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WO/2023/003860A1 |
A soldering station or a soldering station system including a soldering station and a soldering iron includes a control console and an iron holder operably coupled to the control console for supporting a soldering iron. The iron holder c...
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WO/2023/003105A1 |
A brazing system according to an embodiment of the present invention, which is for brazing an object to be bonded to a base material, comprises: a turntable provided with a reception part for receiving the base material and rotatable clo...
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WO/2023/283138A2 |
Example methods of calibrating a parameter in a fluxing process in a soldering machine involve: determining an expected flux result when at least one calibration flux setting is used to spray flux from a nozzle; spraying flux from the no...
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WO/2023/279583A1 |
A wave recorder component welding positioning device and a positioning method. The device comprises a hoisting plate (1) and a mounting back plate (2), wherein an upper end of the hoisting plate (1) is hinged to a connecting plate (11), ...
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WO/2023/283100A2 |
Example processes for generating a program for applying flux to, and/or for soldering components onto, an electronics board, the program including manufacturing settings, involves: a) obtaining an image of the board; b) determining board...
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WO/2023/283022A1 |
A soldering system for processing at least one printed circuit board. The system comprises a first solder pot and a second solder pot, each configured to move within a movement plane. At least one of the first solder pot and the second s...
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WO/2023/276792A1 |
This bonding sheet is provided with: a conductive particle layer which contains conductive particles, a thermoplastic resin and a thermosetting resin; and a flux layer which is arranged on at least one side of the conductive particle lay...
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WO/2022/248859A1 |
A soldering tip for a soldering apparatus and a method of forming a soldering tip for a soldering apparatus, the tip comprising: a body formed of a first material; a proximal end for attaching the tip to the selective soldering apparatus...
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WO/2022/246912A1 |
An automatic PCB reclaiming apparatus, relating to the technical field of automatic PCB reclaiming, and comprising a rack (1), a feeding device (2) mounted on the rack (1), a lifting/lowering and positioning device (3) mounted on the rac...
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WO/2022/244025A1 |
The present invention concerns a device (10) for soldering the interconnections of photovoltaic panels (1).Said device (10) comprises: an inductor (11), which in turn comprises a filament (12), which substantially develops so as to form ...
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WO/2022/245198A1 |
The present invention presents a solder printing apparatus comprising a clamping mechanism (100), and a position adjusting mechanism. The clamping mechanism (100) comprises a mounting base (130), a lead screw (142), one or more clamp bas...
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WO/2022/236897A1 |
Disclosed in the present invention are a quality detection apparatus based on a welding element, and a detection method therefor. The quality detection apparatus based on the welding element comprises a support, a preheating unit and a p...
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WO/2022/223419A1 |
The invention relates to a method for the open-loop or closed-loop control of the advancement speed (VD) of a wire (4) composed of fusible material during a laser soldering or laser welding method, wherein the wire (4) is melted by a las...
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WO/2022/214546A1 |
A method for brazing an electrically conducting connecting piece, for example a cable shoe, of an electrically conducting material to a workpiece of electrically conducting material, by means of a temperature controlled brazing process i...
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WO/2022/206609A1 |
Disclosed in the present invention is a ribbon soldering method for back-contact solar cell chips. The method comprises the following steps: first, soldering back-contact solar cell small chip components into an interconnected small cell...
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WO/2022/201355A1 |
This solder ball supply device is applied to a solder ball feeder equipped with a feeder main unit, a track member, an excitation device, and a cavity unit, and comprises an imaging unit and a determining unit. The track member is provid...
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WO/2022/188522A1 |
An apparatus for soldering a SIP module (3) to a circuit board (4), comprising a first frame (1) and a second frame (2). The first frame is provided a SIP module and the second frame. The side of the SIP module facing the first frame is ...
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WO/2022/179092A1 |
A rapid cooling vacuum eutectic furnace for chip soldering, comprising a lower housing (1), an upper housing (2), a plurality of heating apparatuses (3), a carrier (4), and a driving mechanism (5). A plurality of cooling protrusions are ...
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WO/2022/172927A1 |
A method of manufacturing a member having a solder bump, comprising: a preparation step for preparing a base body with a plurality of recessed portions having roughness on a bottom surface; a disposition step for disposing solder particl...
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WO/2022/168664A1 |
A flow soldering device (1) is provided with a flux application unit (1), a preheating unit (5), a flow soldering body unit (7), and a transport mechanism (9). In the flow soldering body unit (7), jet nozzles (19), dross suppression devi...
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WO/2022/169646A1 |
The present application discloses a fitting apparatus (100) for fitting a sealing member (110) onto a solder paste nozzle (230), the sealing member having a sealing member mounting hole (112), and the fitting apparatus comprising: a supp...
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WO/2022/158604A1 |
A brazing device (1A) is provided with a holding mechanism, a wire supply mechanism (10), a position sensor, a movement mechanism (30), a wire distal end position calculation unit (610), and a movement mechanism control unit (620). The p...
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WO/2022/127961A1 |
The invention relates to a method in which hydrogen is conducted to a surface through a line and burned, and the hydrogen flame is directed at the surface. The invention also relates to a device for reducing surfaces, comprising, in the ...
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WO/2022/133115A1 |
The present application provides a cleaning frame, for keeping a waste gas purification apparatus (150) in a cleaning solution, the waste gas purification apparatus comprising an end plate (132) and a connecting component (131) located a...
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WO/2022/127748A1 |
Embodiments of the present invention relate to the field of soldering sheets, and provided therein are an ultra-thin soldering gasket and a preparation method therefor, a soldering method, and a semiconductor device. The ultra-thin solde...
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WO/2022/124091A1 |
In this method for producing a soldered product, a soldered product is produced by performing a solder supply step, a heating step, and a hardening step. In the solder supply step, a cylindrical soldering iron (2, 21) including a through...
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WO/2022/123988A1 |
The purpose of the present invention is to provide flux by which discharge of sediment is promoted, resin-cored solder in which the flux is used, and a soldering method. This flux for resin-cored solder contains 60-99.9 mass% (inclusiv...
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WO/2022/116190A1 |
An auxiliary apparatus for manufacturing an electronic device. The apparatus comprises a base (1). An operation table (2) is disposed right above the base (1), and holding mechanisms (3) are disposed right above the operation table (2). ...
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WO/2022/116639A1 |
A clamp for precise positioning. The clamp comprises a fixed base plate (1) and a rotary top plate (2) rotationally connected to the upper end face of the fixed base plate (1), wherein several sliding grooves (22) distributed at interval...
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WO/2022/110818A1 |
A solder paste (3), a welding method for an LED (1) and a bonding pad (2), and an LED display unit and a manufacturing method therefor. The welding method comprises: adding a dark dye powder having a mass fraction of 1% to 10% and a powd...
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WO/2022/110602A1 |
A welding pressing device, comprising a fixing plate, a pressing component (2) and a first elastic member (3). The fixing plate is provided with at least one welding hole (13); the number of the pressing components corresponds to that of...
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WO/2022/106227A1 |
The invention relates to a stand (80) of a soldering system and to a soldering system. In addition to the stand, the soldering system comprises an electric soldering device (10), in particular a soldering iron, with a handle (12), a heat...
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WO/2022/106358A1 |
The invention relates to a network (10) and to a method for operating a network, the network having one or more soldering systems (12) provided in the network (10), the soldering systems each comprising: - at least one soldering apparatu...
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WO/2022/106258A1 |
The invention relates to a soldering tip assembly (14) for an electric soldering device (10), in particular a soldering iron. The soldering tip assembly (14) is designed to be releasably arranged on a soldering device (10) handle (12) wh...
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WO/2022/099975A1 |
A tin soldering device for an electric control element of a new energy vehicle, comprising a cylinder body (1), a holding handle (2) extending out of an external surface of a side of the cylinder body (1); a connecting disc (3) which is ...
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WO/2022/102156A1 |
A soldering apparatus comprising a cooling zone, an upper and a lower vent, an external passage, a blower unit, a heat exchanger, a pair of bypass passages, and a ventilation plate. The upper and lower vents are respectively provided ove...
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WO/2022/097874A1 |
According to the present invention, provided is a nozzle body device for reducing selective solder ball comprising: a nozzle body (10) which is seated on a holder (F) that is placed in a solder solution tank (B) and guides a solder solut...
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WO/2022/097875A1 |
Provided according to the present invention is a selective solder ball-reducing nozzle apparatus comprising: a nozzle body (10) which is placed on a mount (F) mounted on a soldering bath (B), guides a soldering liquid (S) from a central ...
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WO/2022/097873A1 |
The present invention provides a selective soldering nozzle cleaning device comprising: a receiving tank (10) for receiving a solvent (SV) for dissolving a flux oxide required for soldering; a pump (20) for pumping the solvent (SV) recei...
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WO/2022/085298A1 |
Provided is a soldering device in which gas is sucked from suction ports in a first plate more evenly than a conventional device. A soldering device according to the present disclosure is a soldering device for performing soldering and...
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WO/2022/081088A1 |
A system and method of laser additive brazing. The method includes forming a melting zone spaced away from a target zone on a workpiece, and responsively adjusting a gap between the melting zone and the target plane according to a temper...
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WO/2022/065437A1 |
[Problem] To provide a system capable of accurately identifying soldering positions within a short time through identification by referring to the back surface of a circuit board in a system or a device for creating a soldering work prog...
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WO/2022/056805A1 |
Provided is a matrix-type smart soldering industrial robot apparatus, belonging to the technical field of welding robots; the robot apparatus comprises an outer cylinder (1) and an inner arc cylinder (2); three circular through-holes (10...
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WO/2022/054384A1 |
A mounting board manufacturing method to solder a terminal of an electronic component to a land 2 of a board 1 is provided with: a paste disposing step for disposing solder paste on the land 2; a melting and hardening step for melting an...
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WO/2022/054420A1 |
The present invention is a heater chip unit with which inconvenience caused due to inadvertent catching on a lead of a temperature sensor is not prone to occur. Specifically, the present invention is a heater chip unit 1 with a thermocou...
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WO/2022/054421A1 |
The present invention is a heater tip unit in which a temperature measurement section of a temperature sensor can satisfactorily be caused to come into contact with a location at which a heater tip is affixed. Specifically, the present i...
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WO/2022/050149A1 |
A soldering system (1) is provided with: a flux coating machine (3) for applying flux to a substrate (10); a preheater (4) for preheating the substrate (10); a solder bath (5) for storing molten solder; a solder bath heater (14) for melt...
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WO/2022/044700A1 |
Provided are: an arc welding control method with which, even if droplet transfer or an arc becomes unstable due to a disturbance, the droplet transfer or the arc can be stabilized quickly and good welding operability can be maintained by...
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WO/2022/039829A1 |
A wave soldering machine includes a housing and a conveyor configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering...
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WO/2022/025058A1 |
Provided is a laser brazing system that can collectively control a robot and devices such as a laser oscillator and a wire feeding device and that can also collectively display the state of the robot and the state of the devices. A laser...
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