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WO/2023/096374A1 |
According to one embodiment of the present invention, provided is a jelly-roll electrode assembly, which is obtained by winding together a cathode sheet, an anode sheet and a separator inserted between the cathode sheet and the anode she...
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WO/2023/095452A1 |
An adhesive sheet 1 to be adhered to a member having a plurality of light emitting bodies comprises an adhesive layer 11 including at least one colored adhesive layer 111, wherein, when the brightness of transmitted light is measured by ...
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WO/2023/095664A1 |
A pressure-sensitive adhesive composition for constituting a pressure-sensitive adhesive sheet (5) comprises a (meth)acrylic polymer having a weight-average molecular weight of 250,000-500,000, a crosslinking agent, and a polyfunctional ...
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WO/2023/092225A1 |
A composite structure comprising a hydrophobic coating that is in contact with an aqueous environment is disclosed. The coating comprises a first layer that comprises an amine functionalized polymer layer with a thickness of 1 to 500 mic...
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WO/2023/090026A1 |
The present invention provides a microcapsule type curable resin composition which is applied to a screw member so as to reduce the generation of dust when the screw member is screwed into a base material, while additionally having excel...
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WO/2023/090457A1 |
Provided are adhesive particles capable of sufficiently enhancing adhesiveness, suppressing peeling from base materials, and highly accurately controlling a gap between the base materials. Adhesive particles (1) according to the presen...
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WO/2023/090684A1 |
The present invention relates to an electrode assembly for a lithium secondary battery and a secondary battery comprising same, wherein at least one electrode disposed at the outermost region of the electrode assembly is a single-sided p...
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WO/2023/090347A1 |
A purpose of the present invention is to provide a curable resin composition having excellent heat resistance, thermal conductivity, and adhesiveness, and low linear expansion. Another purpose of the present invention is to provide a cur...
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WO/2023/090456A1 |
Provided are adhesive particles capable of sufficiently increasing the adhesiveness. Adhesive particles according to the present invention contain a compound having a structure represented by formula (1). (1): R1-(SiOpR3R4q)n-R2 In f...
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WO/2023/088910A1 |
The present invention relates to the use of specific enzymes, more particularly of specific esterases having a polyester degrading activity, for the degradation of polyester or polyester containing material in acidic conditions at a pH b...
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WO/2023/084689A1 |
This coated member comprises a sheet-form or plate-form substrate (101), and a non-adhesive layer (102) and an adhesive layer (103) that are formed on one surface of the substrate (101). The substrate (101) is configured from a material ...
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WO/2023/085280A1 |
A curable resin composition containing a prepolymer (A) having a reactive silyl group, an epoxy compound (B), and a photoacid generator (C).
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WO/2023/085167A1 |
The present invention provides a thermosetting adhesive composition which is used for the purpose of bonding circuit members to each other, and which has a storage elastic modulus of 700 MPa or less at 35°C after being heated at 130°C ...
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WO/2023/085335A1 |
The adhesive composition provided herein contains, as a main component, a polymer (A) having a polyether structure, and further contains a conductive agent and a radical scavenger. When an adhesive sheet is formed from said adhesive comp...
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WO/2023/085083A1 |
The present invention provides an optical multilayer body which comprises an adhesive sheet having a sufficiently low surface resistance, and which is suitable for suppression of unwanted coloring of light from an image display device ev...
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WO/2023/084359A1 |
The present invention is a pressure sensitive adhesive including the reactive product of a copolymer of an alkyl(meth)acrylate, a multifunctional cross-linker, and at least one of an amine-containing (meth)acrylate and a blocked isocyana...
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WO/2023/085281A1 |
Provided are an adhesive and an adhesive tape that have high flame retardance even when there is little flame retardant in the adhesive layer. Specifically provided is an adhesive containing a resin component and a flame retardant, whe...
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WO/2023/080065A1 |
A method for manufacturing a laminate film comprises: a step (S2) for performing laser processing from a film layer (30) side on a work film (W) having a carrier film (C), a film layer (10), a raw adhesive layer (20), and the film layer ...
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WO/2023/080183A1 |
The present invention relates to a molecular bonding sheet comprising a base sheet and molecular bonding layers disposed on both surfaces of the base sheet, wherein the base sheet has a 23°C storage modulus G1 of 3.5×106-1.0×1010 Pa.
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WO/2023/079780A1 |
Provided are a temperature indicator manufacturing system and a temperature indicator manufacturing method that reduce the labor and cost of management associated with temperature indicator manufacturing. This temperature indicator manuf...
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WO/2023/074556A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet including a base polymer and having photocurability. The base polymer is a photopolymerization product. The pressure-sensitive adhesive sheet (10...
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WO/2023/074169A1 |
A primer layer-forming composition for forming a primer layer having a cleavage structure in which chemical bonds are irreversibly cleaved in response to external stimuli, the composition containing a film-forming component and a solvent...
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WO/2023/074558A1 |
This adhesive sheet (10) contains a base polymer as a photopolymer and is photocurable. This adhesive sheet (10) has a gel fraction of at least 75% by mass after curing by a photocuring process under the condition of an irradiation integ...
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WO/2023/074474A1 |
The present invention provides a film-like adhesive 1 for semiconductors, the film-like adhesive 1 comprising a first adhesive region 2 and a second adhesive region 3 in the thickness direction. With respect to this film-like adhesive 1 ...
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WO/2023/074557A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet containing a base polymer. This pressure-sensitive adhesive sheet (10) has a gel percentage G (%) of 90% or less, a shear storage modulus E (MPa)...
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WO/2023/074555A1 |
An adhesive sheet (S) according to the present invention is a photocurable adhesive sheet, wherein the ratio of a surface hardness H2 at 25°C, as measured by nano-indentation, at a location 100 μm away from a cut edge produced by laser...
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WO/2023/068277A1 |
An adhesive tape for circuit connection provided with a first base material, an adhesive film, and a second base material, in that order, the adhesive film containing a cationic polymerizable compound, a thermal cationic polymerization i...
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WO/2023/066902A1 |
The present invention relates to reactive hot-melt adhesive compositions containing, based on the total weight of the composition, a) 3 wt.% to 49 wt.% of at least one alpha-silane-terminated organic polymer; b) 1 wt.% to less than 20 wt...
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WO/2023/068314A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive tape capable of favorably holding a chip component when receiving the chip component, and when re-transferring the chip component, capable of demonstrating ...
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WO/2023/068009A1 |
Provided is a pressure-sensitive adhesive material having excellent pressure-sensitive adhesiveness, excellent flexibility, and excellent restorability. The pressure-sensitive adhesive material is characterized by including a polymer (...
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WO/2023/068088A1 |
The present invention provides a base material for semiconductor wafer processing, the base material being capable of enhancing adhesion to a stage in a semiconductor wafer processing step. The present invention provides a base material ...
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WO/2023/068315A1 |
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that can have chip components preferably pasted thereto when receiving the chip components, that exhibits excellent detachment performance when re-tran...
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WO/2023/063052A1 |
The purpose of the present invention is to provide a sheet for application to component-mounting surfaces of electronic substrates and for thereby protecting the electronic substrates; and an electronic substrate protected by the sheet. ...
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WO/2023/063211A1 |
A bonding method according to the present invention is for bonding a bush to a bonding member and comprises: an adhesive applying step of applying an adhesive to the portion of a cushioning member to be bonded to the bonding member; a fi...
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WO/2023/060257A1 |
Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesi...
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WO/2023/058481A1 |
Provided is a method for manufacturing an electronic component device, comprising: a step for overlapping a protection sheet on a circuit surface that is at least one side of a substrate and on which a circuit-constituting element is dis...
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WO/2023/058577A1 |
This protective sheet is to be bonded to: a surface to be protected of an electronic component having the surface to be protected; one surface of a piece of glass constituting a display surface of a display device; or one surface of a gl...
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WO/2023/054478A1 |
The purpose of the present invention is to provide an adhesive composition that, even after storage in a high-temperature, high-humidity environment, still exhibits a satisfactory decline in adhesive strength due to the application of vo...
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WO/2023/054484A1 |
The purpose of the present invention is to provide: an adhesive composition from which an adhesive layer, which firmly bonds members when a voltage is not applied thereto, and the adhesive strength of which is sufficiently reduced by app...
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WO/2023/054480A1 |
The purpose of the present invention is to provide: an adhesive composition from which an adhesive layer, which firmly bonds members when no voltage is applied and sufficiently reduces an adhesive force by applying voltage, can be formed...
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WO/2023/054114A1 |
A high-frequency dielectric heating adhesive (1A) contains a thermoplastic resin (A) and a cyano group-containing organic compound (B), and satisfies the following (1). (1) The total light transmittance of the high-frequency dielectric h...
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WO/2023/054234A1 |
Provided is a composition that can be used for an adhesive having excellent fast curability and heat cycle resistance. The present invention provides a two-agent type composition comprising a first agent and a second agent. The first age...
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WO/2023/054676A1 |
Provided is a curable adhesive sheet comprising a curable adhesive layer, with which a cured product having a dielectric loss tangent of 0.01 or less at 23 °C and at 1 GHz can be formed, and first and second release films between which ...
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WO/2023/054302A1 |
Provided is a press-bonded sheet manufacturing method by which a product created by a press-bonding process is peeled smoothly and with the appropriate force, and it is possible to inhibit a drop in adhesive force caused by deformation o...
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WO/2023/053560A1 |
An insulative adhesive tape (3) is configured from a laminated body (L3) of at least three layers including an insulative layer (12), an adhesive layer (13), and a substrate layer (11) provided between the insulative layer (12) and the a...
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WO/2023/053871A1 |
The present invention provides a linerless label for a flight baggage, the linerless label being configured by a smaller number of layers. A linerless label 100 comprises four layers of a surface base material layer 110, an adhesive laye...
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WO/2023/054488A1 |
This transfer film includes a base film and a transfer layer, wherein the transfer layer has a surface protection layer and an adhesive layer, the surface protection layer forms the surface layer of the transfer layer on the base film si...
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WO/2023/054085A1 |
The present invention provides an adhesive composition which has excellent adhesive strength when attached to an adherend and excellent peelability when subjected to batch heating at a high temperature, whereby both high initial adhesive...
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WO/2023/048053A1 |
Provided is an adhesive tape with excellent heat resistance. The adhesive tape comprises a vinyl chloride resin-based base material (A) and an adhesive layer (B) laminated onto at least one side of the base material (A). The base mater...
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WO/2023/047917A1 |
This pressure-sensitive adhesive sheet (10) is an optical pressure-sensitive adhesive sheet. When the pressure-sensitive adhesive sheet (10) is applied to a glass plate and the laminate is thereafter subjected to a heating/pressing treat...
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