Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 1,051 - 1,100 out of 22,445

Document Document Title
WO/2011/039875A1
Disclosed is a tin-plated Cu-Ni-Si-based alloy strip having excellent resistance to heat separation of the tin-plating. Specifically disclosed is a tin-plated Cu-Ni-Si-based alloy strip which comprises Ni in an amount of 1.0 to 4.5% by m...  
WO/2011/036306A2
The invention relates to an anti-corrosion layer containing predominantly zinc, in particular for steel materials. Said anti-corrosion layer is permeable to hydrogen. The invention also relates to a steel component comprising said layer ...  
WO/2011/036004A1
The invention relates to a method for coating a work piece (11), preferably the work roll of a mill, wherein the coating is carried out electrochemically, by means of brush plating, for example, by a carrier (15). According to the invent...  
WO/2011/036158A2
The present invention is directed to a pretreatment process for copper electroplating of via or trench features on a wafer, comprising filling the via or trench feature with a pretreatment solution, wherein the pretreatment solution comp...  
WO/2011/033916A1
Disclosed is a film-forming method which comprises: a step in which a substrate is prepared by forming a Co film as a seed layer on the surface of the substrate; a step in which negative voltage is applied to the substrate in such a way ...  
WO/2011/029507A1
In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization of the electrolyte liquid in the pores a...  
WO/2011/027528A1
Disclosed is a plating device which makes it possible to effectively form a plated layer of uniform thickness on base particles having an electrically conductive surface. The plating device is a device for plating base particles having a...  
WO/2011/024443A1
Disclosed is an Ni-plated steel sheet which has excellent pressability. Specifically disclosed is an Ni-plated steel sheet which comprises, in a surface that forms the outer surface of a battery can, an Fe-Ni diffusion layer, a softened ...  
WO/2011/019042A1
Disclosed is a copper alloy material for electrical/electronic components in which an alloy layer containing at least copper and tin is formed on a substrate comprising copper or copper alloy, wherein the area ratio of the region of the ...  
WO/2011/018478A1
The invention relates to an electrolyte for copper electroplating on a copper diffusion barrier layer (B), the barrier layer (B) covering a surface of a semiconductor substrate (S), said electrolyte comprising: - a source of copper ions,...  
WO/2011/019055A1
Disclosed is a copper foil which has excellent high frequency characteristics and heat resistance, while achieving high heat-resistant adhesion to a resin substrate at the same time. Specifically disclosed is a heat-resistant copper foil...  
WO/2010/147508A3
The invention relates to the field of producing finishing materials by chemically treating the surface of elongated metal articles, preferably finishing panels used for cladding the facades of buildings and structures and for finishing h...  
WO/2011/013445A1
Provided are a bead wire manufacturing method and manufacturing apparatus, in which a wire rod which has been raised to a high temperature by drawing a wire is subject to bluing without cooling the wire rod, whereby the temperature of th...  
WO/2011/010540A1
Provided is a resin composite electrolytic copper foil having a further increased thermal resistance, and an increased plating adhesion strength when a plating process is performed after a desmear process is performed in additive method ...  
WO/2011/007704A1
Provided is a copper foil with a resistive layer that has minimal resistance value variation as a resistive element, is capable of sufficiently maintaining adhesion to the resin substrate upon which the foil is layered, and is provided w...  
WO/2011/001737A1
Provided is a method for manufacturing electrical components, said method comprising a step in which a middle plating layer comprising palladium or a palladium alloy is formed on top of a substrate, and a step in which a surface plating ...  
WO/2011/001795A1
A metal laminate structure (100) comprising a first metal layer (1), a second metal layer (2) and a third metal layer (3), wherein the first metal layer (1) is provided on one surface of the second metal layer (2), the third metal layer ...  
WO/2010/147013A1
Disclosed is a copper foil obtained by providing a plating layer containing nickel and zinc upon an electrolytic copper foil or a rolled copper foil, and providing a chrome plating layer upon said plating layer that contains nickel and z...  
WO/2010/147508A2
The invention relates to the field of producing finishing materials by chemically treating the surface of elongated metal articles, preferably finishing panels used for cladding the facades of buildings and structures and for finishing h...  
WO/2010/143374A1
A nickel-plated steel sheet is provided in which scratch development during battery can formation is inhibited. Also provided is a process comprising a step in which a surface of a steel sheet is plated with nickel in a nickel deposition...  
WO/2010/139054A1
Free standing articles or articles at least partially coated with substantially porosity free, fine-grained and/or amorphous Co-bearing metallic materials optionally containing solid particulates dispersed therein, are disclosed. The ele...  
WO/2010/133220A2
The invention relates to a method and a device for electroplating a material (1) comprising an electric contact in the outer edge thereof, especially for electroplating substrates, e.g. as a wafer in a cup plater. Conventional methods re...  
WO/2010/073120A3
Systems and methods for the synthesis of lubricant-containing microcapsules are disclosed. Embodiments of composite nickel and copper coatings containing capsules with liquid lubricating oil cores are also disclosed. In certain embodimen...  
WO/2010/128000A1
An apparatus (1) for continuous electrolytic surface finishing of bars (2) is described, comprising at least one cathode (3), one electrolytic cell (4) containing an electrolyte (5) and comprising an inlet (6) and an outlet (7) for the b...  
WO/2010/119908A1
Disclosed is a polyimide film for metallizing, which has an anisotropic thermal expansion coefficient and is obtained by laminating a polyimide layer (a) on one or both surfaces of a polyimide layer (b). The polyimide film for metallizin...  
WO/2010/119489A1
The conductive member has a stable contact resistance, resists peeling, displays a low insertion/removal force and is stable when used as a connector, and has an excellent fusing characteristic when used as a fuse. A Cu-Sn intermetallic ...  
WO/2010/119575A1
Provided is a manufacturing method which gives Ag plating relatively inexpensively only to required portions of a surface-mounted LED lead frame. A manufacturing method for a surface-mounted LED lead frame provides a strip-form Ag plated...  
WO/2010/115756A1
A composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising active amino functional groups with b) a mixture of ethylene oxide and at least one compound select...  
WO/2010/115717A1
A composition for filling submicrometer sized features having an aperture size of 30 nanometers or less comprising a source of copper ions, and at least one suppressing agent selected from compounds of formula (I) wherein - the R1 radica...  
WO/2010/114164A1
Provided is a spring wire that, while achieving electrical conductivity that can even handle high-frequency signals having frequencies of at least 1 GHz, can be used to make springs. Also provided are a contact probe using said spring wi...  
WO/2010/113749A1
Provided are a Cu-Zn-Sn alloy plate and a tin-plated Cu-Zn-Sn alloy strip having not only excellent pressing processability, but also excellent strength, electrical conductivity, and bending processability. The Cu-Zn-Sn alloy plate compr...  
WO/2010/086111A3
The invention relates to a method for generating metal crystalline surface structures in the course of a galvanic metal deposition on an electrode surface disposed within an electrolyte fluid relative to a counter-electrode comprising th...  
WO2010110061A1
A copper foil provided with an electric resistance film characterized in that the electric resistance film comprises a metal foil made of copper or copper alloy, the surface roughness of at least one surface of which is set as ten point ...  
WO/2010/108996A1
The invention concerns a device to conduct an electrochemical reaction on the surface of a semiconductor substrate (S), characterized in that the device comprises: - a container (10) intended to contain an electrolyte (E), - a support (2...  
WO2010110092A1
Disclosed is a copper foil for a printed wiring board, which is characterized by comprising, on at least one surface thereof, a roughened layer that is composed of needle-like fine roughening particles each having a diameter of 0.1-2.0 ...  
WO2010110259A1
Disclosed is a two-layered flexible substrate which has excellent bending endurance, and furthermore, wherein Kirkendall voids do not arise even if a chip-on-film lead section is tin plated and heat treatment is performed. The disclosed ...  
WO/2010/102516A1
A method of forming hard gold jewellery includes forming a mandrel of low melting point material, electroplating a gold layer over the mandrel, electroplating a copper layer over the gold layer, forming holes through the electroplated la...  
WO/2010/080946A3
There is disclosed a non-stick apparatus, comprising a liquid storage or conveyance article comprising a first material; a coating on an internal surface of the article comprising a second material; wherein the second material comprises ...  
WO/2010/095658A1
Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and...  
WO/2010/094998A1
A process of electrodepositing high purity copper in a via in a silicon substrate to form a through-silicon-via (TSV), including immersing the silicon substrate into an electrolytic bath in an electrolytic copper plating system in which ...  
WO/2010/093009A1
Disclosed is a surface-treated metal foil which can be produced at low cost and enables easy formation of an extremely thin electroless plated copper foil, which does not require a sputtering process for forming a fine circuit and is cap...  
WO/2010/092579A1
A process for electroplating high adhesion copper layer on a surface of a highly oxidizable metal in an invariable container, and products produced by this process are provided.  
WO/2010/087076A1
A spark plug and a process for producing the plug, in which a deposit formed on a ground electrode by plating can be relatively easily removed without causing an increase in cost and ignition properties can be prevented from decreasing. ...  
WO/2010/086111A2
The invention relates to a method for generating metal crystalline surface structures in the course of a galvanic metal deposition on an electrode surface disposed within an electrolyte fluid relative to a counter-electrode comprising th...  
WO/2010/084532A1
Disclosed is a conductive member having a stable contact resistance, which is hardly separated and requires a small inserting/drawing force when used as a connector. The conductive member is characterized in that a Cu-Sn intermetallic co...  
WO/2010/034511A3
A support comprising iron (Fe) is made up of components of a hydraulic cylinder moving relative to each other over a running surface, in particular a piston rod, with an electrochemically applied outer layer of chromium (Cr) with an elec...  
WO/2010/080946A2
There is disclosed a non-stick apparatus, comprising a liquid storage or conveyance article comprising a first material; a coating on an internal surface of the article comprising a second material; wherein the second material comprises ...  
WO/2010/074061A1
Provided is a rolled copper foil or an electrolytic copper foil for an electronic circuit wherein a circuit is formed by etching. The rolled copper foil or the electrolytic copper foil is provided with: a nickel or nickel alloy layer, wh...  
WO/2010/074072A1
Provided is a rolled copper foil or an electrolytic copper foil for an electronic circuit wherein a circuit is formed by etching. The rolled copper foil or the electrolytic copper foil is provided with: a heat-resistant layer, which is ...  
WO/2010/074054A1
Provided is a method for forming an electronic circuit, wherein after forming a nickel or nickel alloy layer on the etching surface side of a rolled copper foil or an electrolytic copper foil, a copper-plated multilayer board is formed b...  

Matches 1,051 - 1,100 out of 22,445