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WO/2020/214662A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising silica particles and alumina particles, wherein the alumina particles are surface coated with an anionic polymer, and (b) water. The...
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WO/2020/214605A1 |
Methods, apparatus and systems for polishing an optical component having an aspheric or freeform surface are described. In one example aspect, a polishing device includes a solid plate and a container coupled to the solid plate. The cont...
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WO/2020/214712A1 |
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polish...
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WO/2020/214706A1 |
A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature m...
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WO/2020/208967A1 |
The present invention is a two-side polishing method for polishing the two sides of a wafer that is disposed between a polishing pad which is affixed to an upper surface of a lower platen and a polishing pad which is affixed to a lower s...
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WO/2020/208968A1 |
The present invention is a two-side polishing device equipped with: a lower platen that is provided so as to be rotatable about a rotating shaft and that has a polishing pad affixed to an upper surface thereof; an upper platen that is pr...
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WO/2020/209965A1 |
Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable...
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WO/2020/203568A1 |
Provided are: a method for production of a polishing composition that is capable of improving post-polishing surface quality; and a polishing method. The polishing composition production method according to the present invention is used ...
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WO/2020/202682A1 |
Provided are a polishing head, a polishing apparatus including the polishing head, and a method for manufacturing a semiconductor wafer using the polishing apparatus. The polishing head comprises: a first ring-shaped member having an ope...
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WO/2020/203140A1 |
An abrasive supply device is provided with: a slurry supply passage 40 having a plurality of slurry drop holes 400; an upper surface plate 10 having a plurality of slurry supply holes 100; and a slurry guide unit 50 having a plurality of...
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WO/2020/203639A1 |
On the polishing surface, this polishing pad has nh grooves (nh is an integer greater than or equal to 4) having a first groove pitch x1 (mm) to an nh^th groove pitch xh (mm), wherein the absolute value of the skewness (S) represented by...
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WO/2020/203219A1 |
A method for manufacturing a hypoid gear (10) comprises a gear cutting step (S1) for processing the shape of the teeth of the hypoid gear, a surface treatment step for shaping a third intermediate gear (10c) having a hardened layer forme...
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WO/2020/194944A1 |
A method for producing a gallium oxide substrate which involves polishing the gallium oxide substrate by using a polishing slurry, wherein the polishing slurry contains water and manganese dioxide particles.
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WO/2020/197877A1 |
Methods and apparatus for removing particles from a substrate surface after a chemical mechanical polish. In some embodiments, the apparatus may include a manifold configured to receive and atomize a fluid and at least one spray nozzle m...
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WO/2020/196162A1 |
The present invention provides a composition for polishing semiconductor wiring, the composition having exceptional polishing speed and being such that the occurrence of dishing is suppressed. This composition for polishing semiconduct...
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WO/2020/196645A1 |
Provided is a polishing composition having excellent ability to reduce haze on a surface of a polished subject. The polishing composition according to the present invention contains abrasive grains, a basic compound, a water-soluble poly...
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WO/2020/196542A1 |
[Problem] The purpose of the present invention is to provide a polishing composition which enables the speed-of-removal of a metal material to be the same as, or similar to, the speed-of-removal of a resin material in a chemical mechanic...
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WO/2020/196369A1 |
A polishing composition provided by the present invention comprises abrasive grains, a poly(vinyl alcohol)-based polymer as a water-soluble polymer, a basic compound, and water and further contains a polyvalent organic acid (salt) having...
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WO/2020/194971A1 |
This double-sided polishing method for a workpiece comprises: a pre-polishing index calculation step for, after performing double-sided polishing of a previous batch, calculating an index Xp for the workpiece on which the double-sided po...
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WO/2020/196370A1 |
The polishing composition provided by the present invention comprises abrasive grains, water-soluble polymers, a basic compound, and water, wherein the water-soluble polymers comprise a poly(vinyl alcohol)-based polymer and a polymer con...
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WO/2020/198761A1 |
During polishing of main surfaces of a substrate, an opening of a through hole through which a polishing liquid is supplied does not constitute an obstacle, and precision polishing of the substrate is realized. A method for producing a s...
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WO/2020/195149A1 |
The present invention provides a method for polishing a to-be-polished object including a material having a silicon-silicon bond, the method comprising a means for achieving reduction in both the number of defects and haze to a great ext...
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WO/2020/198102A1 |
The invention provides a chemical-mechanical polishing composition comprising (a) about 0.05 wt.% to about 10 wt.% of an abrasive; (b) a dispersant, wherein the dispersant is a linear or branched C2-C10 alkylenediol; and (c) water, where...
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WO/2020/189233A1 |
The present invention relates to an improvement of a surface plate which is used in a polishing device and to which a polishing pad is to be adhered. The surface plate according to the present invention includes a surface plate main body...
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WO/2020/188338A1 |
Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for optimizing a process of polishing semiconductor wafers. In one aspect, the method comprises repeatedly performing the following: i) se...
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WO/2020/190869A1 |
An apparatus for chemical mechanical polishing includes a platen having a surface to support a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, a pad conditioner to press an abrasive bod...
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WO/2020/185463A1 |
A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, osc...
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WO/2020/179804A1 |
This substrate processing device is provided with a polishing part and a transport part. The polishing part has a first polishing unit and second polishing unit, and a polishing part conveyance mechanism. The first polishing unit has a f...
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WO/2020/176385A1 |
A carrier head for chemical mechanical polishing includes a base, an actuator, a substrate mounting surface, and a retainer. The retainer includes an inner section and an outer section connected by a flexure. A bottom of the inner sectio...
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WO/2020/176460A1 |
A polishing pad for a chemical mechanical polishing apparatus includes a polishing layer having a polishing surface and a backing layer formed of a fluid-permeable material. The backing layer includes a lower surface configured to be sec...
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WO/2020/175364A1 |
Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sh...
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WO/2020/175363A1 |
Provided is an adhesive sheet for backgrinding which enables sufficient backgrinding while protecting protrusions provided on a semiconductor wafer. The present invention provides an adhesive sheet for the backgrinding of a semiconduct...
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WO/2020/171134A1 |
The purpose of the present invention is to provide silica particles that exhibit excellent polishing properties and storage stability. The present invention relates to silica particles such that when the surface silanol group content is ...
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WO/2020/170331A1 |
One aspect of the present invention is a polishing liquid containing abrasive grains, a copolymer, and a liquid medium, wherein the copolymer has a structural unit derived from at least one styrene compound selected from the group consis...
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WO/2020/171140A1 |
The purpose of the present invention is to provide silica particles that exhibit excellent polishing properties and storage stability. The present invention relates to silica particles such that when the d value measured using wide-angle...
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WO/2020/170801A1 |
The present invention provides an optical member which includes an organic polymer and which includes a surface A having a surface area of at least 1 mm2, the flatness of a region thereof having a surface area of 1 mm2 being 80 µm or le...
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WO/2020/172215A1 |
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a ...
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WO/2020/166438A1 |
Provided is a polishing composition capable of suppressing swelling in a peripheral part of a laser mark without lowering the polishing rate thereof. The polishing composition contains water, abrasive grains, a basic compound, a benzyltr...
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WO/2020/165759A1 |
An abrasive article includes a plurality of abrasive features disposed on one or more abrasive elements. Each of the one or more abrasive elements includes a base having a first major surface from which the plurality of abrasive features...
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WO/2020/167485A1 |
A substrate carrier head is disclosed. In one aspect, the carrier head includes a carrier body, a substrate retainer, a first resilient membrane and a second resilient membrane. The carrier head can include an inner support plate. The su...
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WO/2020/162144A1 |
Provided is a polishing composition which can achieve both a high polishing rate and excellent protrusion elimination properties at a periphery of an HLM. The polishing composition provided by the present invention is used in a prelimina...
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WO/2020/163570A1 |
A system for obtaining a measurement representative of a thickness of a layer on a substrate includes a support to hold a substrate, an optical assembly to capture two color images with light impinging the substrate at different angles o...
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WO/2020/159626A1 |
This application relates to a polishing system, polishing pad and related methods. A chemical-mechanical polishing system includes a rotatable head for mounting a wafer thereto, a polishing pad mounted to a rotatable platen, and a fluid ...
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WO/2020/155240A1 |
A fully-automatic grinding production line, comprising a feeding device (100), a plurality of grinders (200), a cleaning machine (300), and a discharging device (500) arranged according to a processing flow, and further comprising a firs...
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WO/2020/153001A1 |
The present invention adjusts a plurality of parameters of this substrate processing device so as to enhance a performance value of the substrate processing device. The present invention includes: a first artificial intelligence unit whi...
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WO/2020/150072A1 |
A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane...
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WO/2020/149468A1 |
The present invention relates to a method for processing a sink top formed from an engineered stone material. A method for processing a top plate formed from an engineered stone material comprises (a) a step of polishing a sink top forme...
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WO/2019/131886A9 |
The present invention is a polishing pad which comprises a polyurethane resin foam, and which has a polishing surface that is configured of the surface of the polyurethane resin foam. This polishing pad is configured such that the polyur...
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WO/2020/149470A1 |
The present invention pertains to a method for processing an MMA artificial marble top plate, the method comprising: (a) a step for polishing the MMA artificial marble top plate with a polish; (b) a step for coating the MMA artificial ma...
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WO/2020/143261A1 |
Disclosed are a supporting structure for chemical mechanical polishing equipment and the chemical mechanical polishing equipment. The supporting structure comprises a polishing head frame body (1), wherein the polishing head frame body (...
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