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WO/2024/024178A1 |
This management device 20 comprises a control unit 22 that manages a plurality of wafer processing devices 1. The control unit 22 selects a wafer processing device 1 to be assigned to processing of a prescribed type of wafer from among t...
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WO/2024/024413A1 |
The present invention provides means for preventing sedimentation of abrasive grains and improving redispersibility of abrasive grains, while improving polishing performance. The present invention relates to a polishing composition com...
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WO/2024/025839A1 |
Carriers for polishing workpieces with flats or voids are provided. In one aspect, a substrate carrier head for a chemical mechanical planarization (CMP) system include a carrier body comprising an aperture configured to receive a wafer ...
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WO/2024/023618A1 |
Polyurethanes and polishing articles made therefrom including a reaction product of a reactive mixture including a polyol, a diol chain extender, a diisocyanate, a mono-alcohol, and a multifunctional amine are described. The mole ratio o...
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WO/2024/025002A1 |
The present invention relates to a method for polishing the surface of a 3D-printed orthopedic Ti alloy plate, the method enabling the surface of a 3D-printed orthopedic Ti alloy plate to be polished to a roughness level suitable for bio...
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WO/2024/026380A1 |
In one embodiment, a polishing composition can comprise abrasive particles including zirconia, an oxidizing agent including hydroxylamine and water. The polishing composition can have a high copper removal rate of at least 3500 Å/min, a...
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WO/2024/018735A1 |
A method for dressing a polishing pad is proposed by which the polishing pad can be more evenly dressed even on a rotating platen having a curved surface. The method for dressing a polishing pad 100 comprises pressing the grindstone 12 o...
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WO/2024/019240A1 |
A pad conditioner for dressing the surface of a CMP pad according to an embodiment of the present invention comprises: a substrate; and a plurality of protrusion members provided on the substrate. Each of the protrusion members may inclu...
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WO/2024/012048A1 |
A TFT-LCD float glass substrate processing line, sequentially comprising: a fine-cutting and edge-grinding working area, a surface grinding working area, and an inspection and packaging working area. A cold cutting device, a fine-cutting...
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WO/2024/010132A1 |
Disclosed are a polishing pad equipped with a window and a method for manufacturing same, wherein, in the process of inserting and attaching a window into a polishing pad, no thermal melting/bonding scheme and no vibration melting/bondin...
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WO/2024/009580A1 |
Provided is a method for determining conditions for polishing one surface of a wafer with a polisher. The polisher comprises at least a platen, a polishing pad disposed on the platen, and a polishing chuck disposed over the polishing pad...
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WO/2024/008338A1 |
The present invention relates to a grinding and/or polishing machine (1) with a rotatable specimen holder (20) and a rotatable disc (8) for supporting a preparation surface (6), the specimen holder (20) comprising a housing (25) having a...
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WO/2024/002312A1 |
Disclosed in the present invention is a chemical mechanical planarization apparatus, comprising: a polishing module, a cleaning module, and a cleaning input module, which is arranged respectively adjacent to the polishing module and the ...
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WO/2024/004751A1 |
A polishing material slurry according to the present invention comprises: manganese oxide abrasive grains that contain manganese oxide particles; permanganate ions; phosphoric acids; and a polymer additive which contains one or more wate...
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WO/2024/006213A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, an actuator, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and th...
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WO/2024/004750A1 |
A polishing material slurry according to the present invention comprises: manganese oxide abrasive grains that contain manganese oxide particles; permanganate ions; and phosphoric acids. A polishing method of a polishing material slurry ...
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WO/2023/248949A1 |
The objective of the present invention is to provide silica particles, a silica sol, and a polishing composition that have excellent mechanical strength, polishing properties, and storage stability. The present invention relates to silic...
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WO/2023/248960A1 |
A method, for polishing both sides of a workpiece made of a glass substrate, comprises: (1) a step for starting polishing of the workpiece; (2) a step for monitoring the rotational state of the workpiece in real time; and (3) a step for ...
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WO/2023/249678A1 |
A method of controlling a chemical mechanical polishing system includes receiving a respective time-varying test signal from an endpoint detection system for each of a plurality of test substrates, simultaneously visually displaying the ...
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WO/2023/248951A1 |
The purpose of the present invention is to provide: silica particles which has excellent mechanical strength, polishing characteristics and storage stability; a silica sol; and a polishing composition. The present invention relates to si...
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WO/2023/244740A1 |
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization, comprising one or more acrylate urethane oligomers, one or more acrylate monomers and at least one photo-polymerization initi...
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WO/2023/242481A1 |
The present invention relates to a device (100) for moistening a polishing pad (203). The moistening device (100) comprises measuring means (103, 104, 105, 106, 107, 108, 109, 110) for measuring a physical quantity that is indicative of ...
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WO/2023/244739A1 |
The invention provides a composition for preparing a chemical-mechanical polishing pad via photopolymerization and heating, the composition comprising a first component comprising: one or more acrylate-blocked isocyanates, one or more ac...
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WO/2023/239393A1 |
Exemplary substrate electrochemical planarization apparatuses may include a chuck body defining a substrate support surface. The apparatuses may include a retaining wall extending from the chuck body. The apparatuses may include an elect...
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WO/2023/239421A1 |
A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move ...
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WO/2023/240260A1 |
A chemical mechanical polishing (CMP) slurry can comprise a plurality of particles distributed in a carrier, wherein at least a portion of the particles of the plurality of particles can have a body including a core comprising zirconia a...
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WO/2023/239420A1 |
A polishing system including a platen to support a polishing pad, a carrier head to hold a substrate against the polishing pad, a source of dry ice particles, and a pad conditioner. The pad conditioner includes a compressor to generate a...
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WO/2023/233681A1 |
Provided are a polishing head and a polishing treatment device whereby it is possible to address phenomena such as wrinkles and star marks, further improvement of a substrate surface such as SFQR is possible, and polishing treatment of l...
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WO/2023/234974A1 |
A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier hea...
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WO/2023/235582A1 |
A chemical mechanical polishing apparatus, including a platen supporting a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier h...
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WO/2023/233769A1 |
The present invention relates to a polishing device. This polishing device comprises a triaxial sensor that is disposed adjoining a head arm (20) and that detects information relating to triaxial-direction force applied to a polishing he...
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WO/2023/234973A1 |
A chemical mechanical polishing apparatus includes a platen supporting a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, an acoustic sensor supported on the platen, and a motor to generate relati...
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WO/2023/228579A1 |
The present invention addresses the problem of providing a polishing device and a polishing method with which a workpiece surface is modified in consideration of a distribution of irregularities on the workpiece surface, and with which m...
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WO/2023/229009A1 |
An aspect of the present disclosure provides a grinding liquid composition that can reduce residue of silica on a substrate surface after grinding is performed, while maintaining a grinding rate. One aspect of the present disclosure pe...
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WO/2023/229660A1 |
The invention relates to a brake disc arrangement (86) having a brake disc (12) that has a friction ring (14) and a brake disc pot having an opening concentric to a central brake disc axis, which opening is delimited by a boundary which ...
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WO/2023/229658A1 |
A carrier head for chemical mechanical polishing includes a housing, a substrate mounting surface, and a retaining ring assembly. The retaining ring assembly includes an inner ring surrounding the substrate mounting surface and having an...
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WO/2023/229661A1 |
A chemical mechanical polishing assembly includes a chemical mechanical polishing system, a fluid source, and a fluid delivery conduit to carry a fluid from the fluid source into the chemical mechanical polishing system. The polishing sy...
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WO/2023/223959A1 |
Provided are a substrate polishing method, etc., for performing polishing accommodating substrates having various dimensions. Proposed is a substrate polishing method employing a polishing device comprising: a polishing table having a ...
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WO/2023/219004A1 |
The present invention provides colloidal silica in which fine particles are reduced and a production method therefor. Provided is colloidal silica wherein the number distribution ratio of fine particles having a particle diameter such th...
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WO/2023/218812A1 |
The present invention provides a double-sided polishing method including a startup stage for gradually increasing a polishing rate from a polishing stopped state, a main polishing step, continuous with the startup stage, for performing d...
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WO/2023/219783A1 |
Embodiments of the disclosure include a polishing pad for planarizing a surface of a substrate during a polishing process. The polishing pad includes a base layer, comprising a first material composition, and a polishing layer disposed o...
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WO/2023/218809A1 |
This silicon carbide substrate has a main surface. The silicon carbide substrate contains a plurality of carbon inclusions. The main surface has a plurality of pits formed therein. The plurality of carbon inclusions each have a maximum l...
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WO/2023/212981A1 |
Provided in the embodiments of the present disclosure are a chemical mechanical polish process method and a device, relating to the technical field of semiconductor manufacturing. The method comprises: providing a substrate on which a di...
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WO/2023/214986A1 |
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that ...
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WO/2023/214985A1 |
Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a substrate mounting surface coupled with the carrier body. The carrier heads may include an inner ring that ...
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WO/2023/210073A1 |
The present invention relates to a device for initializing an elastic film, a polishing device, a method for initializing an elastic film, and a method for assessing the service life of an elastic film. This device (50) for initializing ...
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WO/2023/203915A1 |
[Problem] To provide a carrier for double-sided polishing, with which an increase in service life can be achieved by improving wear resistance, and a silicon wafer double-sided polishing method and device employing the same. [Solution] A...
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WO/2023/203680A1 |
Provided is a polishing agent for polishing a polishing target surface including indium tin oxide, said polishing agent comprising: polishing grains; at least one dicarboxylic acid component selected from the group consisting of dicarbox...
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WO/2023/197237A1 |
A lapping table (100), comprising a rigid body (110), and the rigid body being used for carrying a wafer (20) and provided with a cavity. The lapping table further comprises a plurality of first through holes (V1) passing through the upp...
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WO/2023/200269A1 |
The present invention provides a sub-pad for a polishing pad, a polishing pad including same, and a method for manufacturing the sub-pad for a polishing pad, the sub-pad being stacked under a top pad that contacts and polishes a wafer an...
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