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WO/2018/161240A1 |
An automatic PCB substrate assembly apparatus comprises a support (1). Opposing inner sides of the support (1) are provided with vertical guide rails (9). A mechanical arm is connected below a cylinder (2) and retrieves an electronic com...
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WO/2018/160137A1 |
An apparatus and method for filling a ball grid array template and a method for transferring a plurality of balls are disclosed. The apparatus includes a flat base, a plate and a stationary ball supply bin. The plate is mounted on the ba...
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WO/2018/149959A1 |
The present industrial property right relates to a method for producing a cooling plate (2a, 2b), to the cooling plate (2a, 2b) as such and to a battery system and an electric vehicle. According the method for the production of the cooli...
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WO/2018/142733A1 |
Provided is a soldering apparatus whereby work time for soldering can be reduced and non-wetting of solder can be suppressed. A soldering apparatus 100 having a plurality of cylindrical solder-piece guiding pipes 10 having a space throug...
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WO/2018/135149A1 |
A plate-like member (20) forming a part of a structure (501, 502) has: a first core material layer (21) exposed at a first surface (210) to the outside; a second core material layer (22) exposed at a second surface (220) to the outside, ...
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WO/2018/132532A1 |
The present application relates to a method and to an apparatus for applying molten solder to a substrate are disclosed. A soldering machine for applying solder to a substrate includes at least one slot soldering nozzle (28) configured t...
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WO/2018/132566A1 |
The present application relates to a laser brazing system including a torch body (24), a wire feed tip (28), a laser processing head, and a cooling collar (34). The torch body (24) includes nozzle (28), mounting (26), and cooling section...
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WO/2018/123261A1 |
Provided is a jet solder height confirmation jig with which the height of a jet wave of molten solder can be precisely adjusted. Also provided is a method for handling this jig. A jet solder height confirmation jig 100 is equipped with: ...
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WO/2018/117991A1 |
The invention relates to a method of coating with brazing paste discontinuously and only onto the desired sections on the surface of the fuel rail (1) through the use a roller (9, 11), with a view to join the external elements such as in...
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WO/2018/109463A1 |
There is provided an applicator device (1) for applying a composition to an end of a pipe. The applicator device comprises an applicator head(3), the applicator head having a cavity (9) with an opening into which the end of the pipe can ...
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WO/2018/096917A1 |
The purpose of the present invention is to prevent solder from scattering during a reflow process and to reliably remove oxide films formed on surfaces of the solder and an electrode. A soldering method according to the present invention...
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WO/2018/092493A1 |
Provided is a reflow device that reflow solders a substrate (90) having a first component (91) and a second component (92) which has a greater heat capacity than that of the first component (91). The reflow device comprises: a plurality ...
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WO/2018/088520A1 |
Provided are a flux applying device and a flux applying method with which flux is applied to one surface of a workpiece and is prevented from moving around to another surface and becoming attached thereto. This flux applying device is pr...
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WO/2018/079515A1 |
The method for determining the state of an iron tip (5) pertaining to the present invention determines the state of an iron tip (5) by measuring a physical quantity of gas flowing through the inside of a gas supply unit (7), the total fl...
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WO/2018/080627A1 |
A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station co...
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WO/2018/081331A1 |
A soldering tool includes a housing having a handle portion defining a first longitudinal axis, and a head portion coupled to the handle portion and defining a second axis. The soldering tool further includes a heating element coupled to...
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WO/2018/073078A1 |
An ejector (1) for jetting a viscous medium onto a substrate (23) is disclosed. The ejector comprises a jetting chamber (2) adapted to accommodate the viscous medium, a nozzle (3) communicatively connected to the chamber, and an impactin...
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WO/2018/073077A1 |
An ejector (1) for jetting a viscous medium onto a substrate (23) is disclosed. The ejector comprises a jetting chamber (2) adapted to accommodate the viscous medium, a nozzle (3) communicatively connected to the chamber, and an impactin...
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WO/2018/056223A1 |
Provided are a heating device, and a method for manufacturing a plate-shaped member, with which it is possible to uniformly heat an object to be heated. The heating device 1 is provided with: a heater 10 for generating heat to be applied...
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WO/2018/050614A1 |
The present invention relates to a device for applying fluid having a pasty consistency. Particularly, the present invention relates to a device for applying brazing paste manually or by means of a robotic arm, comprising an elastically ...
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WO/2018/036226A1 |
A multi-dimensional multi-point synchronous tin-dispensing device, which comprises: a machine base (1), a tin storage device, an operation platform (3) which is arranged on the machine base (1) and which is provided with a circumferentia...
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WO/2018/036208A1 |
A welding system (2) for a metal piece (11) and a coaxial cable (12), comprising: a heating device (21) provided at a processing station and enabling the metal piece (11) or the coaxial cable (12) to enter a contact for heating; a solder...
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WO/2018/036213A1 |
An automatic system for welding a metal part and a coaxial cable, comprising: a tin feeding device (11) disposed at a first station (16) and used for adding tin paste to a joint (1226) between a metal part (1222) and a coaxial cable (122...
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WO/2018/036227A1 |
Provided are a method for non-contact heating and tin brazing of a metal structural member and coaxial cable, comprising: presetting a workpiece on a drive system and transferring the workpiece to a heating system; said workpiece compris...
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WO/2018/034320A1 |
Provided are a solder alloy for preventing Fe erosion, a resin flux cored solder, a wire solder, a resin flux cored wire solder, a flux coated solder, a solder joint, and a soldering method which, in order to prolong the life of a solder...
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WO/2018/031705A1 |
The invention is a hand-held portable device for soldering electrical wires to an LED lighting strip. The device comprises mechanisms for positioning and securing LED strip contact pads, wires, and solder in position in proximity to a he...
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WO/2018/025787A1 |
The purpose of the present invention is to prevent poor soldering. A soldered product manufacturing method comprising: a nozzle approach step for causing a first conductor and a nozzle 24, 124, 224, 324, 524, 624 to approach or abut on e...
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WO/2017/214797A1 |
A solder paste dispensing and driving device comprises a solder paste container (1), a squeezing device (2) squeezing solder paste out of the solder paste container, and a driving device (3) providing power to perform a relative movement...
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WO/2017/213465A1 |
The present invention relates to a reel-to-reel layer reflow method, which emits a uniformized laser beam, which can easily adjust the emission area, and which is for the purpose of improving productivity. An embodiment of the present in...
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WO/2017/207272A1 |
The invention relates to a production line for soldering components (1) onto a printed circuit board (2), comprising: a soldering furnace (3) with at least two temperature zones (Z1, Z2,..), in which there is a predetermined temperature ...
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WO/2017/198476A1 |
The invention concerns a method and apparatus for manufacturing a brazed heat exchanger. The method comprises the steps of: assembling the heat exchanger components to form at least one unbrazed heat exchanger core in a core builder mach...
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WO/2017/194261A1 |
The invention relates to a soldering tip (1) for a soldering iron (5), in particular for a hand-held soldering iron for soldering an electrical connection element (12) to an electroconductive structure (11) on a substrate (10), comprisin...
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WO/2017/170930A1 |
The objective of the present invention is to facilitate maintenance work by translating an upper furnace body and a hood in an upward direction to form openings on both sides in a conveying direction. This conveying and heating device is...
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WO/2017/162481A1 |
The present invention relates to a diagnostic solder frame (1) for detecting contaminants in a solder bath (3) of a soldering installation, said diagnostic solder frame (1) being configured such that, by means of a transport system (6) o...
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WO/2017/158813A1 |
A viscous fluid supply device that: has a housing, a movable member disposed movably according to the pressure in an air chamber in a state in which airtightness is maintained inside the housing, a discharge nozzle for discharging a visc...
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WO/2017/159880A1 |
Provided is a plate laminate type heat exchanger which can easily be fixed temporarily prior to being assembled through brazing and which can reliably be manufactured with excellent accuracy. In the plate laminate type heat exchanger usi...
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WO/2017/144544A1 |
Invention relates to method, an assembly and a controller for supplying an auxiliary material (5) for the purpose of automatically thermally connecting work pieces (17) to be thermally connected to one another, with the advantageous resu...
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WO/2017/140009A1 |
A continuous vacuum nitrogen-protection brazing furnace having a low energy consumption and a good brazing effect, comprising a rack (1) and a chain-type circulating conveying device (2) arranged on the rack (1), wherein a workpiece load...
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WO/2017/138077A1 |
In a flux unit 30 for the present invention, a flux supply device 126 for discharging flux into a retention tray 122 has a discharge outlet 156 for discharging the flux and a discharge outlet moving device 148 for moving the discharge ou...
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WO/2017/122864A1 |
Disclosed are an apparatus for inspecting and replacing expendables and a solder ball application apparatus comprising same. Provided according to one embodiment of the present invention is an apparatus which is used for an apparatus for...
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WO/2017/109933A1 |
A heat exchanger comprising: a plurality of flattened pipes having a flattened cross-section; and a plurality of flattened U-bend pipes having a flattened cross-section and a U-shaped appearance . A plurality of rows of flattened pipes a...
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WO/2017/102213A1 |
The invention relates to a pipette for equipping a circuit card (2) with solder paste (3), said pipette comprising a tubular body (4) for digging out a defined portion of the solder paste (3) from a solder paste supply (5), a plunger (6)...
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WO/2017/104745A1 |
A fluid discharging method for applying fluid to inside a mask upon a workpiece for an electronic component, wherein a fluid discharging device comprising a head unit that is smaller than the workpiece and that is provided with a dischar...
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WO/2017/093388A1 |
An apparatus for holding a printed circuit board when mounting components thereon, said apparatus comprising a base plate, a mounting means for mounting a printed circuit board spaced from and substantially parallel to the base plate, a ...
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WO/2017/073299A1 |
[Purpose] The present invention relates to an ultrasonic soldering method and an ultrasonic soldering device. The purpose of the present invention is to make it possible to solder a section to be soldered to an electrode or similar that ...
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WO/2017/057651A1 |
The present invention is a solder paste that contains no reducing agents or activators, and a method for producing a soldered product for completing solder joints using the solder paste. This solder paste for a reduction gas is used toge...
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WO/2017/050530A1 |
A strip solder advancement system for advancing a single solder strip is improved in such a way that it allows the process to be condensed. Proceeding from said strip solder advancement system, system components are modified in such a wa...
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WO/2017/049511A1 |
A vacuum reacting force welding method, comprising the following steps: a chip being die-bonded onto a substrate by means of a solder to form a semi-finished product (16); the semi-finished product being placed within a vacuum eutectic c...
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WO/2017/038282A1 |
To provide a heater chip having an iron part with superior conductivity and heat generating properties, said heater chip being capable of performing processing for bonding conduction wires and terminal members efficiently, stably, and re...
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WO/2017/020564A1 |
A DC heating circuit comprises a triode, a diode, an inductor, a first capacitor, a second capacitor, and a heating wire. A source of the triode is grounded. A drain of the triode is connected to a positive electrode of the diode and one...
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