being provided with measurement devices that are respectively disposed at a plurality of loca...  
WO/2017/140589A1
The invention relates to a method for determining a calibration current pulse when it is superimposed by a useful current pulse, wherein the calibration current pulse is computationally determined after measurement over a plurality of me...  
WO/2017/141561A1
This probe pin comprises an elastic cylindrical body that expands and contracts along the central axis thereof, a conductive first plunger that extends into the interior of the elastic cylindrical body along the central axis from one end...  
WO/2017/141564A1
This probe pin comprises an insulating elastic member (11), a first plunger (20) and a second plunger (40). The first plunger (20) and the second plunger (40) respectively comprise fist conductors (30, 50) and second conductors (35, 55) ...  
WO/2017/138305A1
[Problem] To provide a contact terminal, an inspection jig, and an inspection device, whereby generation of a magnetic field due to inspection can be reduced. [Solution] A contact terminal Pr is provided with a conductive outer cylindric...  
WO/2017/138380A1
[Problem] To provide an inspection jig, an inspection jig set, and a substrate inspection device capable of shortening inspection time while temperature stress is applied to a substrate to be inspected. [Solution] An inspection jig (3D) ...  
WO/2017/134057A1
The invention relates to a method and a device for reconstructing a useful signal from an acquired signal made up of a plurality of samples representing physical quantities measured, the acquired signal including said useful signal made ...  
WO/2017/129999A1
A transmission line arrangement having a first end and a second end, the transmission line arrangement being configured to transmit a signal between the first end and the second end, the transmission line arrangement comprising a signal ...  
WO/2017/131394A1
The present invention relates to a test socket for a semiconductor device using an air gap, the test socket comprising: a shield unit which has a plurality of clearance openings which are vertically perforated apart from each other, and ...  
WO/2017/127578A1
A multichannel clip device and methods of use that facilitate connection of multiple electrical components of a first device and a second device for testing and/or verification are provided herein. Such multichannel clip devices can incl...  
WO/2017/126877A1
The present invention relates to an electric characteristic inspection pin and, more particularly, to an electric characteristic inspection pin capable of performing stable electric characteristic inspection and an inspection unit having...  
WO/2017/125661A1
Disclosed is a current-measuring device (1, 10) protected against surge voltages if the device (1, 10) is opened. The device (1, 10) comprises a first current transformer (2), a first connecting terminal (4) to which a first terminal (21...  
WO/2017/126782A1
The present invention relates to a bidirectional conductive pattern module for testing a semiconductor, a semiconductor test socket using the same, and a manufacturing method for the bidirectional conductive pattern module for testing a ...  
WO/2017/121489A1
The invention relates to an arrangement and a method for measuring integral field variables of current-carrying assemblies, in which a dielectric waveguide is arranged along the path that contributes to the integration, said waveguide be...  
WO/2017/123397A1
Shielded probe systems are disclosed herein. The probe systems are configured to test a device under test (DUT) and include a measurement chamber that at least partially bounds an enclosed volume, an aperture defined by the measurement c...  
WO/2017/122680A1
Provided is a contact pin which has excellent high-frequency characteristics and with which the risk of damage to an electrode of an inspection substrate is low. The contact pin includes an electrode contacting portion at one end, and a ...  
WO/2017/121542A1
The invention relates to a method for placing and making contact with a contact element which is in the form of a test contact of a test contact arrangement, in particular, in which a contact head provided with a contact element holding ...  
WO/2017/120514A1
A tester apparatus is provided. Slot assemblies are removably mounted to a frame. Each slot assembly allows for individual heating and temperature control of a respective cartridge that is inserted into the slot assembly. A closed loop a...  
WO/2017/119676A1
The present invention relates to a semiconductor test contactor for inspecting a semiconductor having a fine pitch. According to an embodiment of the present invention, the semiconductor test contactor includes a first probe part, a seco...  
WO/2017/117257A1
The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a contr...  
WO/2017/113056A1
A multi-channel interface test device, and the test device comprising: a circuit board (100) comprising a test interface (10) used for electrically connecting with an output interface of a peripheral device, and a breadboard (20) having ...  
WO/2017/111198A1
The present invention relates to a bidirectional contact module for a semiconductor test and a semiconductor test socket using the same. The bidirectional contact module for a semiconductor test according to the present invention compris...  
WO/2017/109837A1
Provided are a probe exchange tool and a probe exchange assistance system, by which a particular probe to be exchanged can be correctly removed from an inspection device by a user. A probe exchange tool 20a is used for probe exchange in ...  
WO/2017/112037A1
Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the ...  
WO/2017/112075A1
Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first so...  
WO/2017/103789A1
The present invention relates to a device for uses in scanning probe microscopy and to a method for manufacturing same. The metallic device comprises a single body (1) with two parts (2) and (3), wherein the second part (3) has a submicr...  

Matches 301 - 350 out of 27,016